Resin composition comprising thermoplastic plastomer and hollow resin particles and molded product thereof

Patent metadata

Field	Value
Publication number	US-12139609-B2
Application number	US-201917279711-A
Country	US
Kind code	B2
Filing date	Sep 13, 2019
Priority date	Sep 28, 2018
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

First claim

The invention claimed is:

1. A resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles,
wherein the hollow resin particles have a void ratio of from 50% to 85%;
wherein the hollow resin particles have a shell containing a resin; and
wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit; and
wherein the hollow resin particles have a particle size distribution, that is, a volume average particle diameter thereof (Dv)/a number average particle diameter thereof (Dn), of from more than 1.20 and 2.50 or less.

2. The resin composition according to claim 1 , wherein the hollow resin particles do not exhibit a glass transition temperature in a range of from 0° C. to 250° C.

3. The resin composition according to claim 1 , wherein the hollow resin particles have a volume-based average particle diameter of from 1.0 μm to 20.0 μm.

4. A molded product comprising the resin composition defined by claim 1 .

5. The resin composition according to claim 1 , wherein a crosslinkable monomer constituting the crosslinkable monomer unit is at least one selected from the group consisting of divinyl benzene and ethylene glycol di(meth)acrylate.

6. The resin composition according to claim 1 , wherein a crosslinkable monomer constituting the crosslinkable monomer unit is an aromatic divinyl compound.

7. The resin composition according to claim 1 , wherein the hollow resin particles have a number average particle diameter of from 1.0 μm to 20.0 μm.

8. The resin composition according to claim 1 , wherein the resin composition comprising more than 80 parts by mass and 95 parts by mass or less of the thermoplastic plastomer and 5 parts by mass or more and less than 20 parts by mass of hollow resin particles.

Assignees

• Zeon Corp

Inventors

• Hirata Takeshi
• Iga Takashi

Classifications

• C08L2205/20

  Hollow spheres · CPC title

• C08L23/12

  Polypropene · CPC title

• C08L2312/00

  Crosslinking · CPC title

• C08F232/06

  having two or more carbon-to-carbon double bonds · CPC title

• C08F120/44

  Acrylonitrile · CPC title