Multi-layered windows for use in chemical-mechanical planarization systems

Patent metadata

Field	Value
Publication number	US-12138735-B2
Application number	US-201916559472-A
Country	US
Kind code	B2
Filing date	Sep 3, 2019
Priority date	Nov 28, 2018
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.

First claim

What is claimed is:

1. A chemical-mechanical planarization (CMP) system, comprising:
a polishing pad having a polishing surface and comprising a first window disposed in the polishing pad, the first window comprising:
a first transparent structural layer having
a first surface and a second surface opposite the first surface; and
a first permanent hydrophilic surfactant layer on at least a portion of each of the first surface and the second surface of the first transparent structural layer; and

a platen supporting the polishing pad, the platen comprising a second window disposed in the platen and arranged beneath the first window, the second window comprising:
a second transparent structural layer having a third surface and a fourth surface opposite the fourth surface; and
a second permanent hydrophilic surfactant layer solely on an outer edge portion of the third surface of the second transparent structural layer proximal to the platen,

wherein each of the first transparent structural layer and the second transparent structural layer comprises a hydrophobic polymer, and
wherein each of the first permanent hydrophilic surfactant layer and the second permanent hydrophilic surfactant layer comprises an organic hydroxy compound, a hydrophilic polymer having a polyethylene chain with a functional group selected from —COOH, —OH, or a combination thereof or a hydrophilic polymer having a polyoxyethylene chain, and has a thickness ranging from 20 μm to 50 μm.

2. The CMP system of claim 1 , wherein the first window further comprises a third permanent hydrophilic surfactant layer on the second surface of the first transparent structural layer.

3. The CMP system of claim 1 , wherein each of the first transparent structural layer and the second transparent structural layer comprises a polyurethane.

4. The CMP system of claim 1 , wherein the second surface of the first transparent structural layer is substantially coplanar with the polishing surface of the polishing pad.

5. A chemical-mechanical planarization (CMP) system, comprising:
a platen comprising a window embedded in the platen and arranged over an endpoint detector, the window comprising:
a transparent structural layer having a first surface and a second surface opposite the first surface; and
a first permanent hydrophilic surfactant layer solely on an outer edge portion of the first surface of the transparent structural layer proximal to the platen and around a portion where the endpoint detector is located,
wherein the transparent structural layer comprises a hydrophobic polymer and the first permanent hydrophilic surfactant layer comprises a hydrophilic polymer having a polyethylene chain with a functional group selected from —COOH, —OH, or a combination thereof; and
a polishing pad on the platen.

6. The CMP system of claim 5 , wherein the window further comprises a second permanent hydrophilic surfactant layer on the second surface of the transparent structural layer.

7. The CMP system of claim 5 , wherein the transparent structural layer is a polyurethane.

8. The CMP system of claim 5 , wherein the second surface of the transparent structural layer is closest to the endpoint detector.

9. The CMP system of claim 5 , wherein the first surface of the transparent structural layer is substantially coplanar with a surface of the platen.

10. The CMP system of claim 5 , wherein the first surface of the transparent structural layer is recessed below a surface of the platen.

11. The CMP system of claim 5 , wherein the polishing pad comprises a pad window embedded in the polishing pad and arranged over the window of the platen.

12. The CMP system of claim 11 , wherein the pad window has a lateral dimension greater than a lateral dimension of the window of the platen.

13. The CMP system of claim 11 , wherein the pad window comprises:
an another transparent structural layer having a third surface and a fourth surface opposite the third surface; and
a third permanent hydrophilic surfactant layer solely an outer edge portion of the third surface of the another transparent structural layer proximal to the polishing pad and around the portion where the endpoint detector is located,
wherein the another transparent structural layer also comprises the hydrophobic polymer and the third permanent hydrophilic surfactant layer comprises the hydrophilic polymer having the polyethylene chain with the functional group selected from —COOH, —OH, or a combination thereof.

14. The CMP system of claim 13 , wherein the pad window further comprises a second permanent hydrophilic surfactant layer on at least a portion of the second surface of the transparent structural layer.

15. The CMP system of claim 5 , wherein the first permanent hydrophilic surfactant layer has a thickness ranging from 20 μm to 50 μm.

16. A method, comprising:
applying a hydrophilic surfactant to a first surface of a transparent structural layer to form a window comprising the transparent structural layer and a first permanent layer of the hydrophilic surfactant on the first surface of the transparent structural layer, the first permanent layer of the hydrophilic surfactant having a thickness ranging from 20 μm to 50 μm, wherein the transparent structural layer comprises a hydrophobic polymer and the hydrophilic surfactant comprises a hydrophilic polymer having a polyethylene chain with a —COOH functional group, a hydroxyl functional group, or a combination thereof or a hydrophilic polymer having a polyoxyethylene chain; and
mounting the window in an opening in each of a platen and a polishing pad of a chemical-mechanical planarization (CMP) system;
wherein a platen window in the platen comprises:
the transparent structural layer having the first surface and a second surface opposite the first surface; and
the first permanent hydrophilic surfactant layer solely an outer edge portion of the first surface of the transparent structural layer proximal to the platen.

17. The method of claim 16 , wherein applying the hydrophilic surfactant comprises brushing the hydrophilic surfactant on the first surface of the transparent structural layer.

18. The method of claim 16 , wherein applying the hydrophilic surfactant comprises spraying the hydrophilic surfactant on the first surface of the transparent structural layer.

19. The method of claim 16 , further comprising applying the hydrophilic surfactant to a second surface of the transparent structural layer to form a second permanent layer of the hydrophilic surfactant on the second surface of the transparent structural layer, the second surface being opposite the first surface of the transparent structural layer.

20. The method of claim 16 , further comprising forming the opening.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Shih-Chung
• Lin Yi-Shao
• Peng Sheng-Tai
• Sheuh Ya-Jen
• Chen Hung-Lin
• Lee Ren-Dou

Classifications

• B24B37/013

  Devices or means for detecting lapping completion · CPC title

• C09G1/02

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• B24B37/044 Primary

  characterised by the composition of the lapping agent · CPC title

• B24B37/205 Primary

  provided with a window for inspecting the surface of the work being lapped · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title