Heat-dissipating substrate structure

Patent metadata

Field	Value
Publication number	US-12140386-B2
Application number	US-202217903993-A
Country	US
Kind code	B2
Filing date	Sep 6, 2022
Priority date	Jul 7, 2021
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm 3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

First claim

What is claimed is:

1. A heat-dissipating substrate structure, comprising:
a base layer made of a metal; and
a cold spray coating layer formed on a top surface of the base layer; wherein the cold spray coating layer is a film formed on the top surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas with a pressure of 4 to 6 Mpa onto the base layer; wherein the solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm 3 and a median particle diameter (D50) of 30 μm or less; wherein a maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm; wherein at least one internal cooling fin is joined to a bottom surface of the base layer, and at least one internal coolant passage is defined between the base layer and the at least one internal cooling fin.

2. The heat-dissipating substrate structure according to claim 1 , wherein a predetermined ratio between a thickness of the base layer and a thickness of the cold spray coating layer ranges from 10:1 to 30:1.

3. The heat-dissipating substrate structure according to claim 2 , wherein the thickness of the base layer is from 1 mm to 3 mm.

4. The heat-dissipating substrate structure according to claim 1 , wherein the at least one internal cooling fin is joined to the bottom surface of the base layer by brazing, adhesive bonding, or solid-state welding.

5. The heat-dissipating substrate structure according to claim 1 , wherein the cold spray coating layer is a cold spray copper layer.

6. The heat-dissipating substrate structure according to claim 1 , wherein the base layer is an aluminum substrate.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Yang Ching-Ming
• Yeh Tze-Yang

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• F28F21/084

  from aluminium or aluminium alloys · CPC title