Transceiver and interface for IC package

Patent metadata

Field	Value
Publication number	US-12140809-B2
Application number	US-202318134647-A
Country	US
Kind code	B2
Filing date	Apr 14, 2023
Priority date	Jul 1, 2011
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

First claim

What is claimed is:

1. An optical transceiver comprising:
a transceiver circuit board including a first row of lands and a second row of lands on a bottom surface of the transceiver circuit board, the first row of lands and the second row of lands are configured to mate and to unmate with an electrical-connection socket; and
an optical engine mounted on a top surface of the transceiver circuit board; wherein
the first row of lands is configured only to transmit and/or to receive high-speed signals; and
the second row of lands is configured only to transmit and/or to receive power and/or low-speed signals with a speed lower than the high-speed signals.

2. The optical transceiver of claim 1 , wherein the first row of lands is located along a front edge of the transceiver circuit board.

3. The optical transceiver of claim 1 , further comprising a third row of lands located on the bottom surface of the transceiver circuit board.

4. A transceiver comprising:
a substrate including:
a first row of lands located on a bottom surface of the substrate; and
a second row of lands located on the bottom surface of the substrate;

a first connection area that is located on a front half of the bottom surface of the substrate and that transmits and/or receives first electrical signals through the first row of lands; and
a second connection area that is separate and spaced away from the first connection area, that is located on a back half of the bottom surface of the substrate, and that transmits and/or receives second electrical signals through the second row of lands; wherein
the first row of lands and the second row of lands are configured to mate and to unmate with an electrical-connection socket.

5. The transceiver according to claim 4 , further comprising a third row of lands located along a bottom surface of the substrate.

6. The transceiver according to claim 4 , further comprising an optical engine mounted to a top surface of the substrate that converts optical signals into electrical signals and/or converts electrical signals into optical signals.

7. The optical transceiver according to claim 4 , wherein the substrate includes a circuit board.

8. The optical transceiver of claim 1 , further comprising a permanently attached optical fiber cable including a plurality of optical fibers.

9. The optical transceiver of claim 8 , wherein the optical fiber cable terminates in an MPO optical connector mounted on an end of the transceiver circuit board opposite to the optical engine.

10. The optical transceiver of claim 1 , further comprising an optical connector configured to receive an optical patchcord.

11. The optical transceiver of claim 1 , further comprising a thermal dissipation surface on a top surface of the optical transceiver.

12. The optical transceiver of claim 11 , wherein the thermal dissipation surface is flat.

13. The optical transceiver of claim 1 , wherein the socket is included in an integrated circuit package.

14. The transceiver according to claim 4 , further comprising a copper cable configured to transmit high data rate signals.

15. The transceiver according to claim 6 , further comprising a permanently attached optical fiber cable including a plurality of optical fibers.

16. The transceiver according to claim 6 , further comprising an optical connector configured to receive an optical patchcord.

17. The transceiver according to claim 4 , further comprising a thermal dissipation surface on a top surface of the transceiver.

18. The transceiver according to claim 17 , wherein the thermal dissipation surface is flat.

19. The transceiver according to claim 4 , wherein the socket is included in an integrated circuit package.

20. The transceiver according to claim 4 , wherein
the first connection area is configured to transmit and/or to receive high-speed signals; and
the second connection area is configured to transmit and/or to receive low-speed signals with a speed lower than the high-speed signals.

21. A system comprising:
the optical transceiver of claim 1 , and
a circuit board on which the socket is attached; wherein
the socket includes electrical contacts that are configured to provide an upward compression force that ensures an electrical connection between the optical transceiver and the socket, when the optical transceiver is mated with the socket.

22. The system according to claim 21 , further comprising a screw configured to attach the optical transceiver to the circuit board.

23. The system according to claim 22 , further comprising a host circuit board; wherein
the circuit board is included in an integrated circuit (IC) package that includes an IC die;
the IC package is attached to the host circuit board; and
a data connection between the socket and the IC die does not go through the host circuit board.

24. The system according to claim 23 , wherein the socket includes a land grid array connector.

25. The system according to claim 24 , wherein the optical transceiver includes permanently attached optical fibers.

26. A system comprising:
the transceiver of claim 4 ; and
a circuit board on which the socket is attached; wherein
the socket includes electrical contacts that are configured to provide an upward compression force that ensures an electrical connection between the transceiver and the socket, when the transceiver is mated with the socket.

27. The system according to claim 26 , further comprising a screw configured to attach the transceiver to the circuit board.

28. The system according to claim 27 , further comprising a host circuit board; wherein
the circuit board is included in an integrated circuit (IC) package that includes an IC die;
the IC package is attached to the host circuit board; and
a data connection between the socket and the IC die does not go through the host circuit board.

29. The system according to claim 28 , wherein the socket includes a land grid array connector.

30. The system according to claim 29 , wherein the optical transceiver includes permanently attached optical fibers.

Assignees

• Samtec Inc

Inventors

• Zbinden Eric J
• Musser Randall E
• Verdiell Jean-Marc A
• Mongold John A
• Vicich Brian R
• Guetig Keith R

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H04B10/803

  Free space interconnects, e.g. between circuit boards or chips · CPC title

• H04B10/801

  using optical interconnects, e.g. light coupled isolators, circuit board interconnections · CPC title

• H04B10/27

  Arrangements for networking · CPC title