Liquid resin composition for sealing and electronic component apparatus

Patent metadata

Field	Value
Publication number	US-12131970-B2
Application number	US-201816618697-A
Country	US
Kind code	B2
Filing date	May 31, 2018
Priority date	May 31, 2017
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

First claim

The invention claimed is:

1. A liquid resin composition for sealing, comprising:
an aliphatic epoxy compound (A),
an epoxy compound (B) having an aromatic ring in a molecule,
a nitrogen-containing heterocyclic compound (C),
a curing agent other than the nitrogen-containing heterocyclic compound (C), and
an inorganic filler (D);
wherein the nitrogen-containing heterocyclic compound (C) is present in an amount within a range of from 2 parts by mass to 12 parts by mass with respect to 100 parts by mass in total of epoxy compounds;
wherein the curing agent other than the nitrogen-containing heterocyclic compound (C) is a liquid acid anhydride, a liquefied phenol, or an aromatic amine, and the curing agent other than the nitrogen-containing heterocyclic compound (C) is present in an amount of less than 0.1 equivalent with respect to 1 equivalent of epoxy compounds in the liquid resin composition; and
wherein the inorganic filler (D) is at least one selected from the group consisting of silicas, calcium carbonate, clay, alumina, silicon nitride, silicon carbide, boron nitride, calcium silicate, potassium titanate, aluminum nitride, beryllia, zirconia, zircon, forsterite, steatite, spinel, mullite, titania, aluminum hydroxide, magnesium hydroxide, zinc borate, and zinc molybdate, and the inorganic filler (D) is present in an amount of at least 77% by mass with respect to a total mass of the composition.

2. The liquid resin composition for sealing according to claim 1 , wherein the aliphatic epoxy compound (A) comprises a compound represented by the following Formula (I):

wherein, in Formula (I), n is an integer from 1 to 15.

3. The liquid resin composition for sealing according to claim 2 , wherein a number-average molecular weight of the compound represented by Formula (I) is from 200 to 10000.

4. The liquid resin composition for sealing according to claim 3 , wherein the epoxy compound (B) having an aromatic ring in a molecule comprises at least one of N,N-diglycidylorthotoluidine or N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline.

5. The liquid resin composition for sealing according to claim 4 , further comprising a coupling agent (E).

6. The liquid resin composition for sealing according to claim 3 , further comprising a coupling agent (E).

7. The liquid resin composition for sealing according to claim 2 , wherein the epoxy compound (B) having an aromatic ring in a molecule comprises at least one of N,N-diglycidylorthotoluidine or N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline.

8. The liquid resin composition for sealing according to claim 7 , further comprising a coupling agent (E).

9. The liquid resin composition for sealing according to claim 2 , further comprising a coupling agent (E).

10. The liquid resin composition for sealing according to claim 1 , wherein a number-average molecular weight of the aliphatic epoxy compound (A) is from 200 to 10000.

11. The liquid resin composition for sealing according to claim 10 , wherein the epoxy compound (B) having an aromatic ring in a molecule comprises at least one of N,N-diglycidylorthotoluidine or N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline.

12. The liquid resin composition for sealing according to claim 11 , further comprising a coupling agent (E).

13. The liquid resin composition for sealing according to claim 10 , further comprising a coupling agent (E).

14. The liquid resin composition for sealing according to claim 1 , wherein the epoxy compound (B) having an aromatic ring in a molecule comprises at least one of N,N-diglycidylorthotoluidine or N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline.

15. The liquid resin composition for sealing according to claim 14 , further comprising a coupling agent (E).

16. The liquid resin composition for sealing according to claim 1 , further comprising a coupling agent (E).

17. The liquid resin composition for sealing according to claim 1 , wherein a percentage content of the aliphatic epoxy compound (A) is from 3% by mass to 40% by mass with respect to the total amount of compounds having an epoxy group, included in the liquid resin composition for sealing.

18. The liquid resin composition for sealing according to claim 17 , wherein the epoxy compound (B) having an aromatic ring in a molecule comprises at least one of N,N-diglycidylorthotoluidine or N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline.

19. The liquid resin composition for sealing according to claim 1 , wherein a percentage content of the aliphatic epoxy compound (A) is from 10% by mass to 30% by mass with respect to the total amount of compounds having an epoxy group, included in the liquid resin composition for sealing.

20. An electronic component apparatus, comprising an element sealed with the liquid resin composition for sealing according to claim 1 .

Assignees

• Hitachi Chemical Co Ltd
• Namics Corp
• Resonac Corp

Inventors

• Inoue Hidetoshi
• Matsuzaki Takayuki
• Takahashi Hisato
• Kamimura Tsuyoshi
• Yoshii Haruyuki

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/473 Primary

  containing a filler · CPC title

• C09K2200/0647

  Polyepoxides · CPC title

• C09K2200/0247

  Silica · CPC title