Systems and methods for using additive manufacturing for thermal management

Patent metadata

Field	Value
Publication number	US-12150279-B2
Application number	US-202016845381-A
Country	US
Kind code	B2
Filing date	Apr 10, 2020
Priority date	Apr 8, 2014
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

First claim

What is claimed is:

1. A thermal management system, comprising:
a hollow vapor chamber containing a working fluid that conducts heat from a heat source to a cold reservoir, the hollow vapor chamber having an interior defining a vapor space to contain a vapor of the working fluid and having a non-porous exterior wall and a porous wick structure integrally formed with the non-porous exterior wall by an additive manufacturing process, the porous wick structure being in the interior of the hollow vapor chamber, wherein
the non-porous exterior wall has a component side surface thermally coupled to a heat generating component of the heat source, the component side surface having a shape that at least partially conforms to at least one surface of the heat generating component, and
a portion of the porous wick structure opposite the component side surface of the non-porous exterior wall directs the working fluid toward the heat generating component,
wherein the hollow vapor chamber comprises curved integrally formed internal support posts formed by the additive manufacturing process that extends between opposing sides of the hollow vapor chamber, the internal support posts having a truss structure.

2. The thermal management system of claim 1 , wherein the hollow vapor chamber further comprises a condenser integrally formed by the additive manufacturing process.

3. The thermal management system of claim 2 , wherein the condenser comprises a plurality of hollow fins integrally formed with the hollow vapor chamber by the additive manufacturing process.

4. The thermal management system of claim 3 , wherein the plurality of hollow fins are in fluidic communication with the vapor space.

5. The thermal management system of claim 1 , wherein the porous wick structure has one or more of a non-uniform thickness, a non-uniform porosity, a non-uniform pore-size, or non-uniform permeability.

6. The thermal management system of claim 1 , wherein the curved integrally formed internal support posts comprises the porous wick structure.

7. The thermal management system of claim 1 , wherein the curved integrally formed internal support posts comprise non-porous solid portions.

8. The thermal management system of claim 1 , wherein pores of the porous wick structure of the curved integrally formed internal support posts that are adjacent the opposing sides of the hollow vapor chamber are larger than pores that are between the opposing sides.

9. The thermal management system of claim 1 , wherein pores of the porous wick structure on a liquid transport side adjacent the non-porous exterior wall are larger than pores on a vapor transport side adjacent the vapor space.

10. The thermal management system of claim 1 , wherein the hollow vapor chamber comprises a plurality of ridges that permit elastic deformation of the hollow vapor chamber.

11. The thermal management system of claim 1 , wherein the component side surface of the non-porous exterior wall is non-planar.

12. The thermal management system of claim 1 , wherein the component side surface includes a mounting portion that retains the heat generating component of the heat source.

13. The thermal management system of claim 12 , wherein the mounting portion retains the heat generating component by a friction fit.

14. The thermal management system of claim 1 , wherein the additive manufacturing process comprises 3D printing, rapid prototyping, direct digital manufacturing, selective laser melting, electron beam melting, or direct metal laser melting.

Assignees

• Gen Electric

Inventors

• Rush Brian Magann
• Gerstler William Dwight
• Lassini Stefano Angelo Mario
• Wetzel Todd Garrett

Classifications

• H05K7/20672

  within sub-racks for removing heat from electronic boards · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• G06F1/20

  Cooling means · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title