Cooling apparatus for power module

Patent metadata

Field	Value
Publication number	US-12144147-B2
Application number	US-202217987199-A
Country	US
Kind code	B2
Filing date	Nov 15, 2022
Priority date	May 11, 2022
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.

First claim

What is claimed is:

1. A cooling apparatus for a power module, the cooling apparatus comprising:
a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded;
a fin plate embedded in the manifold cover and positioned so as to contact the power module when the power module is embedded in the flow path, the fin plate comprising a plurality of cooling fins on a surface of the fin plate, the cooling fins projecting toward an inner surface of the manifold cover, the cooling fins extending in a direction perpendicular to a flow direction of the cooling fluid; and
a guide wall projecting from the inner surface of the manifold cover, the guide wall extending in the flow direction of the cooling fluid, the guide wall defines a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall having an end portion in contact with the cooling fins of the fin plate to allow the cooling fluid to flow in sequence through the first channels, between the cooling fins of the fin plate in the manifold cover, and through the second channels, wherein the end portion of the guide wall overlaps the cooling fins of the fin plate when the power module and the fin plate are mounted on the manifold cover.

2. The cooling apparatus of claim 1 , wherein the end portion of the guide wall is inclined in a direction perpendicular to the first channels and the second channels and has an inclined surface.

3. The cooling apparatus of claim 1 , wherein both sides of the end portion of the guide wall are inclined in a direction perpendicular to the first channels and the second channels.

4. The cooling apparatus of claim 1 , wherein the end portion of the guide wall comprises a plurality of contact points with the cooling fins of the fin plate in which a width of a plurality of contact portions gradually decreases toward the fin plate.

5. The cooling apparatus of claim 1 , further comprising a contact protrusion disposed on the end portion of the guide wall and extending in an extension direction of the cooling fins of the fin plate.

6. The cooling apparatus of claim 1 , wherein the guide wall comprises:
a plurality of wall units extending to divide the first channels and the second channels;
first blocking units connected to first sides of the wall units to close the first closed ends of the first channels; and
second blocking units connected to second sides of the wall units to close the second closed ends of the second channels.

7. The cooling apparatus of claim 6 , wherein the first channels and the second channels are alternately arranged.

8. The cooling apparatus of claim 1 , wherein the manifold cover is coupled to an edge of the fin plate by welding, bonding, or bolting.

9. An apparatus comprising:
a manifold cover provided with an inner space that defines a flow path for a cooling fluid;
a power module embedded in the flow path;
a fin plate embedded in the manifold cover, in contact with the power module, and comprising a plurality of cooling fins on a surface of the fin plate, the cooling fins projecting toward an inner surface of the manifold cover, the cooling fins extending in a direction perpendicular to a flow direction of the cooling fluid; and
a guide wall projecting from the inner surface of the manifold cover, the guide wall extending in the flow direction of the cooling fluid, the guide wall defines a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall having an end portion in contact with the cooling fins of the fin plate to allow the cooling fluid to flow in sequence through the first channels, between the cooling fins of the fin plate in the manifold cover, and through the second channels, wherein the end portion of the guide wall overlaps the cooling fins of the fin plate when the power module and the fin plate are mounted on the manifold cover.

10. The apparatus of claim 9 , wherein the end portion of the guide wall is inclined in a direction perpendicular to the first channels and the second channels and has an inclined surface.

11. The apparatus of claim 9 , wherein both sides of the end portion of the guide wall are inclined in a direction perpendicular to the first channels and the second channels.

12. The apparatus of claim 9 , wherein the end portion of the guide wall comprises a plurality of contact points with the cooling fins of the fin plate in which a width of a plurality of contact portions gradually decreases toward the fin plate.

13. The apparatus of claim 9 , further comprising a contact protrusion disposed on the end portion of the guide wall and extending in an extension direction of the cooling fins of the fin plate.

14. The apparatus of claim 9 , wherein the guide wall comprises:
a plurality of wall units extending to divide the first channels and the second channels;
first blocking units connected to first sides of the wall units to close the first closed ends of the first channels; and
second blocking units connected to second sides of the wall units to close the second closed ends of the second channels.

15. The apparatus of claim 14 , wherein the first channels and the second channels are alternately arranged.

16. The apparatus of claim 9 , wherein the manifold cover is coupled to an edge of the fin plate by welding, bonding, or bolting.

17. An apparatus comprising:
a power module;
a manifold cover in which the power module is embedded, the manifold cover comprising a first manifold cover having an inlet and a second manifold cover having an outlet, wherein the manifold cover is provided with an inner space defining a flow path for a cooling fluid;
a plurality of fin plates embedded in the manifold cover, each of the fin plates in contact with a respective one of two side surfaces of the power module, wherein each of the fin plates comprises a plurality of cooling fins on a surface of the fin plate, the cooling fins projecting toward an inner surface of an opposing one of the first and second manifold covers, the cooling fins of each fin plate extending in a direction perpendicular to a flow direction of the cooling fluid, the plurality of fin plates comprising a first fin plate having a first flow hole defined therein, and a second fin plate having a second flow hole defined therein, wherein both sides of the power module are configured to be cooled by a flow of the cooling fluid between the first manifold cover and the second manifold cover; and
a plurality of guide walls each projecting from the inner surface of a respective one of the first and second manifold covers, each of the guide walls extending in the flow direction of the cooling fluid, each of the guide walls defines to define a plurality of first channels having first closed ends and second channels having second closed ends, each of the guide walls having an end portion in contact with the cooling fins of a corresponding one of the first and second fin plates such that the cooling fluid is allowed to flow in sequence through the first channels, between the cooling fins of the corresponding one of the first and second fin plates, and through the second channels, wherein the end portion of each of the guide walls overlaps the cooling fins of the corresponding one of the first and second fin plates when the power module and the fin plate are mounted on the manifold cover.

18. The apparatus of claim 17 , wherein:
the inlet is provided at a first side of the first manifold cover and the outle

Assignees

• Hyundai Motor Co Ltd
• Kia Corp

Inventors

• Lee Sang Hun
• Park Hyong Joon
• Kwon Se Heun

Classifications

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title