Injection molding machine management system

US12138839B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12138839-B2
Application numberUS-202117522967-A
CountryUS
Kind codeB2
Filing dateNov 10, 2021
Priority dateNov 11, 2020
Publication dateNov 12, 2024
Grant dateNov 12, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided an injection molding machine management system including an injection molding machine configured to mold a molded article with injection molding, a peripheral device configured to perform a post-process of the injection molding, and a control device communicably coupled to the injection molding machine and the peripheral device. The injection molding machine management system includes a generating section configured to generate a common identifier for each of predetermined production units and transmit the common identifier to the peripheral device. Molding data concerning the injection molding and post-process data concerning the post-process are correlated with the common identifier.

First claim

Opening claim text (preview).

What is claimed is: 1. An injection molding machine management system comprising: an injection molding machine including an injection section, a molding section, and a molding processor, the molding processor being programed to: control the injection section and the molding section to perform an injection molding operation to form a first molded article; obtain molding data that is gathered while the first molded article is molded in the injection molding operation; and generate a common identifier relating to the first molded article while the injection molding operation for the first molded article is performed; a peripheral device receiving the first molded article from the injection molding machine, the peripheral device including a peripheral processor, the peripheral processor being programed to: receive the common identifier and the molding data for the first molded article from the injection molding machine; perform a peripheral operation to process the first molded article; and obtain peripheral data that is gathered while the first molded article is processed in the peripheral operation; and a control device communicably connected to the injection molding machine and the peripheral device via a network to control the injection molding machine and the peripheral device, the control device including a control processor, the control processor being programed to: receive the common identifier and the molding data from the injection molding machine and save the common identifier and the molding data in a memory in correlation with each other; receive the common identifier and the peripheral data from the peripheral device and save the common identifier and the peripheral data in the memory in correlation with each other; and specify a cause of a failure of the first molded article based on the common identifier, the molding data, and the peripheral data when the failure of the first molded article occurs, wherein the common identifier includes information corresponding to a shot number for molding the first molded article in the injection molding machine. 2. The injection molding machine management system according to claim 1 , wherein the molding processor is programed to transmit the common identifier to the peripheral device not via the control device. 3. The injection molding machine management system according to claim 1 , wherein the peripheral device is any one of: a taking-out machine configured to take out the first molded article molded by the injection molding machine from the injection molding, machine; a working machine configured to machine the first molded article; and an inspection device configured to inspect the first molded article.

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What does patent US12138839B2 cover?
There is provided an injection molding machine management system including an injection molding machine configured to mold a molded article with injection molding, a peripheral device configured to perform a post-process of the injection molding, and a control device communicably coupled to the injection molding machine and the peripheral device. The injection molding machine management system …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B29C45/7626. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 12 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).