Photosensitive assembly, camera module and electronic device

Patent metadata

Field	Value
Publication number	US-12133364-B2
Application number	US-202217954506-A
Country	US
Kind code	B2
Filing date	Sep 28, 2022
Priority date	Mar 1, 2022
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

Provided are a photosensitive assembly, a camera module, and an electronic device. The electronic device includes an electronic device body and a camera module mounted on the electronic device body. The camera module includes a lens and a photosensitive assembly. The photosensitive assembly includes a circuit board, a photosensitive element, a base, and an adhesive. The circuit board is provided with an accommodation cavity that extends through the circuit board. The photosensitive element is accommodated in the accommodation cavity and electrically connected to the circuit board. The base is disposed on the circuit board. The lens is located in the photosensitive path of the photosensitive element. The adhesive includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located in the accommodation cavity. The second adhesive portion is located outside the accommodation cavity.

First claim

What is claimed is:

1. A photosensitive assembly, comprising:
a circuit board provided with an accommodation cavity that extends through the circuit board;
a photosensitive element accommodated in the accommodation cavity and electrically connected to the circuit board;
a base disposed on the circuit board; and
an adhesive comprising a first adhesive portion and a second adhesive portion, wherein the first adhesive portion ( 41 ) and the second adhesive portion ( 42 ) are connected to each other, the first adhesive portion is located in the accommodation cavity, the first adhesive portion ( 41 ) is connected to the photosensitive element and the circuit board, the second adhesive portion is located outside the accommodation cavity, the second adhesive portion is disposed on a surface of the circuit board facing the base, and the base is connected to or not connected to the second adhesive portion.

2. The photosensitive assembly according to claim 1 , wherein a heat sink is disposed on a surface of the photosensitive element facing away from the base, and the heat sink is located outside the accommodation cavity.

3. The photosensitive assembly according to claim 1 , wherein part of the first adhesive portion is sandwiched between an inner peripheral surface of the base and an outer peripheral surface of the photosensitive element, and another part of the first adhesive portion extends to an edge of a top surface of the photosensitive element facing the base.

4. The photosensitive assembly according to claim 1 , further comprising
an optical window formed on the base, wherein a position of the optical window corresponds to a photosensitive region of the photosensitive element; and
a filter accommodated in the optical window.

5. The photosensitive assembly according to claim 4 , wherein the optical window is a stepped hole extending through the base, and the stepped hole comprises a large-diameter hole and a small-diameter hole, wherein one end of the large-diameter hole communicates with a surface of the base facing the photosensitive element, another end of the large-diameter hole communicates with one end of the small-diameter hole, and another end of the small-diameter hole communicates with a surface of the base facing away from the photosensitive element, and wherein the filter is accommodated in the small-diameter hole, and the second adhesive portion is bonded to the filter.

6. The photosensitive assembly according to claim 4 , wherein the optical window is a stepped hole extending through the base, and the stepped hole comprises a large-diameter hole and a small-diameter hole, wherein one end of the large-diameter hole communicates with a surface of the base facing the photosensitive element, another end of the large-diameter hole communicates with one end of the small-diameter hole, another end of the small-diameter hole communicates with a surface of the base facing away from the photosensitive element, and wherein a stop block is disposed on a hole wall of the small-diameter hole, and the filter is disposed on the stop block.

7. A camera module, comprising a lens and a photosensitive assembly, wherein
the photosensitive assembly comprises:
a circuit board provided with an accommodation cavity that extends through the circuit board;
a photosensitive element accommodated in the accommodation cavity and electrically connected to the circuit board;
a base disposed on the circuit board; and
an adhesive comprising a first adhesive portion and a second adhesive portion, wherein the first adhesive portion and the second adhesive portion are connected to each other, the first adhesive portion is located in the accommodation cavity, the first adhesive portion is connected to the photosensitive element and the circuit board, the second adhesive portion is located outside the accommodation cavity, the second adhesive portion is disposed on a surface of the circuit board facing the base, and the base is connected to or not connected to the second adhesive portion; and
the lens is located in a photosensitive path of the photosensitive element.

8. The camera module according to claim 7 , further comprising a lens carrier, wherein the lens carrier is disposed on the base, and the lens is mounted on the lens carrier.

9. The camera module according to claim 7 , further comprising a motor brake electrically connected to the circuit board, wherein the motor brake is disposed on the base, and the lens is mounted on the motor brake.

10. The camera module according to claim 7 , wherein a heat sink is disposed on a surface of the photosensitive element facing away from the base, and the heat sink is located outside the accommodation cavity.

11. The camera module according to claim 7 , wherein part of the first adhesive portion is sandwiched between an inner peripheral surface of the base and an outer peripheral surface of the photosensitive element, and another part of the first adhesive portion extends to an edge of a top surface of the photosensitive element.

12. The camera module according to claim 7 , wherein the photosensitive assembly further comprises a filter and an optical window formed on the base, wherein the optical window corresponds to a photosensitive region of the photosensitive element, and the filter is accommodated in the optical window.

13. The camera module according to claim 12 , wherein the optical window is a stepped hole extending through the base, and the stepped hole comprises a large-diameter hole and a small-diameter hole, wherein one end of the large-diameter hole communicates with a surface of the base facing the photosensitive element, another end of the large-diameter hole communicates with one end of the small-diameter hole, another end of the small-diameter hole communicates with a surface of the base facing away from the photosensitive element, the filter is accommodated in the small-diameter hole, and the second adhesive portion is bonded to the filter.

14. The camera module according to claim 12 , wherein the optical window is a stepped hole extending through the base, and the stepped hole comprises a large-diameter hole and a small-diameter hole, wherein one end of the large-diameter hole communicates with a surface of the base facing the photosensitive element, another end of the large-diameter hole communicates with one end of the small-diameter hole, another end of the small-diameter hole communicates with a surface of the base facing away from the photosensitive element, a stop block is disposed on a hole wall of the small-diameter hole, and the filter is disposed on the stop block.

15. An electronic device, comprising an electronic device body and a camera module, wherein
the photosensitive assembly comprises:
a circuit board provided with an accommodation cavity that extends through the circuit board;
a photosensitive element accommodated in the accommodation cavity and electrically connected to the circuit board;
a base disposed on the circuit board; and
an adhesive comprising a first adhesive portion and a second adhesive portion, wherein the first adhesive portion and the second adhesive portion are connected to each other, the first adhesive portion is located in the accommodation cavity, the first adhesive portion is connected to the photosensitive element and the circuit board, the second adhesive portion is located outside the accommodation cavity, the second adhesive portion is disposed on a surface of the circuit board facing the base, and the base is connected to or not connected to the second adhesive portion; and
the camera module is mounted on the electronic device bod

Assignees

• Guangzhou Luxvisions Innovation Tech Limited

Inventors

• Pang Chao
• Mi Lingyun
• Qin Bin
• Chan Chaoyuan

Classifications

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H05K7/205

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title