Display panels, display apparatuses and preparation methods of display panel

Patent metadata

Field	Value
Publication number	US-12156459-B2
Application number	US-202117469127-A
Country	US
Kind code	B2
Filing date	Sep 8, 2021
Priority date	Aug 28, 2019
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

A display panel, a display apparatus and a preparation method of a display panel. The display panel includes a substrate, a display region and a non-display region. The non-display region includes a hole region and an isolation region adjoining the display region and the hole region. The isolation region includes at least one second isolation structure at least partially surrounding the hole region. The second isolation structure includes a supporting portion and a partitioning portion located on the supporting portion. An orthographic projection of the partitioning portion on the substrate covers an orthographic projection of the supporting portion on the substrate, and a maximum width of the supporting portion is smaller than a width of the partitioning portion. A tensile stress layer configured to apply a tensile stress to the partitioning portion is disposed on the partitioning portion.

First claim

The invention claimed is:

1. A display panel comprising:
a substrate;
a display region, wherein the display region comprises a tensile stress layer that comprises an organic material comprising polyimide;
a non-display region comprising:
a hole region; and
an isolation region adjoining the display region and the hole region, wherein the isolation region comprises a plurality of second isolation structures that at least partially surrounds the hole region, and each of the plurality of second isolation structures comprises:

a supporting portion; and
a partitioning portion, located on the supporting portion, wherein an orthographic projection of the partitioning portion on the substrate covers an orthographic projection of the supporting portion on the substrate, and a maximum width of the supporting portion is smaller than a width of the partitioning portion, wherein the tensile stress layer is configured to apply a tensile stress to the partitioning portion and is disposed directly on the partitioning portion.

2. The display panel according to claim 1 , further comprising:
at least one conductive layer located on the substrate;
a plurality of first electrodes located on the at least one conductive layer;
an organic light-emitting material layer located on the first electrodes and the second isolation structure, and
an encapsulation layer located on the organic light-emitting material layer, wherein the organic light-emitting material layer breaks at the second isolation structure, and the encapsulation layer comprises a packaging layer that at least covers a side portion of the supporting portion.

3. The display panel according to claim 2 , wherein the encapsulation layer further covers a side portion of the partitioning portion of the second isolation structure and encloses the second isolation structure.

4. The display panel according to claim 2 , wherein the plurality of second isolation structures is further configured to partition a second electrode layer disposed at a side of the organic light-emitting material layer away from the substrate.

5. The display panel according to claim 2 , wherein a recessed structure is disposed at a side portion of the display region adjoining the non-display region, the organic light-emitting material layer breaks at the recessed structure, and the encapsulation layer at least covers a side wall of the recessed structure.

6. The display panel according to claim 1 , further comprising:
a plurality of pixel circuits and a data line in the display region, wherein each of the pixel circuits comprises a plurality of transistors, the at least one conductive layer comprises the data line, the at least one conductive layer comprises a first conductive film layer, a second conductive film layer located on the first conductive film layer, and a third conductive film layer located on the second conductive film layer, the supporting portion and the second conductive film layer are located in a same layer, and the partitioning portion and the third conductive film layer are located in a same layer.

7. The display panel according to claim 1 , wherein the partitioning portion comprises a first inorganic material layer and the supporting portion at least comprises a second inorganic material layer.

8. The display panel according to claim 7 , wherein the display region further comprises a passivation layer.

9. The display panel according to claim 7 , wherein the supporting portion comprises an organic material layer and the second inorganic material layer stacked from bottom to top, the substrate is a flexible substrate, and the organic material layer is an upwardly-convex portion of the flexible substrate in a region corresponding to the supporting portion.

10. The display panel according to claim 1 , wherein the plurality of second isolation structures is arranged at intervals in the isolation region.

11. The display panel according to claim 1 , wherein a shape of a section of the supporting portion is a regular trapezoid or an inverted trapezoid.

12. A display apparatus, comprising:
a device body, having a device region, wherein one or more light-sensing elements configured to emit or collect light are disposed in the device region, and a display panel that covers the device body comprises:
a substrate;
a display region, wherein the display region comprises a tensile stress layer that comprises an organic material comprising polyimide;
a non-display region comprising:
a hole region; and
an isolation region adjoining the display region and the hole region, wherein the isolation region comprises a plurality of second isolation structures that at least partially surrounds the hole region, and each of the second isolation structures comprises:

a supporting portion; and
a partitioning portion, located on the supporting portion, wherein an orthographic projection of the partitioning portion on the substrate covers an orthographic projection of the supporting portion on the substrate, and a maximum width of the supporting portion is smaller than a width of the partitioning portion, wherein the tensile stress layer is configured to apply a tensile stress to the partitioning portion and is disposed directly on the partitioning portion.

Assignees

• Yungu Guan Tech Co Ltd

Inventors

• Qin Shaoyang
• Wang Shoukun

Classifications

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title

• H10K71/00 Primary

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title

• H10K77/111

  Flexible substrates · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title