Graphene-coated heat spreader for integrated circuit device assemblies

Patent metadata

Field	Value
Publication number	US-12154839-B2
Application number	US-202217698209-A
Country	US
Kind code	B2
Filing date	Mar 18, 2022
Priority date	Dec 17, 2021
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

An integrated circuit device assembly including a graphene-coated heat spreader, including: a substrate; a die coupled to the substrate; and a heat spreader thermally coupled to the die, the heat spreader comprising: a body of thermally conductive metal defining a cavity at least partially surrounding the die; and a graphene layer contacting a surface of the body.

First claim

What is claimed is:

1. A device comprising:
a substrate;
a die coupled to the substrate; and
a heat spreader thermally coupled to the die, the heat spreader comprising:
a body of thermally conductive material defining a cavity at least partially surrounding the die; and
a graphene layer contacting a surface of the body.

2. The device of claim 1 , wherein the die is thermally coupled to the heat spreader via a portion of thermal interface material.

3. The device of claim 2 , wherein the cavity is defined by an inner surface of the body.

4. The device of claim 3 , wherein the graphene layer contacts the inner surface.

5. The device of claim 1 , wherein the graphene layer is applied to an outer surface of the body opposite the cavity.

6. The device of claim 1 , wherein the graphene layer comprises a graphene film adhered to the surface.

7. The device of claim 1 , wherein the graphene layer comprises chemical vapor deposition (CVD) graphene.

8. The device of claim 1 , further comprising a cooling element thermally coupled to the heat spreader.

9. The device of claim 1 , wherein the substrate comprises a semiconductor material.

10. The device of claim 9 , wherein the semiconductor material comprises an integrated circuit.

11. The device of claim 1 , wherein the device comprises a computing device.

12. The device of claim 11 , wherein the computing device comprises a screen and a housing, whereby the heat spreader reduces localized housing temperatures.

13. A method, comprising:
coupling a die to a substrate; and
thermally coupling the die to a heat spreader, the heat spreader comprising:
a body of thermally conductive metal defining a cavity receiving the die; and
a graphene layer contacting a surface of the body.

14. The method of claim 13 , wherein the graphene layer comprises a graphene film adhered to the surface.

15. The method of claim 13 , wherein the graphene layer comprises a chemical vapor deposition (CVD) of graphene.

16. The method of claim 13 , wherein the heat spreader is thermally coupled to the die by a portion of thermal interface material.

17. The method of claim 13 , wherein the graphene layer is applied to an inner surface of the body defining the cavity.

18. The method of claim 13 , wherein the graphene layer is applied to an outer surface of the body opposite the cavity.

19. The method of claim 13 , further comprising thermally coupling a cooling element to the heat spreader.

20. A heat spreader for integrated circuit dies comprising:
a body of thermally conductive metal defining a cavity configured to receive a die; and
a graphene layer applied to a surface of the body.

21. The heat spreader of claim 20 , wherein the graphene layer is applied to an inner surface of the body defining the cavity.

22. The heat spreader of claim 20 , wherein the graphene layer is applied to an outer surface of the body opposite the cavity.

23. The heat spreader of claim 20 , wherein the graphene layer comprises a graphene film adhered to the surface.

24. The heat spreader of claim 20 , wherein the graphene layer comprises chemical vapor deposition (CVD) graphene.

Assignees

• Advanced Micro Devices Inc

Inventors

• Ji Xiaoyang
• An Li
• Chow Soo Pin

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title