Systems and methods for using additive manufacturing for thermal management
US-2020281095-A1 · Sep 3, 2020 · US
US12135152B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12135152-B2 |
| Application number | US-202117518321-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 3, 2021 |
| Priority date | Nov 3, 2021 |
| Publication date | Nov 5, 2024 |
| Grant date | Nov 5, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.
Opening claim text (preview).
The invention claimed is: 1. An evaporator assembly for a vapor chamber, the evaporator assembly comprising: an evaporator surface opposite a heat receiving surface; an array of posts extending from the evaporator surface; an array of vapor vents within the evaporator surface, wherein each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface; and a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents. 2. The evaporator assembly of claim 1 , wherein the array of posts is interlaced within the array of vapor vents. 3. The evaporator assembly of claim 1 , wherein a spacing between adjacent posts of the array of posts vary on the evaporator surface; and a spacing between adjacent vapor vents of the array of vapor vents vary on the evaporator surface. 4. The evaporator assembly of claim 1 , wherein at least one of a size and a shape of individual vapor vents of the array of vapor vents varies across the evaporator surface. 5. The evaporator assembly of claim 1 , wherein a thickness of the porous layer is between 0.20 mm and 1 mm, including endpoints. 6. The evaporator assembly of claim 1 , wherein a depth of individual vapor vents varies across the evaporator surface. 7. The evaporator assembly of claim 1 , wherein the array of posts and the array of vapor vents define a structure array, wherein each row of the structure array comprises alternating individual posts and individual vents. 8. An assembly comprising: an evaporator assembly comprising: an evaporator surface opposite a heat receiving surface; an array of posts extending from the evaporator surface; an array of vapor vents within the evaporator surface, wherein each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface; and a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents; and a condenser plate comprising a condenser surface, wherein the condenser surface is bonded to a top surface of the array of posts such that the evaporator assembly and the condenser plate define a vapor chamber. 9. The assembly of claim 8 , wherein the assembly further comprises an electronic device coupled to the heat receiving surface. 10. The assembly of claim 9 , wherein: the condenser surface is provided on a condenser plate further comprising a cooling surface; and the assembly further comprises a heat sink coupled to the cooling surface. 11. The assembly of claim 8 , wherein the array of posts is interlaced within the array of vapor vents. 12. The assembly of claim 8 , wherein a spacing between adjacent posts of the array of posts vary on the evaporator surface; and a spacing between adjacent vapor vents of the array of vapor vents vary on the evaporator surface. 13. The assembly of claim 8 , wherein at least one of a size and a shape of individual vapor vents of the array of vapor vents varies across the evaporator surface. 14. The assembly of claim 8 , wherein a thickness of the porous layer is between 0.20 mm and 1 mm, including endpoints. 15. The assembly of claim 8 , wherein a depth of individual vapor vents varies across the evaporator surface. 16. The assembly of claim 8 , wherein the array of posts and the array of vapor vents define a structure array, wherein each row of the structure array comprises alternating individual posts and individual vents. 17. The evaporator assembly of claim 1 , wherein: the array of posts extend from the evaporator surface in a positive z-axis direction; and the array of vapor vents extend within the evaporator surface in a negative z-axis direction. 18. The assembly of claim 1 , wherein: the array of posts extend from the evaporator surface in a positive z-axis direction; and the array of vapor vents extend within the evaporator surface in a negative z-axis direction.
for cooling by change of state · CPC title
heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title
Products made by additive manufacturing · CPC title
especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title
by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.