Electronic device including thermosetting bonding sheet

Patent metadata

Field	Value
Publication number	US-12144115-B2
Application number	US-202218084994-A
Country	US
Kind code	B2
Filing date	Dec 20, 2022
Priority date	Sep 30, 2021
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.

First claim

What is claimed is:

1. An electronic device comprising a thermosetting bonding sheet, the electronic device comprising:
a base substrate comprising a base substrate body and a plurality of base pads disposed on the base substrate body;
a connection substrate comprising a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and comprising a pad hole, and a plurality of connection lines disposed on the connection substrate body and respectively connected to the plurality of connection pads;
a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad; and
a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.

2. The electronic device of claim 1 , wherein the thermosetting bonding sheet is attached to the base pad, the connection pad, and the solder.

3. The electronic device of claim 1 , wherein the thermosetting bonding sheet is attached to the connection line.

4. The electronic device of claim 3 , wherein, in a portion where the thermosetting bonding sheet is provided, the connection line is covered by the connection substrate body and the thermosetting bonding sheet.

5. The electronic device of claim 3 , wherein the thermosetting bonding sheet is configured to fill a space between the connection pad and the connection line.

6. The electronic device of claim 1 , wherein the connection substrate comprises: a cover layer configured to cover at least a portion of the connection substrate body and an adhesive layer configured to connect the connection substrate body to the cover layer, and
the thermosetting bonding sheet is bonded to the base substrate body and the cover layer.

7. The electronic device of claim 1 , wherein the thermosetting bonding sheet comprises:
a sheet base in a plate shape; and
a plurality of sheet holes penetrating the sheet base and accommodating the base pad and the solder.

8. The electronic device of claim 7 , wherein, based on a state before thermal deformation of the thermosetting bonding sheet, a height of the thermosetting bonding sheet is greater than a sum of a height of the solder and a height of the base pad.

9. The electronic device of claim 7 , wherein, based on a state in which the thermosetting bonding sheet is bonded to the base substrate and the connection substrate by thermal deformation, a height of the thermosetting bonding sheet is less than a sum of a height of the solder and a height of the base pad.

10. The electronic device of claim 7 , wherein, based on a state before thermal deformation of the thermosetting bonding sheet, a diameter of the sheet hole is greater than a diameter of the base pad.

11. The electronic device of claim 1 , wherein some of the plurality of connection lines are between two adjacent connection pads among the plurality of connection pads.

12. The electronic device of claim 1 , wherein the connection substrate body comprises a body hole communicating with the pad hole and accommodating at least a portion of the solder.

13. The electronic device of claim 1 , wherein a pair of connection lines are provided at opposite sides of the connection substrate body to each other.

14. The electronic device of claim 13 , further comprising:
a photo solder resist configured to cover the connection line provided at an opposite side of the connection substrate body to the thermosetting bonding sheet.

15. The electronic device of claim 13 , wherein the connection line provided at an opposite side of the connection substrate body to the thermosetting bonding sheet is exposed to an outside.

16. An electronic device comprising a thermosetting bonding sheet, the electronic device comprising:
a base substrate comprising a base substrate body and a plurality of base pads disposed on the base substrate body;
a solder disposed on the base pad; and
a thermosetting bonding sheet comprising a sheet base arranged on the base substrate body and a plurality sheet holes penetrating the sheet base and accommodating the base pad and the solder.

17. The electronic device of claim 16 , wherein a height of the thermosetting bonding sheet is greater than a sum of a height of the solder and a height of the base pad.

18. The electronic device of claim 16 , wherein a diameter of the sheet hole is greater than a diameter of the base pad.

19. The electronic device of claim 16 , wherein the thermosetting bonding sheet is attachable to the base pad and the solder by thermal deformation.

20. An electronic device comprising a thermosetting bonding sheet, the electronic device comprising:
a base substrate comprising a base substrate body and a plurality of base pads disposed on the base substrate body;
a connection substrate comprising a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and comprising a pad hole, and a plurality of connection lines disposed on the connection substrate body and respectively connected to the plurality of connection pads;
a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad; and
a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and attached to the base pad, the connection pad, the solder, and the connection line.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Youngsun
• Kim Dohyeon
• Kim Byeongkeol
• Kim Jinsu
• Park Seokjoon
• Bang Jungje
• Seo Hoyeon
• Lee Jongbum
• Jeon Jongmin

Classifications

• H05K2201/10378

  Interposers · CPC title

• H05K2201/10984

  Component carrying a connection agent, e.g. solder, adhesive · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• H05K2201/048

  Second PCB mounted on first PCB by inserting in window or holes of the first PCB · CPC title

• B32B2457/00

  Electrical equipment · CPC title