Light source module and backlight unit having the same

Patent metadata

Field	Value
Publication number	US-12155017-B2
Application number	US-202318504410-A
Country	US
Kind code	B2
Filing date	Nov 8, 2023
Priority date	May 9, 2013
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

A backlight unit includes one or more light sources operable to emit light and a light guide plate arranged adjacent to the one or more light sources, reflected lights exiting the one or more light sources via the second surfaces and entering the light guide plate. A light source includes a light emitting device having a substrate and a semiconductor stack disposed on the substrate. The reflector is structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source.

First claim

What is claimed is:

1. A light emitting module comprising:
a circuit board;
a first light emitter disposed on the circuit board and operable to emit light, the first light emitter comprising:
a first device source comprising a substrate and a semiconductor stack disposed on the substrate; and
a first reflector configured to reflect light emitted from the semiconductor stack;
a first wavelength conversion layer covering the first light source,

a second light emitter disposed on the circuit board and operable to emit light, the second light emitter including:
a second light source including a substrate and a semiconductor stack connected to the substrate;
a second reflector configured to reflect light emitted from the semiconductor stack; and
a second wavelength conversion layer covering the second light source,

wherein the first light emitter and the second light emitter are arranged side by side and spaced apart from each other; and
wherein a light guide plate arranged adjacent to the first light emitter and the second light emitter and configured to guide the light emitted from the first light emitter and the second light emitter and entering the light guide plate,
wherein the substrate of the first light emitter includes a convex-concave region covering by the first wavelength conversion layer, and
wherein the first reflector and the second reflector are spaced apart each other.

2. The light emitting module of claim 1 , wherein a thickness of the first wavelength conversion layer covering an upper surface of the first light source is different from a thickness of the first wavelength conversion layer covering a side surface of the first light source.

3. The light emitting module of claim 1 , wherein a thickness of the second wavelength conversion layer covering an upper surface of the second light source is different from a thickness of the second wavelength conversion layer covering a side surface of the second light source.

4. The light emitting module of claim 1 , wherein the first light source further includes a first pad and a second pad electrically connected to the semiconductor stack of the first light source, and wherein the first pad and the second pad include same conductive materials.

5. The light emitting module of claim 1 , further comprising a cover surrounding the first light emitter and the second light emitter.

6. The light emitting module of claim 1 , wherein the semiconductor stack of the first light source includes a convex-concave region.

7. The light emitting module of claim 1 , wherein the semiconductor stack of the second light source includes a convex-concave region.

8. A light emitting module comprising:
a circuit board;
light emitters disposed on the circuit board and operable to emit light, each light emitter including:
a light source including a substrate and a semiconductor stack connected to the substrate;
a reflector configured to reflect light emitted from the semiconductor stack from a first direction toward second direction; and
a wavelength conversion layer covering the light source,

a light guide plate arranged adjacent to the light emitters and configured to guide the light emitted from the light emitters entering the light guide plate,
wherein at least one substrate of light sources includes a convex-concave region covered by the wavelength conversion layer,
wherein the light emitters are arranged side by side and spaced apart from each other, and
wherein reflectors of the light emitters are spaced apart each other.

9. The light emitting module of claim 8 , wherein a thickness of the wavelength conversion layer covering an upper surface of the light source is different from a thickness of the wavelength conversion layer covering a side surface of the light source.

10. The light emitting module of claim 8 , wherein the wavelength conversion layer includes a region having non-uniform thickness.

11. The light emitting module of claim 8 , wherein the light source further includes a first pad and a second pad electrically connected to the semiconductor stack of the light source, and wherein the first pad and the second pad include same conductive materials.

12. The light emitting module of claim 11 , wherein the light source further includes an insulation disposed between the semiconductor stack and the second pad.

13. The light emitting module of claim 8 , further comprising a cover surrounding the light emitters.

14. The light emitting module of claim 8 , wherein semiconductor stacks of the light sources include a convex-concave region.

15. A light emitting module comprising:
a circuit board;
light sources disposed on the circuit board and operable to emit light, each light source including:
a substrate;
a semiconductor stack disposed on the substrate; and
a reflector configured to reflect light emitted from the semiconductor stack from a first direction toward second direction,

a wavelength conversion layer covering the light sources; and
a light guide plate arranged adjacent to the light sources and configured to guide the light emitted from the light sources entering the light guide plate,
wherein at least one substrate of the light sources includes a convex-concave region covering by the wavelength conversion layer,
wherein the light sources are arranged side by side and spaced apart from each other,
wherein reflectors of the light sources are spaced apart each other.

16. The light emitting module of claim 15 , wherein the wavelength conversion layer includes a region having a non-uniform thickness.

17. The light emitting module of claim 15 , wherein each of the light sources further includes a first pad and a second pad electrically connected to the semiconductor stack of a corresponding light source, and wherein the first pad and the second pad include same conductive materials.

18. The light emitting module of claim 17 , wherein each of the light sources further include an insulation disposed between the semiconductor stack and the second pad.

19. The light emitting module of claim 15 , further comprising a cover surrounding the light sources.

20. The light emitting module of claim 15 , wherein each of semiconductor stacks of the light sources includes a convex-concave region.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Song Young Jun
• Kim Da Hye
• Jung Seoung Ho

Classifications

• H10H20/856

  Reflecting means · CPC title

• H10H20/8514 Primary

  characterised by their shape, e.g. plate or foil · CPC title

• G02B6/0073 Primary

  Light emitting diode [LED] · CPC title

• G02F1/133614

  using photoluminescence, e.g. phosphors illuminated by UV or blue light · CPC title

• H01L33/60

  Electricity · mapped topic