Polishing system apparatus and methods for defect reduction at a substrate edge

Patent metadata

Field	Value
Publication number	US-12138732-B2
Application number	US-202017121467-A
Country	US
Kind code	B2
Filing date	Dec 14, 2020
Priority date	Dec 14, 2020
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. By removing such contaminates, e.g., loosely adhered particles of dielectric material, from the bevel edge, contamination of the polishing interface can be avoided thus preventing and/or substantially reducing scratch related defectivity associated therewith.

First claim

The invention claimed is:

1. A polishing system, comprising:
a carrier loading station comprising:
one or more support surfaces for supporting a to-be-polished substrate, wherein the one or more support surfaces are sized and located to engage with radially outermost portions of an active surface of the to-be-polished substrate;
a load cup;
a carrier head comprising a substrate backing assembly and an annular retaining ring surrounding the substrate backing assembly; and
a fluid delivery assembly directly fixed to the load cup, the fluid delivery assembly comprising one or more first nozzles configured to spray energized fluids in a fan shaped spray pattern having a flat portion directed towards an annular gap formed between the substrate backing assembly and the annular retaining ring when the carrier head is disposed over the carrier loading station and is aligned therewith,
wherein the flat portion of the fan shaped spray pattern is tangential to a peripheral edge of the to-be-polished substrate when the to-be-polished substrate is vacuum chucked to the carrier head positioned over the carrier loading station and aligned therewith,
wherein the energized fluids comprise acoustically energized fluid, liquid mixed with a pressured gas, thermally energized fluid, or a combination thereof.

2. The polishing system of claim 1 , wherein the one or more first nozzles are disposed proximate to the one or more support surfaces when the carrier loading station is viewed from top down.

3. The polishing system of claim 1 , wherein the one or more first nozzles are atomizer nozzles.

4. The polishing system of claim 1 , wherein the one or more first nozzles are positioned so that the flat portion of the fan shaped spray pattern is within 20° of orthogonal to the active surface of the to-be-polished substrate.

5. The polishing system of claim 1 , wherein the one or more first nozzles are fluidly coupled to a first fluid source configured to deliver the energized fluids to the one or more first nozzles.

6. The polishing system of claim 1 , further comprising a non-transitory computer readable medium having instructions stored thereon for performing a method of processing a substrate when executed by a processor, the method comprising:
transferring the substrate from the carrier loading station to the carrier head, wherein the carrier head is positioned over the carrier loading station and is aligned therewith;
rotating the carrier head and the substrate about a carrier axis;
using the one or more first nozzles to direct the energized fluid towards the peripheral edge of the substrate as the carrier head rotates the substrate about the carrier axis;
moving the carrier head to a polishing station of the polishing system; and
urging the substrate against a polishing pad.

7. The polishing system of claim 6 , wherein transferring the substrate to the carrier head comprises:
positioning the carrier head over the carrier loading station, wherein the substrate is disposed on the one or more support surfaces of the carrier loading station;
moving one or both of the carrier loading station and the carrier head towards one another;
aligning the carrier head and the carrier loading station using one or more carrier alignment features extending upwardly from the carrier loading station; and
vacuum chucking the substrate to the carrier head using the substrate backing assembly.

8. The polishing system of claim 6 , wherein the one or more first nozzles are spaced apart from the substrate by a distance of 20 cm or less as the energized fluid is directed towards the peripheral edge thereof.

9. The polishing system of claim 6 , wherein the fluid delivery assembly further comprises one or more second nozzles fluidly coupled to a second fluid source, wherein the one or more second nozzles are positioned to direct a rinsing fluid from the second fluid source towards the peripheral edge of the substrate as the carrier head rotates about the carrier axis.

10. The polishing system of claim 6 , wherein the substrate backing assembly is surrounded by the annular retaining ring, and a surface of the vacuum chucked substrate protrudes outwardly from the annular retaining ring as the energized fluid from the one or more first nozzles is directed towards the peripheral edge of the substrate.

11. A method of processing a substrate, comprising:
transferring a substrate from a carrier loading station of a polishing system to a carrier head positioned over the carrier loading station and aligned therewith;
rotating the carrier head and the substrate about a carrier axis;
using one or more first nozzles directly fixed to the carrier loading station to spray an energized fluid in a fan shaped spray pattern having a flat portion directed towards an annular gap formed between a substrate backing assembly and an annular retaining ring when the carrier head is disposed over the carrier loading station and is aligned therewith, the flat portion of the fan shaped spray pattern being tangential to a peripheral edge of the substrate as the carrier head rotates the substrate about the carrier axis, wherein the energized fluid comprises acoustically energized fluid, liquid mixed with a pressured gas, thermally energized fluid, or a combination thereof;
moving the carrier head to a polishing station of the polishing system; and
urging the substrate against a polishing pad.

12. The method of claim 11 , wherein transferring the substrate to the carrier head comprises:
positioning the carrier head over the carrier loading station, wherein the substrate is disposed on a surface of the carrier loading station;
moving one or both of the carrier loading station and the carrier head towards one another;
aligning the carrier head and the carrier loading station using one or more carrier alignment features extending upwardly from the carrier loading station; and
vacuum chucking the substrate to the carrier head using a substrate backing assembly.

13. The method of claim 12 , wherein the one or more first nozzles are spaced apart from the substrate by a distance of 20 cm or less as the energized fluid is directed towards the peripheral edge thereof.

14. The method of claim 11 , further comprising using one or more second nozzles of the carrier loading station to direct a rinsing fluid at the peripheral edge of the substrate as the carrier head rotates about the carrier axis.

15. The method of claim 11 , wherein the energized fluid from the one or more first nozzles is acoustically energized, pneumatically energized, thermally energized, or a combination thereof.

16. The method of claim 15 , wherein the one or more first nozzles are atomizer nozzles.

17. The method of claim 12 , wherein the substrate backing assembly is surrounded by the retaining ring, and a surface of the vacuum chucked substrate protrudes outwardly from the retaining ring as the energized fluid from the one or more first nozzles is directed towards the peripheral edge of the substrate.

Assignees

• Applied Materials Inc

Inventors

• Jain Asheesh
• Deshpande Sameer

Classifications

• H10W20/092

  by smoothing the dielectric parts · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B41/061

  axially supporting turning workpieces, e.g. magnetically, pneumatically · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title

• B24B37/32

  Retaining rings · CPC title