Optoelectronic device including morphological stabilizing layer

Patent metadata

Field	Value
Publication number	US-12150321-B2
Application number	US-202117528821-A
Country	US
Kind code	B2
Filing date	Nov 17, 2021
Priority date	Dec 17, 2020
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

An organic electronic device comprises a substrate, at least one morphological stabilizing layer positioned over the substrate, the morphological stabilizing layer comprising a material having a T g greater than 50° C., and at least one organic layer positioned in direct contact with the morphological stabilizing layer. A method of making an organic electronic device is also disclosed.

First claim

The invention claimed is:

1. An organic electronic device, comprising:
a substrate;
at least one morphological stabilizing layer positioned over the substrate, the morphological stabilizing layer comprising a material having a T g greater than 50° C.; and
at least one organic emissive layer positioned in direct contact with the morphological stabilizing layer;
wherein the morphological stabilizing layer improves the horizontal dipole alignment of the organic emissive layer by at least 3%.

2. The organic electronic device of claim 1 , wherein the at least one morphological stabilizing layer has a thickness of less than 50 nm.

3. The organic electronic device of claim 2 , wherein the at least one morphological stabilizing layer has a thickness of less than 30 nm.

4. The organic electronic device of claim 1 , wherein the at least one morphological stabilizing layer is positioned within the at least one organic layer.

5. The organic electronic device of claim 1 , wherein the at least one morphological stabilizing layer is positioned directly on a surface of the at least one organic layer.

6. The organic electronic device of claim 1 , wherein the material in the morphological stabilizing layer has a glass transition temperature higher than 90° C.

7. The organic electronic device of claim 1 , wherein the at least one organic layer forms part of an organic thin film transistor.

8. The organic electronic device of claim 7 , wherein the at least one organic layer is a channel body of an organic thin film transistor.

9. The organic electronic device of claim 1 , wherein the at least one organic layer comprises a heterojunction bilayer.

10. A method of making an organic electronic device, comprising:
providing a substrate;
depositing a morphological stabilizing layer over the substrate;
depositing at least one organic emissive layer directly on top of the over the morphological stabilizing layer; and
annealing the morphological stabilizing layer and the organic emissive layer at an annealing temperature of at least 50° C. for an annealing duration of at least 30 minutes, causing an improvement of at least 3% in the horizontal dipole alignment of the organic emissive layer.

11. The method of claim 10 , wherein the glass transition temperature of at least one material in the morphological stabilizing layer is higher than 50° C.

12. The method of claim 10 , wherein the annealing temperature is at least 80° C.

13. The method of claim 10 , wherein the annealing duration is at least two hours.

14. The method of claim 10 , wherein the annealing temperature is between 90° C. and 100° C.

15. The method of claim 10 , wherein the annealing duration is between 150 minutes and 210 minutes.

16. The method of claim 10 , further comprising depositing a second organic layer between the substrate and the morphological stabilizing layer.

17. The method of claim 11 , wherein the glass transition temperature of the at least one material in the morphological stabilizing layer is higher than 90° C.

Assignees

• Univ Michigan Regents

Inventors

• Kim Jongchan
• Forrest Stephen R

Classifications

• H10K30/865 Primary

  Intermediate layers comprising a mixture of materials of the adjoining active layers · CPC title

• H10K71/40 Primary

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K2102/361

  Temperature · CPC title

• H10K2102/351

  Thickness · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title