Polyester resin for heat-shrinkable film, heat-shrinkable film, heat-shrinkable label, and packaged product

US12134679B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12134679-B2
Application numberUS-201917276120-A
CountryUS
Kind codeB2
Filing dateSep 25, 2019
Priority dateOct 16, 2018
Publication dateNov 5, 2024
Grant dateNov 5, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides a polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mole of neopentyl glycol and from 7 to 15% by mole of diethylene glycol when a total amount of the whole diol component in total polyester resin components is taken as 100% by mole. The polyester resin has (i) an intrinsic viscosity (IV) of not less than 0.65 and less than 0.70 dl/g, (ii) a carboxyl end group concentration (AV) of 8-25 eq/t, (iii) a color b value of 1.0-8.0 in an L*a*b* color system, and (iv) aluminum and phosphorus atoms, wherein the aluminum atoms are present in an amount of 15-40 ppm, and wherein the molar ratio of the phosphorus atoms to the aluminum atoms is 1.8-2.6.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mole of neopentyl glycol and from 8 to 15% by mole of diethylene glycol when a total amount of the whole diol component in total polyester resin components is taken as 100% by mole, characterized in that the polyester resin satisfies the following requirements (i) to (iv): (i) the polyester resin has an intrinsic viscosity (IV) of not less than 0.65 and less than 0.70 dL/g; (ii) the polyester resin has a carboxyl end group concentration (AV) of from 8 to 25 eq/t; (iii) the polyester resin has a color b value of from 1.0 to 8.0 in an L*a*b* color system; and (iv) the polyester resin contains aluminum atom and phosphorus atom, wherein an amount of the aluminum atom in the polyester resin is 15 to 40 ppm and wherein a molar ratio of the phosphorus atom to the aluminum atom in the polyester resin is 1.8 to 2.6. 2. A heat-shrinkable film comprising the polyester resin for heat-shrinkable film of claim 1 . 3. A heat-shrinkable label comprising the heat-shrinkable film of claim 2 . 4. A packaged product which has been formed by coating the heat-shrinkable label of claim 3 at least on a part of an outer periphery of a target to be packaged followed by a heat-shrinking treatment.

Assignees

Inventors

Classifications

  • to be fastened or secured by the material of the label itself, e.g. by thermo-adhesion (by a separate adhesive layer G09F3/10) · CPC title

  • Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time · CPC title

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

  • Manufacture of films or sheets · CPC title

  • Labels, badges, e.g. marker sleeves · CPC title

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What does patent US12134679B2 cover?
The invention provides a polyester resin for heat-shrinkable film which contains terephthalic acid as a main component of a dicarboxylic acid component, contains ethylene glycol as a main component of a diol component, and contains from 18 to 32% by mole of neopentyl glycol and from 7 to 15% by mole of diethylene glycol when a total amount of the whole diol component in total polyester resin co…
Who is the assignee on this patent?
Toyo Boseki
What technology area does this patent fall under?
Primary CPC classification C08G63/183. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).