Treatment liquid and method for treating object to be treated

Patent metadata

Field	Value
Publication number	US-12139693-B2
Application number	US-202017850160-A
Country	US
Kind code	B2
Filing date	Dec 24, 2020
Priority date	Jan 28, 2020
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

A treatment liquid contains water, hydroxylamine, and one or more kinds of hydrazines selected from the group consisting of hydrazine, a hydrazine salt, and a hydrazine derivative, in which a total content of the hydrazines is 1 part by mass or less with respect to 100 parts by mass of the hydroxylamine.

First claim

What is claimed is:

1. A treatment liquid comprising:
water;
hydroxylamine; and
one or more kinds of hydrazines selected from the group consisting of hydrazine, a hydrazine salt, and a hydrazine derivative,
wherein a total content of the hydrazines is 1 part by mass or less with respect to 100 parts by mass of the hydroxylamine.

2. The treatment liquid according to claim 1 ,
wherein the total content of the hydrazines is 0.0001 parts by mass or more with respect to 100 parts by mass of the hydroxylamine.

3. The treatment liquid according to claim 1 ,
wherein the total content of the hydrazines is 0.005 to 0.5 parts by mass with respect to 100 parts by mass of the hydroxylamine.

4. The treatment liquid according to claim 1 ,
wherein the hydrazine derivative is one or more kinds of compounds selected from the group consisting of a compound represented by General Formula (A), a compound represented by General Formula (B), a compound having a pyrazole ring, and a salt of these,
H 2 N—N—R N 2   (A)

H 2 N—N═X  (B)

in General Formula (A), two R N 's each independently represent a hydrogen atom or a substituent, two R N 's may be bonded to each other to form a ring, at least one of two R N 's is not a hydrogen atom, and
in General Formula (B), X represents a divalent group.

5. The treatment liquid according to claim 1 ,
wherein the hydrazines contain hydrazine.

6. The treatment liquid according to claim 1 , further comprising:
one or more kinds of first anions selected from the group consisting of Cl − , NO 2 − , and NO 3 − .

7. The treatment liquid according to claim 6 , comprising:
three kinds of first anions consisting of Cl − , NO 2 − , and NO 3 − .

8. The treatment liquid according to claim 6 ,
wherein a total content of the first anions is 0.0001 to 30 parts by mass with respect to 100 parts by mass of the hydroxylamine.

9. The treatment liquid according to claim 6 , further comprising:
one or more kinds of second anions selected from the group consisting of SO 4 2− and PO 4 3− ,
wherein a total content of the first anions and the second anions is 0.0001 to 30 parts by mass with respect to 100 parts by mass of the hydroxylamine.

10. The treatment liquid according to claim 6 ,
wherein a total mass of NO 2 − and NO 3 − contained in the treatment liquid is larger than a mass of Cl − contained in the treatment liquid.

11. The treatment liquid according to claim 1 , further comprising:
a chelating agent.

12. The treatment liquid according to claim 11 ,
wherein the chelating agent contains a functional group selected from the group consisting of a carboxylic acid group, a phosphonic acid group, and a sulfonic acid group.

13. The treatment liquid according to claim 11 ,
wherein the chelating agent is one or more kinds of compounds selected from the group consisting of diethylenetriaminepentaacetic acid, ethylenediaminetetraacetic acid, trans-1,2-diaminocyclohexanetetraacetic acid, oxalic acid, malonic acid, succinic acid, citric acid, methanesulfonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, and nitrilotrismethylenephosphonic acid.

14. The treatment liquid according to claim 1 , further comprising:
an anticorrosive.

15. The treatment liquid according to claim 14 ,
wherein the anticorrosive is benzotriazoles.

16. The treatment liquid according to claim 15 ,
wherein the benzotriazoles are benzotriazole that may be substituted with one or more kinds of substituents selected from the group consisting of an alkyl group which may further contain a substituent, an aryl group which may further contain a substituent, a halogen atom, an amino group which may further contain a substituent, a nitro group, an alkoxy group which may further contain a substituent, and a hydroxyl group.

17. The treatment liquid according to claim 14 ,
wherein the anticorrosive is one or more kinds of compounds selected from the group consisting of benzotriazole, 5-aminotetrazole, 1-hydroxybenzotriazole, 5-phenylthiol-benzotriazole, 5-chlorobenzotriazole, 4-chlorobenzotriazole, 5-bromobenzotriazole, 4-bromobenzotriazole, 5-fluorobenzotriazole, 4-fluorobenzotriazole, naphthotriazole, tolyltriazole, 5-phenyl-benzotriazole, 5-nitrobenzotriazole, 4-nitrobenzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 2-(5-amino-pentyl)-benzotriazole, 1-amino-benzotriazole, 5-methyl-1H-benzotriazole, benzotriazole-5-carboxylic acid, 4-methylbenzotriazole, 4-ethylbenzotriazole, 5-ethylbenzotriazole, 4-propylbenzotriazole, 5-propylbenzotriazole, 4-isopropylbenzotriazole, 5-isopropylbenzotriazole, 4-n-butylbenzotriazole, 5-n-butylbenzotriazole, 4-isobutylbenzotriazole, 5-isobutylbenzotriazole, 4-pentylbenzotriazole, 5-pentylbenzotriazole, 4-hexylbenzotriazole, 5-hexylbenzotriazole, 5-methoxybenzotriazole, 5-hydroxybenzotriazole, dihydroxypropylbenzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]-benzotriazole, 5-t-butylbenzotriazole, 5-(1′,1′-dimethylpropyl)-benzotriazole, 5-(1′,1′,3′-trimethylbutyl)benzotriazole, 5-n-octylbenzotriazole, and 5-(1′,1′,3′,3′-tetramethylbutyl)benzotriazole.

18. The treatment liquid according to claim 1 , further comprising:
one or more kinds of organic solvents selected from the group consisting of an alcohol-based solvent, a ketone-based solvent, an ester-based solvent, and an ether-based solvent.

19. The treatment liquid according to claim 1 ,
wherein the treatment liquid has a pH of 6 to 11.

20. The treatment liquid according to claim 1 ,
wherein the treatment liquid is used for an object to be treated that contains a cobalt-containing substance containing cobalt atoms and a metal-containing substance containing metal atoms other than cobalt atoms.

21. The treatment liquid according to claim 20 ,
wherein the cobalt-containing substance is simple cobalt, a cobalt alloy, a cobalt oxide, or a cobalt nitride.

22. A method for treating an object to be treated, comprising:
bringing an object to be treated that contains a cobalt-containing substance containing cobalt atoms into contact with the treatment liquid according to claim 1 so that the cobalt-containing substance is dissolved.

23. A method for treating an object to be treated, comprising:
a step A of performing a treatment on an object to be treated containing a metal layer so that a surface layer of the metal layer is oxidized and turns into a metal oxide layer; and
a step B of bringing the object to be treated obtained by the step A into contact with the treatment liquid according to claim 1 so that the metal oxide layer is dissolved,
wherein the treatment in the step A is a liquid treatment of bringing the object to be treated into contact with a solution selected from the group consisting of water, hydrogen peroxide water, a mixed aqueous solution of ammonia and hydrogen peroxide, a mixed aqueous solution of hydrofluoric acid and hydrogen peroxide water, a mixed aqueous solution of sulfuric acid and hydrogen peroxide water, a mixed aqueous solution of hydrochloric acid and hydrogen peroxide water, water containing dissolved oxygen, and water containing dissolved ozone,
an ozone treatment of bringing the object to be treated into contact with an ozone gas,
a heating treatment in oxygen in which the object to be treated is heated in an oxygen atmosphere, or
a plasma treatment using an oxygen gas.

24. The method for treating an object to be treated according to claim 23 ,
wherein the step A and the step B are

Assignees

• Fujifilm Corp

Inventors

• Sugishima Yasuo

Classifications

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title

• H10P50/667

  by liquid etching only · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P50/28

  of insulating materials · CPC title

• H10P70/234 Primary

  the processing being the formation of vias or contact holes · CPC title