Active optical coupler

Patent metadata

Field	Value
Publication number	US-12153269-B2
Application number	US-202017132955-A
Country	US
Kind code	B2
Filing date	Dec 23, 2020
Priority date	Dec 23, 2020
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An active optical coupler apparatus comprising:
a first optical interface to receive or transmit one or more light signals;
a second optical interface to receive or transmit the one or more light signals;
photonics circuitry optically coupled with the first optical interface and the second optical interface to monitor operation of the active optical coupler apparatus, wherein the photonics circuitry comprises electronic circuit structures, the electronic circuit structures physically intervening between the first optical interface and the second optical interface;
electrical circuitry coupled with the photonic circuitry to facilitate the monitoring of the active optical coupler apparatus; and
wherein the first optical interface and the second optical interface are optically coupled to allow light received by the first optical interface to be transmitted to the second optical interface and light received by the second optical interface to be transmitted to the first optical interface.

2. The apparatus of claim 1 , wherein the apparatus is physically coupled with a substrate, and wherein the electrical circuitry is electrically coupled with the substrate, to provide an electrical coupling with the electrical circuitry.

3. The apparatus of claim 2 , wherein the electrical coupling with the substrate is to provide power to the apparatus.

4. The apparatus of claim 2 , wherein the photonic circuitry includes one or more photonic diodes.

5. The apparatus of claim 2 , wherein to monitor operation of the active optical coupler apparatus further includes to identify data related to operational characteristics of the operation of the active optical coupler apparatus.

6. The apparatus of claim 5 , wherein to identify data related to characteristics of the one or more light signals further includes transmitting the data related to the characteristics of the one or more light signals to the electrical circuitry.

7. The apparatus of claim 6 , wherein the electrical circuitry transmits electrical signals based upon the identified data to the substrate.

8. The apparatus of claim 1 , wherein the first optical interface is optically coupled with a photonics integrated circuit (PIC) outside the apparatus.

9. The apparatus of claim 8 , wherein the first optical interface is optically coupled with the PIC outside the apparatus by a selected one of: an optical waveguide or an optical fiber.

10. The apparatus of claim 1 further includes a socket mechanism coupled to the second optical interface, the socket mechanism to receive an optical fiber housing that includes one or more optical fibers.

11. The apparatus of claim 10 , further comprising one or more features to align the socket mechanism with the optical fiber housing.

12. An optical coupling apparatus comprising:
a first optical interface to receive or transmit one or more light signals;
a second optical interface to receive or transmit the one or more light signals;
wherein the first optical interface and the second optical interface are optically coupled to allow light received by the first optical interface to be transmitted to the second optical interface and light received by the second optical interface to be transmitted to the first optical interface;
photonics circuitry comprising electronic circuit structures, the electronic circuit structures coupled to and physically intervening between the first optical interface and the second optical interface; and
wherein the first optical interface is to optically couple with a photonics connector that is physically integrated with a photonics package and at or proximate to an edge of the photonics package.

13. The apparatus of claim 12 , wherein the photonics connector is physically and thermally coupled with a heat spreader of the photonics package.

14. The apparatus of claim 12 , wherein the first optical interface is to removably couple with the photonics connector.

15. The apparatus of claim 12 , wherein the
photonics circuitry is optically coupled with the first optical interface or the second optical interface to monitor the operation of the optical coupling apparatus, wherein the apparatus further comprises:
electrical circuitry coupled with the photonic circuitry to facilitate the monitoring of the operation of the optical coupling apparatus; and
wherein the apparatus is physically coupled with a substrate coupled with the photonics package.

16. The apparatus of claim 15 , wherein the substrate is a motherboard; and wherein the second optical interface is optically coupled with an optical layer in the motherboard.

17. The apparatus of claim 16 , wherein an optical path between the first optical interface and the second optical interface includes one or more reflectors or mirrors.

18. The apparatus of claim 15 , wherein the photonics circuitry includes a photonic crystal fiber (PCF) to sense temperature data of the optical coupling apparatus.

19. The apparatus of claim 12 , wherein the first optical interface is coupled with one or more first lenses, and wherein the second optical interface is coupled with one or more second lenses, the one or more first lenses and second lenses to facilitate reception or transmission of the one or more light signals.

20. A package, comprising:
a substrate;
a photonics IC (PIC) with the first side and a second side opposite the first side, the first side of the PIC coupled with the substrate;
an XPU with a first side and a second side opposite the first side, the first side of the XPU coupled with the substrate and electrically coupled with the first side of the PIC;
a heat spreader coupled with the package and thermally coupled with the second side of the PIC and the second side of the XPU;
an optical coupler disposed at or proximate to an edge of the substrate and physically coupled with the substrate, the optical coupler including:
a first optical interface to receive or transmit one or more light signals and optically coupled with the PIC;
a second optical interface to receive or transmit the one or more light signals; and
photonics circuitry comprising electronic circuit structures, the electronic circuit structures coupled to and physically intervening between the first optical interface and the second optical interface;
wherein the first optical interface and the second optical interface are optically coupled to allow light received by the first optical interface to be transmitted to the second optical interface and light received by the second optical interface to be transmitted to the first optical interface; and
wherein the optical coupler is not physically or thermally coupled with the heat spreader.

21. The package of claim 20 , further comprising an air gap at least partially surrounding the optical coupler to allow access to one or more internal chambers of the package for cleaning.

22. The package of claim 20 , wherein the XPU is a selected one of: a central processing unit (CPU), a graphics processing unit (GPU), field programmable gate array (FPGA), an application specific integrated circuit (ASIC), an accelerator, or some other processing device.

23. The package of claim 20 , wherein the PIC and the XPU are electrically coupled by a selected one of: an interconnect bridge, an embedded multi-die interconnect bridge (EMIB), a silicon interposer, organic routing on the substrate or a redistribution layer (RDL) on the substrate.

24. The package of claim

Assignees

• Intel Corp

Inventors

• Pratap Divya
• Nekkanty Srikant

Classifications

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/423

  using guiding surfaces for the alignment · CPC title