Laser processing apparatus

Patent metadata

Field	Value
Publication number	US-12151312-B2
Application number	US-202318184973-A
Country	US
Kind code	B2
Filing date	Mar 16, 2023
Priority date	Mar 30, 2020
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.

First claim

What is claimed is:

1. A method of operating a laser processing apparatus, the laser apparatus comprising:
a chuck table that holds a workpiece and includes a holding surface defined by an X-axis and a Y-axis; and
a laser beam irradiation unit that irradiates the workpiece held by the chuck table with a laser beam and forms a broken layer, wherein
the laser beam irradiation unit includes
a laser oscillator that emits the laser beam,
a Y-axis scanner that executes a high-speed scan with the laser beam emitted from the laser oscillator in a Y-axis direction,
an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and
a beam condenser,
wherein the beam condenser is configured to output a spot diameter (D) of the laser beam with which the workpiece is irradiated of 5 to 60 μm, wherein the beam condenser and the X-axis scanner are configured to output an overlap rate (K) of a spot of the laser beam of 0.70 to 0.99, wherein the Y-axis scanner is configured to output a scan speed (Vy) in the Y-axis direction of 1 to 300 m/s, and wherein the laser oscillator is configured to output an energy (E) of the laser beam per one pulse of 0.07 to 50 μJ,
the method comprising the steps of:
scanning the workpiece with the laser beam wherein
a repetition frequency (H) of the laser beam is set to:
H=Vy/{D ·(1− K )} MHz,

a scan speed (Vx) in the X-axis direction is set to:
Vx=D ·(1− K )· Vy/L mm/s,

where a width of the scan by the Y-axis scanner is defined as L mm, and

an average output power (P) of the laser beam is set to:
P=E·Vy/{D ·(1− K )} W.

Assignees

• Disco Corp

Inventors

• Morikazu Hiroshi
• Kimura Nobuyuki

Classifications

• H10H20/018

  Bonding of wafers · CPC title

• B32B2315/00

  Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04 · CPC title

• B32B2311/12

  Copper · CPC title

• B32B2311/09

  Palladium · CPC title

• B32B2311/06

  Platinum · CPC title