Device for discharging condensate for a housing of a motor vehicle closed off from the environment, housing, and motor vehicle
US-9169945-B2 · Oct 27, 2015 · US
US12140270B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12140270-B2 |
| Application number | US-202218081293-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 14, 2022 |
| Priority date | Dec 15, 2021 |
| Publication date | Nov 12, 2024 |
| Grant date | Nov 12, 2024 |
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The disclosure relates to a condensate draining device for discharging condensate from at least one cooled component, which is in particular a cooled electronic system and has a surface on which condensate formation can occur, wherein the condensate draining device has a heat conducting element which has a condensation surface and which is designed to at least partially cover the surface of the at least one component and to transfer a cold causing condensation on the surface of the at least one component to the condensation surface, further having a housing with at least one condensate drain and/or a condensate chamber for collecting a condensate forming on the condensation surface, wherein the at least one condensate drain determines in each case at least one predetermined flow path which is fluidically separated from the at least one component for draining off the condensate from the housing.
Opening claim text (preview).
The invention claimed is: 1. A condensate draining device for discharging condensate from at least one cooled component having a cooled electronic system and a surface on which condensate formation can occur, the condensate draining device comprising: a heat conducting element which has a condensation surface and which is configured to at least partially cover the surface of the at least one component and to transfer a cold causing condensation on the surface of the at least one component to the condensation surface; and a housing with at least one condensate drain and/or a condensate chamber for collecting a condensate forming on the condensation surface, wherein the housing has a lower part and/or an upper part, which are designed to enclose the at least one component from two opposite sides in the region of the surface, wherein the at least one condensate drain determines in each case at least one predetermined flow path which is fluidically separated from the at least one component for draining off the condensate from the housing. 2. The condensate draining device according to claim 1 , wherein the condensation surface in the condensate chamber is exposed and forms part of a surface delimiting the condensate chamber. 3. The condensate draining device according to claim 1 , wherein the at least one condensate drain is designed to drain off a condensate forming on the condensation surface and accumulating in the condensate chamber from the housing along the flow path such that it is fluidically separated from the at least one component. 4. The condensate draining device according to claim 1 , wherein the at least one component can be arranged in a first spatial orientation or in a second spatial orientation differing therefrom, wherein the housing has a first condensate drain which determines at least one first predetermined flow path fluidically separated from the at least one component for draining off the condensate from the housing, and has a second condensate drain which determines at least one second predetermined flow path fluidically separated from the at least one component for draining off the condensate from the housing, and wherein the condensate draining device can be arranged with the at least one component in the first spatial orientation or in the second spatial orientation differing therefrom, and wherein in the first spatial orientation, the condensate can be guided out of the housing via the first condensate drain and/or via the second condensate drain and in the second spatial orientation via the second condensate drain and/or via the first condensate drain. 5. The condensate draining device according to claim 1 , wherein the heat conducting element is formed from a flowable and curable protective mass. 6. The condensate draining device according to claim 5 , wherein the housing has a mold chamber for accommodating the heat conducting element, wherein the mold chamber is completely filled by the heat conducting element and is designed to enclose the at least one component at least in certain sections and the surface of the at least one component completely, and forms a mold for the potting compound. 7. The condensate draining device according to claim 6 , wherein the housing has at least one sealing section which is formed in particular by a sealing lip and which is designed to seal off the mold chamber formed as a mold from an environment, in particular by cooperating with the at least one component. 8. An electronic assembly with a cooling device, at least one electrical component and a condensate draining device according to claim 1 , wherein the cooling device for cooling the at least one component is arranged on the latter and the at least one component has a surface on which condensate formation can occur as a result of the cooling by means of the cooling device. 9. The electronic assembly according to claim 8 , further having an assembly housing, wherein the housing of the condensate draining device is arranged in particular completely within the assembly housing and the at least one condensate drain is designed in each case to discharge the condensate from the assembly housing. 10. A method for producing an electronic assembly according to claim 9 , wherein the housing has a mold chamber for accommodating the heat conducting element, the method comprising: arranging the housing forming the mold chamber to rest against the at least one component and to seal to the at least one component so that the mold chamber is open exclusively towards the condensate chamber, filling the mold chamber with a potting compound through an opening to the condensate chamber, which potting compound is distributed in the mold chamber by gravity and completely fills the mold chamber, and curing the potting compound such that the potting compound forms the heat conducting element.
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