Light emitting device and method of manufacturing light emitting device

Patent metadata

Field	Value
Publication number	US-12145349-B2
Application number	US-202117197606-A
Country	US
Kind code	B2
Filing date	Mar 10, 2021
Priority date	Nov 7, 2013
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

First claim

What is claimed is:

1. A backlight source, comprising:
a light emitting element;
a first light transmissive member disposed over a light extracting surface side of the light emitting element, in a plan view, the first light transmissive member having a planar dimension greater than a light extracting surface of the light emitting element; and
a reflecting layer disposed on opposite surface of a light extracting surface of the first light transmissive member, wherein the reflecting layer is thinner than the light emitting element,
wherein an n-side electrode and a p-side electrode are disposed opposite side to the light extracting surface of the light emitting element.

2. The backlight source according to claim 1 , wherein the first light transmissive member disposed over the light emitting element via a second light transmissive member.

3. The backlight source according to claim 2 , wherein the reflecting layer has a thickness thinner than a thickness of the second light transmissive member.

4. The backlight source according to claim 2 , wherein the first light transmissive member has a refractive index substantially equal to or higher than a refractive index of the second light transmissive member.

5. The backlight source according to claim 1 , further comprising a fluorescent material layer disposed on the light extracting surface of the first light transmissive member.

6. The backlight source according to claim 5 , wherein the fluorescent material layer includes a planar dimension larger than the first light transmissive member in a plan view.

7. The backlight source according to claim 5 , further comprising:
a mounting substrate disposed opposite side to the light extracting surface of the light emitting element; and
a reflecting material disposed to cover at least one from the group consisting of side surfaces of the light emitting element, side surfaces of the first light transmissive member and side surfaces of the fluorescent material layer.

8. The backlight source according to claim 7 , wherein the reflecting layer is made of a dielectric multilayer film and the reflecting material covers the dielectric multilayer film.

9. The backlight source according to claim 5 , wherein the fluorescent material layer is directly disposed on the light extracting surface of the first light transmissive member.

10. The backlight source according to claim 5 , further comprising a lens covering a light extracting surface of the fluorescent material layer.

11. The backlight source according to claim 1 , wherein the reflecting layer includes a dielectric multilayer film.

12. The backlight source according to claim 1 , wherein the reflecting layer includes a dielectric multilayer film, and a metal film disposed on the dielectric multilayer film at an opposite side to the first light transmissive member.

13. The backlight source according to claim 1 , further comprising:
a mounting substrate disposed opposite side to the light extracting surface of the light emitting element; and
a reflecting material disposed to cover at least one from the group consisting of side surfaces of the light emitting element and side surfaces of the first light transmissive member.

14. The backlight source according to claim 13 , wherein the reflecting layer is made of a dielectric multilayer film and the reflecting material covers the dielectric multilayer film.

15. The backlight source according to claim 1 , wherein the reflecting layer includes a white resin layer.

16. The backlight source according to claim 1 , wherein the light emitting element comprises a sapphire substrate at a light extracting surface side of the light emitting element.

Assignees

• Nichia Corp

Inventors

• Sanga Daisuke
• Ichikawa Masatsugu
• Minato Shunsuke
• Takasone Toru
• Sano Masahiko

Classifications

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/018

  Bonding of wafers · CPC title

• B32B2305/55

  Liquid crystals · CPC title