Display substrate with inorganic protective layer between conducting layer and insulating layer and fabrication method thereof, and display device

Patent metadata

Field	Value
Publication number	US-12144196-B2
Application number	US-202117508891-A
Country	US
Kind code	B2
Filing date	Oct 22, 2021
Priority date	Mar 19, 2021
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

A display substrate includes: a base substrate; a first conducting layer; a first insulating layer, where the first insulating layer is provided with a first opening; a second conducting layer, connected to the first conducting layer through the first opening, and including a first portion and a second portion, where the first portion is located within the first opening, and the second portion is located outside the first opening and located on the side of the first insulating layer facing away from the base substrate; and an inorganic protective layer including at least a first inorganic protective layer portion located between the second portion and the first insulating layer; in a direction perpendicular to the base substrate, the thickness h1 of the first inorganic protective layer portion and the thickness h2 of the second portion satisfy the following relationship: h2=K*h1, wherein 12≤K≤18.

First claim

What is claimed is:

1. A display substrate, comprising:
a base substrate;
a first conducting layer, located on the base substrate;
a first insulating layer, located on a side of the first conducting layer facing away from the base substrate, wherein the first insulating layer is provided with a first opening;
a second conducting layer, connected to the first conducting layer through the first opening, and comprising a first portion and a second portion, wherein the first portion is located within the first opening, and the second portion is located outside the first opening and located on a side of the first insulating layer facing away from the base substrate; and
an inorganic protective layer, comprising at least a first inorganic protective layer portion located between the second portion and the first insulating layer; wherein in a direction perpendicular to the base substrate, a thickness h 1 of the first inorganic protective layer portion and a thickness h 2 of the second portion satisfy the following relationship:
h 2 =K*h 1 , wherein 12≤ K≤ 18;

wherein the inorganic protective layer further comprises a second inorganic protective layer portion, wherein the second inorganic protective layer portion is located on the side of the first insulating layer facing away from the base substrate and is located on a side of the first inorganic protective layer portion far away from the first opening; in the direction perpendicular to the base substrate, a thickness of the second inorganic protective layer portion is less than the thickness of the first inorganic protective layer portion.

2. The display substrate according to claim 1 , wherein an orthographic projection of an edge of a side of the first inorganic protective layer portion far away from the first opening on the base substrate is located on a side, far away from the first opening, of an orthographic projection of an edge of a side of the second portion far away from the first opening on the base substrate.

3. The display substrate according to claim 1 , wherein the inorganic protective layer further comprises a third inorganic protective layer portion lapping on a side surface of the first insulating layer close to the first opening.

4. The display substrate according to claim 1 , wherein 400 Å≤h 1 ≤600 Å, and 5000 Å≤h 2 ≤10000 Å.

5. The display substrate according to claim 1 , wherein a material of the second conducting layer comprises an aluminum element.

6. The display substrate according to claim 1 , wherein a material of the first insulating layer comprises an organic insulating material.

7. A fabrication method of a display substrate, comprising:
providing a base substrate;
forming a pattern of a first conducting layer on the base substrate;
forming a first insulating layer provided with a first opening on the pattern of the first conducting layer;
fabricating an inorganic protective layer on the first insulating layer using a mask for fabricating the first insulating layer, wherein the inorganic protective layer comprises at least a first inorganic protective layer portion, and the first inorganic protective layer portion does not overlap with the first opening; the inorganic protective layer further comprises a second inorganic protective layer portion, wherein the second inorganic protective layer portion is located on a side of the first insulating layer facing away from the base substrate and is located on a side of the first inorganic protective layer portion far away from the first opening; in a direction perpendicular to the base substrate, a thickness of the second inorganic protective layer portion is less than a thickness of the first inorganic protective layer portion; and
forming a pattern of a second conducting layer on the inorganic protective layer, wherein the pattern of the second conducting layer is connected with the pattern of the first conducting layer through the first opening, the second conducting layer comprises a first portion and a second portion, the first portion is located within the first opening, and the second portion is located outside the first opening, and in the direction perpendicular to the base substrate, a thickness h 2 of the second portion and the thickness h 1 of the first inorganic protective layer portion satisfy the following relationship:
h 2 =K*h 1 , wherein 12≤ K≤ 18.

8. The fabrication method according to claim 7 , wherein the forming the pattern of the second conducting layer on the inorganic protective layer further comprises:
forming the pattern of the second conducting layer on the inorganic protective layer using a dry etching process;
after forming the pattern of the second conducting layer on the inorganic protective layer, the fabrication method further comprises:
removing residual Cl 2 during the dry etching process using CF 4 and O 2 and the inorganic protective layer made of an a-Si material that is not shielded by the pattern of the second conducting layer.

9. A display device, comprising a display substrate, wherein the display substrate comprises:
a base substrate;
a first conducting layer, located on the base substrate;
a first insulating layer, located on a side of the first conducting layer facing away from the base substrate, wherein the first insulating layer is provided with a first opening;
a second conducting layer, connected to the first conducting layer through the first opening, and comprising a first portion and a second portion, wherein the first portion is located within the first opening, and the second portion is located outside the first opening and located on a side of the first insulating layer facing away from the base substrate; and
an inorganic protective layer, comprising at least a first inorganic protective layer portion located between the second portion and the first insulating layer; wherein in a direction perpendicular to the base substrate, a thickness h 1 of the first inorganic protective layer portion and a thickness h 2 of the second portion satisfy the following relationship:
h 2 =K*h 1 , wherein 12≤ K≤ 18;

wherein the inorganic protective layer further comprises a second inorganic protective layer portion, wherein the second inorganic protective layer portion is located on the side of the first insulating layer facing away from the base substrate and is located on a side of the first inorganic protective layer portion far away from the first opening; in the direction perpendicular to the base substrate, a thickness of the second inorganic protective layer portion is less than the thickness of the first inorganic protective layer portion.

10. The display device according to claim 9 , wherein an orthographic projection of an edge of a side of the first inorganic protective layer portion far away from the first opening on the base substrate is located on a side, far away from the first opening, of an orthographic projection of an edge of a side of the second portion far away from the first opening on the base substrate.

11. The display device according to claim 10 , wherein a material of the second conducting layer comprises an aluminum element.

12. The display device according to claim 10 , wherein a material of the first insulating layer comprises an organic insulating material.

13. The display device according to claim 9 , wherein the inorganic protective layer further comprises a third inorganic protective layer portion lapping on a side surface of the first insulating layer close to the first opening.

14. The display device according to claim 13 , wherein a material of the second conducting layer comprises an

Assignees

• Chongqing Boe Display Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Jie
• Zhang Wei
• Li Zeliang
• Li Zhendong
• Fang Fei

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K50/844 Primary

  Encapsulations · CPC title

• H10K59/131 Primary

  Interconnections, e.g. wiring lines or terminals · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title