Bonding member, method for producing bonding member and method for producing bonding structure

Patent metadata

Field	Value
Publication number	US-12134146-B2
Application number	US-202217812352-A
Country	US
Kind code	B2
Filing date	Jul 13, 2022
Priority date	Feb 23, 2017
Publication date	Nov 5, 2024
Grant date	Nov 5, 2024

Abstract

A bonding member ( 10 ) includes surface-processed silver surfaces ( 11 a, 11 b ).

First claim

The invention claimed is:

1. A method for producing a bonding member used for bonding a first bonding target and a second bonding target together through heating, the bonding member having a surface-processed silver surface, the method comprising:
preparing a silver layer that is porous; and
processing a surface of the silver layer so as to supply the surface of the silver layer with a compressive stress, wherein
the bonding member has a thickness of 50 μm or greater and 300 μm or less.

2. The method for producing the bonding member of claim 1 , wherein
in the processing of the surface of the silver layer, the surface of the silver layer is processed such that the number of grain boundaries, between silver grains, at the surface of the silver layer is larger than that in a pre-processing state.

3. The method for producing the bonding member of claim 1 , wherein
the surface-processed silver surface has a residual stress of a negative value due to supply of the compressive stress.

4. The method for producing the bonding member of claim 3 , wherein
in the processing of the surface of the silver layer, the surface of the silver layer is processed such that the number of the pores at the surface of the silver layer is smaller than that in a pre-processing state.

5. The method for producing the bonding member of claim 1 , wherein
in the preparing a silver layer, the silver layer is formed through heating a silver paste.

6. The method for producing the bonding member of claim 1 , wherein
in the processing a surface of the silver layer, the silver surface is ground.

7. A method for producing a bonding structure, comprising:
preparing a bonding member by the method according to claim 1 ;
preparing the first bonding target;
preparing the second bonding target;
forming a stack body including the first bonding target, the bonding member, and the second bonding target stacked such that the bonding member is located between the first bonding target and the second bonding target; and
heating the stack body to bond the first bonding target and the second bonding target to together via the bonding member.

Assignees

• Univ Osaka

Inventors

• Suganuma Katsuaki
• Chen Chuantong
• ISHINA Toshiyuki
• NOH Seungjun
• CHOE Chanyang

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/01938

  in gaseous form, e.g. by CVD or PVD · CPC title

• H10W72/07331

  Connecting techniques · CPC title