Stent delivery device
US-2022313462-A1 · Oct 6, 2022 · US
US12150690B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12150690-B2 |
| Application number | US-202016941913-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2020 |
| Priority date | Jul 30, 2019 |
| Publication date | Nov 26, 2024 |
| Grant date | Nov 26, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present disclosure relates generally to the field of medical devices. In particular, the present disclosure relates to an electrosurgical surgical tip that includes a conductive and low-profile cutting surface to provide high current density radiofrequency energy with minimal thermal damage to surrounding tissues. For example, an electrosurgical tip of the present disclosure may include a ring of conductive material sputter-coated around a distal opening of a non-conductive base component and a strip of conductive material sputter-coated along a longitudinal axis of the non-conductive base component.
Opening claim text (preview).
What is claimed is: 1. A medical device, comprising: a non-conductive base component defining a longitudinal axis and a lumen therethrough and having a channel formed within an outer surface along the longitudinal axis; a conductive material disposed on an outer surface of the non-conductive base component around a distal opening of the lumen; and a strip of conductive material disposed in the channel; wherein the conductive material disposed around the distal opening includes a first layer of conductive material bonded to the non-conductive base component and the strip of conductive material disposed along the longitudinal axis includes a second layer of conductive material bonded to the non-conductive base component. 2. The medical device of claim 1 , wherein one or more of the first and second layers of conductive material are sputter-coated onto the non-conductive base component. 3. The medical device of claim 1 , wherein the first and second layers of conductive material include titanium. 4. The medical device of claim 1 , wherein the conductive material disposed around the distal opening further includes a third layer of conductive material bonded to the first layer of conductive material and the strip of conductive material disposed along the longitudinal axis includes a fourth layer of conductive material bonded to the second layer of conductive material, and wherein the third and fourth layers of conductive material are sputter-coated onto the respective first and second layers of conductive material. 5. The medical device of claim 4 , wherein the third and fourth layers of conductive material include niobium. 6. The medical device of claim 4 , wherein the conductive material disposed around the distal opening further includes a fifth layer of conductive material bonded to the third layer of conductive material and the strip of conductive material disposed along the longitudinal axis includes a sixth layer of conductive material bonded to the fourth layer of conductive material. 7. The medical device of claim 6 , wherein the fifth layer of conductive material includes gold and the sixth layer of conductive material includes a nickel-copper alloy. 8. The medical device of claim 6 , wherein the fifth layer of conductive material is brazed to the third layer of conductive material and the sixth layer of conductive material is sputter-coated onto the fourth layer of conductive material. 9. The medical device of claim 6 , further comprising a distal portion of a conductive wire soldered to the sixth layer of conductive material. 10. A system, comprising: a non-conductive base component having a channel formed within an outer surface along a longitudinal axis, the non-conductive base component attached to a distal end of an electrosurgical sheath, wherein the non-conductive base component includes a first layer of conductive material applied around a distal opening of the non-conductive base component and a strip of conductive material disposed in the channel; and an access cannula disposable within a lumen of the electrosurgical sheath and extendable through the lumen and out the distal opening of the non-conductive base component, wherein the strip of conductive material disposed along the longitudinal axis includes a second layer of conductive material bonded to the non-conductive base component. 11. The system of claim 10 , wherein one or more of the conductive material and the strip of conductive material are applied via sputter-coating. 12. The system of claim 10 , further comprising a distal portion of a conductive wire disposed within the channel. 13. The system of claim 12 , wherein the conductive wire extends along the electrosurgical sheath and a proximal end of the conductive wire is connectable to an electrosurgical generator. 14. The system of claim 10 , wherein a guidewire is extendable through a lumen of the access cannula.
only coatings of metal elements only · CPC title
Sputtering · CPC title
Metallic material, boron or silicon · CPC title
Cutting · CPC title
with metal · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.