Arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece

US12138707B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12138707-B2
Application numberUS-202217695448-A
CountryUS
Kind codeB2
Filing dateMar 15, 2022
Priority dateMar 16, 2021
Publication dateNov 12, 2024
Grant dateNov 12, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the workpiece position.

First claim

Opening claim text (preview).

What is claimed is: 1. An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece, comprising: a protective chamber having a workpiece position at which at least a portion of the workpiece is arranged; an acceleration device shooting the electrically conductive contact element into the workpiece arranged at the workpiece position; and a projectile, the electrically conductive contact element forms at least a sub-portion of the projectile. 2. The arrangement of claim 1 , wherein the projectile has a cylindrical shape. 3. The arrangement of claim 1 , wherein the projectile has a central body with a cutting portion cutting free at least a portion of the workpiece. 4. The arrangement of claim 3 , wherein the projectile has a supporting portion supporting the electrically conductive contact element. 5. The arrangement of claim 1 , further comprising a heating element configured to heat the electrically conductive contact element before or during acceleration by the acceleration device. 6. The arrangement of claim 1 , wherein the protective chamber has a negative pressure relative to a normal pressure outside the protective chamber. 7. A method for making a diffusion solder connection between an electrically conductive contact element and a workpiece, comprising: providing a protection chamber having a workpiece position at which at least a portion of the workpiece is arranged; and shooting the electrically conductive contact element into the workpiece arranged at the workpiece position with an acceleration device, the electrically conductive contact element is mechanically and electrically conductively connected to the workpiece by the shooting, the electrically conductive contact element forms at least a sub-portion of a projectile. 8. The method of claim 7 , wherein the electrically conductive contact element is shot into the workpiece as the projectile. 9. The method of claim 8 , wherein the electrically conductive contact element remains in the workpiece and a remaining portion of the projectile detaches from the workpiece. 10. The method of claim 8 , wherein the projectile cuts a portion of the workpiece free during movement through the workpiece. 11. The method of claim 10 , wherein the electrically conductive contact element forms a diffusion solder connection with the portion of the workpiece that was cut free. 12. The method of claim 7 , further comprising generating a bore extending through the workpiece. 13. The method of claim 12 , wherein the electrically conductive contact element is shot into the bore after the bore is generated. 14. The method of claim 13 , wherein the electrically conductive contact element and/or the projectile have a diameter larger than an inner diameter of the bore. 15. The method of claim 7 , further comprising heating the electrically conductive contact element before shooting the electrically conductive contact element into the workpiece. 16. An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece, comprising: a protective chamber having a workpiece position at which at least a portion of the workpiece is arranged; an acceleration device shooting the electrically conductive contact element into the workpiece arranged at the workpiece position; and a heating element configured to heat the electrically conductive contact element before or during acceleration by the acceleration device.

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What does patent US12138707B2 cover?
An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the …
Who is the assignee on this patent?
Te Connectivity Germany Gmbh
What technology area does this patent fall under?
Primary CPC classification B23K20/026. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 12 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).