Inspection robot and methods utilizing coolant for temperature management

Patent metadata

Field	Value
Publication number	US-12156334-B2
Application number	US-202217752453-A
Country	US
Kind code	B2
Filing date	May 24, 2022
Priority date	Apr 20, 2021
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

Inspection robot and methods utilizing coolant for temperature management are described. An example inspection robot may include a housing with a couplant retaining chamber, and an electronic board selectively thermally coupled to the couplant retaining chamber. The inspection robot may include a couplant input port coupling a couplant source to a couplant flow path, a drive module coupled to the housing, and a payload with at least one sensor, where the payload is coupled to the housing. The couplant flow path is fluidly coupling the couplant input port to the couplant retaining chamber.

First claim

What is claimed is:

1. An inspection robot, comprising:
a housing, comprising at least a portion of a couplant retaining chamber;
an electronic board positioned within the housing, wherein the electronic board is at least selectively thermally coupled to the couplant retaining chamber;
a couplant input port fluidly coupled to a couplant source on a first side, and fluidly coupled to a couplant flow path on a second side;
a drive module coupled to the housing, the drive module comprising at least one wheel positioned to engage an inspection surface when the inspection robot is positioned on the inspection surface, and a drive motor operatively coupled to the at least one wheel;
a payload comprising at least one sensor, the payload coupled to the housing and positioned such that the at least one sensor selectively engages the inspection surface when the inspection robot is positioned on the inspection surface; and
the couplant flow path fluidly coupling the couplant input port to the couplant retaining chamber.

2. The inspection robot of claim 1 , wherein the couplant flow path fluidly couples, in order:
the couplant input port;
the drive module;
the payload; and
the couplant retaining chamber.

3. The inspection robot of claim 2 , further comprising a heat exchanger positioned on the drive module, wherein the heat exchanger thermally couples the couplant flow path to the drive motor.

4. The inspection robot of claim 1 , wherein the electronic board comprises at least one of a main board or a data acquisition circuit.

5. The inspection robot of claim 1 , wherein the couplant retaining chamber is positioned within the housing.

6. The inspection robot of claim 5 , further comprising a routing valve configured to selectively bypass the couplant flow path past the couplant retaining chamber.

7. The inspection robot of claim 5 , wherein the couplant flow path further comprises a housing recirculation path, and wherein the inspection robot further comprises a routing valve configured to modulate a recirculation rate of couplant within the housing recirculation path.

8. The inspection robot of claim 5 , further comprising a heat pipe thermally coupling the electronic board to the couplant retaining chamber.

9. The inspection robot of claim 8 , further comprising at least one additional heat generating component positioned within the housing, and wherein the heat pipe thermally couples the at least one additional heat generating component to the couplant retaining chamber.

10. The inspection robot of claim 9 , wherein the at least one additional heat generating component comprises at least one component selected from the components consisting of:
a main board;
a payload board;
a drive module board;
a modular electronic board;
a power converter; and
a data acquisition circuit.

11. The inspection robot of claim 1 , wherein the housing further comprises a shaped bottom surface configured to form the couplant retaining chamber in cooperation with the inspection surface.

12. The inspection robot of claim 11 , wherein the couplant flow path fluidly couples, in order:
the couplant input port;
the payload; and
the couplant retaining chamber.

13. The inspection robot of claim 12 , further comprising a bypass couplant path fluidly coupling the couplant input port to the couplant retaining chamber.

14. The inspection robot of claim 13 , further comprising a routing valve configured to modulate a couplant flow through the bypass couplant path.

15. The inspection robot of claim 10 , wherein the at least one sensor comprises an ultrasonic (UT) sensor, and wherein the couplant flow path further comprises a delay line chamber of the UT sensor.

16. A method, comprising:
operating an inspection robot to interrogate an inspection surface with at least one sensor mounted on the inspection robot;
supplying a couplant to a couplant input port of the inspection robot;
providing the couplant to a delay line chamber of the at least one sensor; and
after providing the couplant to the delay line chamber, thermally contacting the couplant with an electronic board of the inspection robot.

17. The method of claim 16 , further comprising:
thermally contacting the couplant with a drive module of the inspection robot before thermally contacting the couplant with the electronic board.

18. The method of claim 16 , wherein thermally contacting the couplant with the electronic board comprises thermally contacting the couplant with a heat pipe thermally coupled to the electronic board.

19. The method of claim 18 , wherein thermally contacting the couplant with the heat pipe further comprises thermally contacting the couplant with at least one additional heat generating component of the inspection robot.

20. The method of claim 16 , further comprising, in order:
thermally contacting the couplant with a drive motor;
providing the couplant to the delay line chamber of the at least one sensor; and
thermally contacting the couplant with the electronic board.

21. The method of claim 16 , further comprising recirculating at least a portion of the couplant within a housing of the inspection robot.

Assignees

• Gecko Robotics Inc

Inventors

• Bryner Edward A
• Jourde Dillon R
• Cho Mark
• Binger Michael A
• Low Kevin Y
• Cuti Alexander R

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K1/18 Primary

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/206

  comprising thermal management · CPC title

• G01N2291/2698

  Other discrete objects, e.g. bricks · CPC title