Sensor device

Patent metadata

Field	Value
Publication number	US-12152940-B2
Application number	US-202017784289-A
Country	US
Kind code	B2
Filing date	Dec 21, 2020
Priority date	Dec 27, 2019
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

A sensor device according to the present disclosure includes a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element, and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass.

First claim

What is claimed is:

1. A sensor device comprising:
a Peltier element;
a sensor element thermally connected to a cooling surface of the Peltier element;
a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass; and
a support member, wherein the support member has an opening that allows passage of incident light and a frame that supports the window member, and wherein the window member is disposed above and overlaps a portion of the frame.

2. The sensor device according to claim 1 , wherein
an effective pixel region that receives incident light from the window member is arranged on the light receiving surface of the sensor element.

3. The sensor device according to claim 2 , wherein
the frame is arranged outside the effective pixel region in a plan view.

4. The sensor device according to claim 2 , wherein
an area of the opening is larger than an area of the effective pixel region.

5. The sensor device according to claim 1 ,
the window member is arranged to cover the opening.

6. The sensor device according to claim 1 , wherein
the cooling surface of the Peltier element is larger than a surface of the sensor element opposite to the light receiving surface.

7. The sensor device according to claim 1 , further comprising
a package substrate that is thermally connected to a heat dissipation surface of the Peltier element, and accommodates the Peltier element and the sensor element.

8. The sensor device according to claim 7 , further comprising
a relay substrate that is arranged between the cooling surface of the Peltier element and the sensor element, and relays electrical connection between the package substrate and the sensor element.

9. The sensor device according to claim 1 , wherein
the sensor element is a short wave infrared (SWIR) image sensor.

10. The sensor device according to claim 8 , wherein the sensor element and the relay substrate are electrically connected by a bonding wire and a bonding pad.

11. The sensor device according to claim 8 , wherein the relay substrate is made of ceramic.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Wakabayashi Takahiro
• Taguchi Kenichi

Classifications

• H10W40/28

  comprising Peltier coolers · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10F77/60

  Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title

• H10F77/933

  for devices having potential barriers · CPC title