Evaporator assemblies, vapor chambers, and methods for fabricating vapor chambers

US12135152B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12135152-B2
Application numberUS-202117518321-A
CountryUS
Kind codeB2
Filing dateNov 3, 2021
Priority dateNov 3, 2021
Publication dateNov 5, 2024
Grant dateNov 5, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.

First claim

Opening claim text (preview).

The invention claimed is: 1. An evaporator assembly for a vapor chamber, the evaporator assembly comprising: an evaporator surface opposite a heat receiving surface; an array of posts extending from the evaporator surface; an array of vapor vents within the evaporator surface, wherein each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface; and a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents. 2. The evaporator assembly of claim 1 , wherein the array of posts is interlaced within the array of vapor vents. 3. The evaporator assembly of claim 1 , wherein a spacing between adjacent posts of the array of posts vary on the evaporator surface; and a spacing between adjacent vapor vents of the array of vapor vents vary on the evaporator surface. 4. The evaporator assembly of claim 1 , wherein at least one of a size and a shape of individual vapor vents of the array of vapor vents varies across the evaporator surface. 5. The evaporator assembly of claim 1 , wherein a thickness of the porous layer is between 0.20 mm and 1 mm, including endpoints. 6. The evaporator assembly of claim 1 , wherein a depth of individual vapor vents varies across the evaporator surface. 7. The evaporator assembly of claim 1 , wherein the array of posts and the array of vapor vents define a structure array, wherein each row of the structure array comprises alternating individual posts and individual vents. 8. An assembly comprising: an evaporator assembly comprising: an evaporator surface opposite a heat receiving surface; an array of posts extending from the evaporator surface; an array of vapor vents within the evaporator surface, wherein each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface; and a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents; and a condenser plate comprising a condenser surface, wherein the condenser surface is bonded to a top surface of the array of posts such that the evaporator assembly and the condenser plate define a vapor chamber. 9. The assembly of claim 8 , wherein the assembly further comprises an electronic device coupled to the heat receiving surface. 10. The assembly of claim 9 , wherein: the condenser surface is provided on a condenser plate further comprising a cooling surface; and the assembly further comprises a heat sink coupled to the cooling surface. 11. The assembly of claim 8 , wherein the array of posts is interlaced within the array of vapor vents. 12. The assembly of claim 8 , wherein a spacing between adjacent posts of the array of posts vary on the evaporator surface; and a spacing between adjacent vapor vents of the array of vapor vents vary on the evaporator surface. 13. The assembly of claim 8 , wherein at least one of a size and a shape of individual vapor vents of the array of vapor vents varies across the evaporator surface. 14. The assembly of claim 8 , wherein a thickness of the porous layer is between 0.20 mm and 1 mm, including endpoints. 15. The assembly of claim 8 , wherein a depth of individual vapor vents varies across the evaporator surface. 16. The assembly of claim 8 , wherein the array of posts and the array of vapor vents define a structure array, wherein each row of the structure array comprises alternating individual posts and individual vents. 17. The evaporator assembly of claim 1 , wherein: the array of posts extend from the evaporator surface in a positive z-axis direction; and the array of vapor vents extend within the evaporator surface in a negative z-axis direction. 18. The assembly of claim 1 , wherein: the array of posts extend from the evaporator surface in a positive z-axis direction; and the array of vapor vents extend within the evaporator surface in a negative z-axis direction.

Assignees

Inventors

Classifications

  • for cooling by change of state · CPC title

  • heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

  • Products made by additive manufacturing · CPC title

  • especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title

  • by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

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What does patent US12135152B2 cover?
Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression withi…
Who is the assignee on this patent?
Toyota Eng & Mfg North America
What technology area does this patent fall under?
Primary CPC classification F25B39/024. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).