Electronic component

Patent metadata

Field	Value
Publication number	US-12154740-B2
Application number	US-201917297458-A
Country	US
Kind code	B2
Filing date	Oct 16, 2019
Priority date	Dec 27, 2018
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

An electronic component includes an internal component, an inner case, and an outer case. The inner case is hermetically sealed and houses the internal component. The outer case is arranged outside the inner case with a gap between the outer case and the inner case. The outer case includes an opening. The opening communicates the gap with an outside of the outer case.

First claim

The invention claimed is:

1. An electronic component, comprising:
an internal component;
an inner case that houses the internal component, the inner case being hermetically sealed; and
an outer case arranged outside the inner case with an air-filled gap between walls of the inner case and walls of the outer case, the outer case including an opening that establishes fluid communication between the gap and an outside of the outer case, whereby air is able to pass from the air-filled gap to the outside of the outer case via the opening, wherein the electronic component is a relay.

2. The electronic component according to claim 1 , wherein the outer case is fixed to the inner case.

3. The electronic component according to claim 1 , further comprising:
a rib provided on an outer surface of the inner case or an inner surface of the outer case.

4. The electronic component according to claim 1 , wherein
the inner case includes
a base that supports the internal component, and
a cover attached to the base,

the cover includes
an inner side surface attached to the base, and
an inner top surface that faces the base,

the outer case includes
an outer top surface arranged outside the inner top surface, and
an outer side surface arranged outside the inner side surface, and

the gap is provided between the inner top surface and the outer top surface.

5. The electronic component according to claim 4 , further comprising:
a rib protruding from the inner top surface or the outer top surface.

6. The electronic component according to claim 1 , wherein
the inner case includes
a base that supports the internal component, and
a cover attached to the base,

the cover includes
an inner side surface attached to the base, and
an inner top surface that faces the base,

the outer case includes
an outer top surface arranged outside the inner top surface, and
an outer side surface arranged outside the inner side surface, and

the gap is provided between the inner side surface and the outer side surface.

7. The electronic component according to claim 6 , further comprising:
a rib protruding from the inner side surface or the outer side surface.

8. The electronic component according to claim 1 , wherein the outer case is bonded to the inner case.

9. The electronic component according to claim 1 , wherein one of the outer case and the inner case includes a locking portion that locks to another.

10. The electronic component according to claim 1 , wherein
the inner case has been arranged in the outer case through the opening, and
the gap communicates with the outside of the outer case through a space between the periphery of the opening and the inner case.

11. The electronic component according to claim 10 , wherein a size of the gap between the opening and the inner case is smaller than a thickness of the outer case.

12. The electronic component according to claim 1 , wherein the opening is a through hole provided in the outer case.

13. The electronic component according to claim 1 , wherein a thickness of the outer case is larger than a thickness of the inner case.

14. The electronic component according to claim 1 , wherein the outer case is made of a material having higher heat resistance than the inner case.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Horiuchi Kasumi
• Mimura Yoshiaki
• Tsutsui Kazuhiro

Classifications

• H01H51/29

  Relays having armature, contacts, and operating coil within a sealed casing (H01H51/27 takes precedence) · CPC title

• H01H50/023

  Details concerning sealing, e.g. sealing casing with resin · CPC title

• H01H50/12

  Ventilating; Cooling; Heating (for operating electrothermal relays H01H61/013) · CPC title

• H01H50/02

  Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

• H01H50/06 Primary

  having windows; Transparent cases or covers · CPC title