Multilayer encapsulation thin-film

US12134821B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12134821-B2
Application numberUS-202117491554-A
CountryUS
Kind codeB2
Filing dateOct 1, 2021
Priority dateApr 30, 2013
Publication dateNov 5, 2024
Grant dateNov 5, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer encapsulation thin-film and a method and apparatus for preparing a multilayer encapsulation thin-film are provided. The multilayer encapsulation thin-film includes an inorganic thin film that includes a metal oxide, and an organic thin film that includes a polymer and is formed on the inorganic thin film, where the inorganic thin film and the organic thin film are alternately stacked in multiple layers.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of preparing a multilayer encapsulation thin-film, the method comprising: forming an inorganic thin film comprising a metal oxide on a substrate; and forming an organic thin film comprising a polymer on the inorganic thin film using an organic thin film deposition unit comprising a monomer injection unit and UV-curing units, wherein the forming of the inorganic thin film and the forming of the organic thin film are alternately carried out, so that separate inorganic thin film and organic thin film are alternately stacked on top of each other, wherein the forming of each organic thin film in the alternate stack comprises: coating an acrylic monomer on each inorganic thin film; and UV-curing the coated acrylic monomer using a first UV-curing unit when the substrate is moving in one direction and a second UV-curing unit when the substrate is moving in the opposite direction, and wherein the first and second UV-curing units are disposed one adjacent each side of both sides of the monomer injection unit. 2. The method of claim 1 , wherein the forming of each inorganic thin film in the alternate stack is carried out by an atomic layer deposition (ALD) module, and wherein the organic thin film deposition unit is disposed between two ALD modules to alternately form the inorganic thin film and the organic thin film on top of each other while reciprocating the substrate. 3. The method of claim 1 , wherein the inorganic thin film comprises an aluminum oxide thin film. 4. The method of claim 1 , wherein the metal oxide comprises a member selected from the group consisting of aluminum oxide, zirconium oxide, zinc oxide, and combinations thereof. 5. The method claim 1 , wherein the forming of the inorganic thin film and/or the forming of the organic thin film are carried out at a temperature in a range of about 20° C. to about 120° C. 6. The method of claim 1 , wherein the forming of each inorganic thin film in the alternate stack is carried out by a spatial atomic layer deposition comprising spatially arranging raw materials for the inorganic thin film on a moving substrate. 7. A method of preparing a multilayer encapsulation thin-film, the method comprising: forming an inorganic thin film on a substrate using a spatial atomic layer deposition (spatial ALD) module comprising spatially arranging raw materials for the inorganic thin film on the substrate; and forming an organic thin film on the inorganic thin film using an organic thin film deposition unit comprising a monomer injection unit and UV-curing units, wherein the forming of the inorganic thin film and the forming of the organic thin film are alternately carried out, so that separate inorganic thin film and organic thin film are alternately stacked on top of each other, wherein the forming of each organic thin film in the alternate stack comprises: coating an acrylic monomer on each inorganic thin film; and UV-curing the coated acrylic monomer using a first UV-curing unit when the substrate is moving in one direction and a second UV-curing unit when the substrate is moving in the opposite direction, and wherein the first and second UV-curing units are disposed one adjacent each side of both sides of the monomer injection unit.

Assignees

Inventors

Classifications

  • C23C16/44Primary

    characterised by the method of coating (C23C16/04 takes precedence) · CPC title

  • C23C28/00Primary

    Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D · CPC title

  • characterized by the composition of the alternating layers · CPC title

  • multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

  • H10K30/88Primary

    Passivation; Containers; Encapsulations · CPC title

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What does patent US12134821B2 cover?
A multilayer encapsulation thin-film and a method and apparatus for preparing a multilayer encapsulation thin-film are provided. The multilayer encapsulation thin-film includes an inorganic thin film that includes a metal oxide, and an organic thin film that includes a polymer and is formed on the inorganic thin film, where the inorganic thin film and the organic thin film are alternately stack…
Who is the assignee on this patent?
Research & Business Found Sungkyunkwan Univ, Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C16/44. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).