Heat dissipation apparatus and methods for UV-LED photoreactors

Patent metadata

Field	Value
Publication number	US-12134572-B2
Application number	US-202318317660-A
Country	US
Kind code	B2
Filing date	May 15, 2023
Priority date	Jan 19, 2016
Publication date	Nov 5, 2024
Grant date	Nov 5, 2024

Abstract

A UV reactor irradiates a flow of fluid with UV radiation. The reactor comprises: a fluid conduit defined by a heat conducting conduit body comprising one or more heat conducting walls for permitting a flow of fluid therethrough; a UV-LED operatively connected to a PCB and oriented for directing radiation into the fluid conduit. The PCB comprises a heat conducting substrate having a first surface. The conduit body is in thermal contact with the first surface of the heat conducting substrate. Heat is dissipated from the UV-LED via the heat conducting substrate, the thermal contact between the first surface of the heat conducting substrate and the heat conducting conduit body, and from the one or more heat conducting walls of the heat conducting conduit body to the fluid flowing through the fluid conduit.

First claim

What is claimed is:

1. An ultraviolet (UV) reactor for irradiating a flow of fluid with UV radiation, the reactor comprising:
a plurality of channels;
a printed circuit board (PCB) comprising a heat conducting substrate having a first side and a second side opposite the first side; and
a UV light emitting diode (UV-LED) operatively connected to the PCB on the first side of the heat conducting substrate, the UV-LED oriented for directing radiation into a first channel of the plurality of channels on the first side of the heat conducting substrate;
wherein the second side of the heat conducting substrate of the PCB faces a second channel of the plurality of channels on the second side of the heat conducting substrate.

2. The UV reactor of claim 1 further comprising an inlet and an outlet, wherein each channel of the plurality of channels is in fluid communication with the inlet and with the outlet.

3. The UV reactor of claim 1 further comprising a fluid conduit comprising an inlet, and outlet, and the first channel, wherein the first channel is in fluid communication with the inlet and with the outlet.

4. The UV reactor of claim 3 wherein:
the fluid conduit further comprises the second channel; and
the second channel is in fluid communication with the inlet and with the outlet.

5. The UV reactor of claim 4 wherein the first and second channels are in fluid communication with the inlet and with the outlet such that, when the fluid flows from the inlet to the outlet, the fluid flows through the first and second channels in parallel.

6. The UV reactor of claim 4 wherein the first and second channels are in fluid communication with the inlet and with the outlet such that, when the fluid flows from the inlet to the outlet, the fluid flows through the first and second channels in series.

7. The UV reactor of claim 3 wherein the fluid conduit comprises thermally conductive material thermally coupled to a thermal contact region of the heat conducting substrate of the PCB.

8. The UV reactor of claim 7 wherein:
the heat conducting substrate of the PCB has a first surface comprising a circuit region;
the UV reactor further comprises a solder mask coating on the circuit region of the first surface of the heat conducting substrate; and
the thermal contact region of the heat conducting substrate is devoid of the solder mask coating.

9. The UV reactor of claim 8 wherein the thermal contact region is on the first surface of the heat conducting substrate.

10. The UV reactor of claim 8 wherein the first surface of the heat conducting substrate is generally planar.

11. The UV reactor of claim 8 wherein the circuit region is adjacent to the thermal contact region.

12. The UV reactor of claim 7 wherein:
the PCB comprises a solder mask coating on the first side of the heat conducting substrate; and
the thermal contact region is on the first side of the heat conducting substrate and devoid of the solder mask coating.

13. The UV reactor of claim 7 wherein:
the PCB comprises a solder mask coating on the second side of the heat conducting substrate; and
the thermal contact region is on the second side of the heat conducting substrate and devoid of the solder mask coating.

14. The UV reactor of claim 7 wherein the thermally conductive material is in walls of the fluid conduit.

15. The UV reactor of claim 3 wherein the fluid conduit is defined by a heat conducting conduit body.

16. The UV reactor of claim 3 wherein the fluid conduit comprises at least one thermally conductive material and at least one non-thermally-conductive material.

17. The UV reactor of claim 3 wherein the fluid conduit is made of a thermally conductive material.

18. The UV reactor of claim 1 wherein the UV-LED is positioned such that radiation from the UV-LED is generally orthogonal to a longitudinal extension of the first channel.

19. The UV reactor of claim 1 wherein a thermal contact region of the heat conducting substrate of the PCB is on the second side of the heat conducting substrate of the PCB.

20. The UV reactor of claim 19 wherein:
the PCB comprises a solder mask coating on the second side of the heat conducting substrate; and
the thermal contact region is on the second side of the heat conducting substrate and devoid of the solder mask coating.

Assignees

• Univ British Columbia

Inventors

• Taghipour Fariborz

Classifications

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K1/181

  associated with surface mounted components · CPC title