Tetragonal half metallic half-Heusler compounds

Patent metadata

Field	Value
Publication number	US-12136447-B2
Application number	US-202217710399-A
Country	US
Kind code	B2
Filing date	Mar 31, 2022
Priority date	Mar 31, 2022
Publication date	Nov 5, 2024
Grant date	Nov 5, 2024

Abstract

A magnetoresistive random-access memory cell includes a templating layer. The templating layer includes a binary alloy having an alternating layer lattice structure. The cell further includes a half metallic half-Heusler layer including a half metallic half-Heusler material having a tetragonal lattice structure. The half metallic half-Heusler layer is located outward of the templating layer, and has a half-Heusler in-plane lattice constant that is different from an in-plane lattice constant in a cubic form of the half metallic half-Heusler material. A tunnel barrier is located outward of the half metallic half-Heusler layer, and a magnetic layer is located outward of the tunnel barrier.

First claim

What is claimed is:

1. A magnetoresistive random-access memory cell, comprising:
a templating layer comprising a binary alloy having an alternating layer lattice structure;
a half metallic half-Heusler layer comprising a half metallic half-Heusler material having a tetragonal lattice structure, the half metallic half-Heusler layer being located outward of the templating layer, and having a half-Heusler in-plane lattice constant that is different from an in-plane lattice constant in a cubic form of the half metallic half-Heusler material;
a tunnel barrier outward of the half metallic half-Heusler layer; and
a magnetic layer outward of the tunnel barrier.

2. The magnetoresistive random-access memory cell of claim 1 , wherein:
the half metallic half-Heusler layer comprises a storage layer; and
the magnetic layer comprises a reference layer.

3. The magnetoresistive random-access memory cell of claim 2 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, NiVSn, NaCsP, LiCaGe, LiSrGe, NaCaGe, KCaGe, RbTaGe, KCrTe, NaCaSn, KTaSn, KCaSn, RbNbSi, RbTaSi, NaCsAs, CsRbAs, CsBaC, CsSrC, CsRbN, RhFeGe, CoCrGe, RuCrAs, CoCrAs, and CsSrSn.

4. The magnetoresistive random-access memory cell of claim 3 , wherein the half metallic half-Heusler layer has a thickness of less than 5 nm.

5. The magnetoresistive random-access memory cell of claim 3 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, CoCrGe, NiVSn, CoCrAs, RhFeGe, or RuCrAs.

6. The magnetoresistive random-access memory cell of claim 5 , wherein the half metallic half-Heusler layer has a thickness of less than 5 nm.

7. The magnetoresistive random-access memory cell of claim 2 , wherein the tunnel barrier is selected from the group consisting of magnesium oxide and magnesium aluminum oxide.

8. The magnetoresistive random-access memory cell of claim 2 , wherein the binary alloy is represented by A 1−x E x , wherein A is a transition metal element and E is a main group element including at least one of aluminum and gallium, and x is in the range from 0.42 to 0.55.

9. The magnetoresistive random-access memory cell of claim 1 , wherein:
the half metallic half-Heusler layer comprises a reference layer; and
the magnetic layer comprises a storage layer.

10. The magnetoresistive random-access memory cell of claim 9 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, NiVSn, NaCsP, LiCaGe, LiSrGe, NaCaGe, KCaGe, RbTaGe, KCrTe, NaCaSn, KTaSn, KCaSn, RbNbSi, RbTaSi, NaCsAs, CsRbAs, CsBaC, CsSrC, CsRbN, RhFeGe, CoCrGe, RuCrAs, CoCrAs, CsSrSn.

11. The magnetoresistive random-access memory cell of claim 10 , wherein the half metallic half-Heusler layer has a thickness of less than 5 nm.

12. The magnetoresistive random-access memory cell of claim 10 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, CoCrGe, NiVSn CoCrAs, RhFeGe, or RuCrAs.

13. The magnetoresistive random-access memory cell of claim 12 , wherein the half metallic half-Heusler layer has a thickness of less than 5 nm.

14. The magnetoresistive random-access memory cell of claim 1 , wherein the alternating layer lattice structure of the templating layer comprises a cesium chloride structure.

15. The magnetoresistive random-access memory cell of claim 1 , wherein the templating layer is nonmagnetic at room temperature.

16. The magnetoresistive random-access memory cell of claim 1 , wherein:
the templating layer has a templating layer in-plane lattice constant; and
the half-Heusler in-plane lattice constant substantially matches the templating layer in-plane lattice constant.

17. The magnetoresistive random-access memory cell of claim 16 , wherein the half metallic half-Heusler material has magnetization substantially perpendicular to the half metallic half-Heusler material.

18. A magnetoresistive random-access memory array, comprising:
a plurality of bit lines and a plurality of complementary bit lines forming a plurality of bit line-complementary bit line pairs;
a plurality of word lines intersecting said plurality of bit line pairs at a plurality of cell locations;
a plurality of magnetoresistive random-access memory cells located at each of said plurality of cell locations, each of said magnetoresistive random-access memory cells being electrically connected to a corresponding bit line and selectively interconnected to a corresponding one of said complementary bit lines under control of a corresponding one of said word lines, each of said plurality of magnetoresistive random-access memory cells comprising:
a templating layer comprising a binary alloy having an alternating layer lattice structure;
a half metallic half-Heusler layer comprising a half metallic half-Heusler material having a tetragonal lattice structure, the half metallic half-Heusler layer being located outward of the templating layer, and having a half-Heusler in-plane lattice constant that is different from an in-plane lattice constant in a cubic form of the half metallic half-Heusler material;
a tunnel barrier outward of the half metallic half-Heusler layer; and
a magnetic layer outward of the tunnel barrier.

19. The magnetoresistive random-access memory array of claim 18 , wherein:
the half metallic half-Heusler layer comprises a storage layer; and
the magnetic layer comprises a reference layer.

20. The magnetoresistive random-access memory array of claim 19 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, NiVSn, NaCsP, LiCaGe, LiSrGe, NaCaGe, KCaGe, RbTaGe, KCrTe, NaCaSn, KTaSn, KCaSn, RbNbSi, RbTaSi, NaCsAs, CsRbAs, CsBaC, CsSrC, CsRbN, RhFeGe, CoCrGe, RuCrAs, CoCrAs, and CsSrSn.

21. The magnetoresistive random-access memory array of claim 18 , wherein:
the half metallic half-Heusler layer comprises a reference layer; and
the magnetic layer comprises a storage layer.

22. The magnetoresistive random-access memory array of claim 21 , wherein the half metallic half-Heusler compound is selected from the group consisting of RhCrGe, RhFeSn, NiVSn, NaCsP, LiCaGe, LiSrGe, NaCaGe, KCaGe, RbTaGe, KCrTe, NaCaSn, KTaSn, KCaSn, RbNbSi, RbTaSi, NaCsAs, CsRbAs, CsBaC, CsSrC, CsRbN, RhFeGe, CoCrGe, RuCrAs, CoCrAs, and CsSrSn.

23. A method of operating a magnetoresistive random-access memory array, comprising:
providing a magnetoresistive random-access memory array, said array comprising:
a plurality of bit lines and a plurality of complementary bit lines forming a plurality of bit line-complementary bit line pairs;
a plurality of word lines intersecting said plurality of bit line pairs at a plurality of cell locations;
a plurality of magnetoresistive random-access memory cells located at each of said plurality of cell locations, each of said magnetoresistive random-access memory cells being electrically connected to a corresponding bit line and selectively interconnected to a corresponding one of said complementary bit lines under control of a corresponding one of said word lines, each of said plurality of magnetoresistive random-access memory cells comprising:
a templating layer comprising a binary alloy having an alternating layer lattice structure;
a half metallic half-Heusler layer comprising a half metallic half-Heusler material having a tetragonal lattice structure, the half metallic half-Heusler layer be

Assignees

• IBM
• Samsung Electronics Co Ltd

Inventors

• Faleev Sergey
• Filippou Panagiotis Charilaos
• Ferrante Yari
• Garg Chirag
• Samant Mahesh
• Jeong Jaewoo

Classifications

• H01F10/3268

  the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn · CPC title

• H01F10/1936

  Half-metallic, e.g. epitaxial CrO2 or NiMnSb films · CPC title

• H10B61/20

  comprising components having three or more electrodes, e.g. transistors · CPC title

• H10N50/01

  Manufacture or treatment · CPC title

• G11C11/1657

  Word-line or row circuits · CPC title