Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement system

Patent metadata

Field	Value
Publication number	US-12130247-B2
Application number	US-202117926998-A
Country	US
Kind code	B2
Filing date	Dec 23, 2021
Priority date	Dec 23, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A method of measuring physical properties includes: a preparation step of preparing a moisened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.

First claim

The invention claimed is:

1. A method of measuring physical properties, the method comprising:
preparing a moistened member containing an organic material and having a known water absorption rate and a known mass;
heating and then cooling the member; and
measuring a mass of the member while heating and cooling the member, after heating and cooling the member, or any combination thereof; and measuring a deformation rate of the member using a digital image correlation method,
wherein the physical properties include the mass and deformation rate, the mass is used for obtaining a water absorption rate of the member at the time of measuring the mass, and the deformation rate is used for evaluating a relationship with the water absorption rate at the time of measuring the mass.

2. The method of measuring physical properties according to claim 1 , wherein, in heating and cooling the member, the member is heated and cooled within a range of −65° C. to 300° C.

3. The method of measuring physical properties according to claim 1 , wherein the member is a measurement sample obtained from a multilayer wiring board, a laminate, a semiconductor package, a core substrate, a prepreg, a build-up material, or a solder resist.

4. The method of measuring physical properties according to claim 1 , wherein preparing the moistened member includes measuring a mass of the member that has been moistened.

5. The method of measuring physical properties according to claim 1 , wherein:
in measuring the mass of the member, at least a first deformation rate, which is a deformation rate of the member after heating and before cooling, and a second deformation rate, which is a deformation rate of the member after cooling, are measured using the digital image correlation method, and
the method further comprises deriving a thermal expansion coefficient of the member in heating and cooling the member based on the first deformation rate and the second deformation rate.

6. The method of measuring physical properties according to claim 1 , wherein:
a first mass is obtained by measuring a mass of the member during heating and cooling, and a deformation rate of the member corresponding to the first mass is measured using the digital image correlation method, and
the method further comprises deriving a thermal expansion coefficient of the member in heating and cooling the member based on the first mass and the third deformation rate of the member corresponding to the first mass.

7. The method of measuring physical properties according to claim 1 , wherein:
heating and cooling the member and measuring the mass of the member are repeatedly performed, and
a mass of the member and a deformation rate of the member are measured for each combination of heating and cooling the member and measuring the mass of the member when heating and cooling the member and measuring the mass of the member are repeatedly performed.

8. The method of measuring physical properties according to claim 7 , wherein:
at least a first deformation rate, which is a deformation rate of the member after heating and before cooling, and a second deformation rate, which is a deformation rate of the member after cooling, are measured using the digital image correlation method for each combination of heating and cooling the member and measuring the mass of the member, and
the method further comprises deriving a thermal expansion coefficient of the member in each instance of heating and cooling the member based on the first deformation rate and the second deformation rate.

9. The method of measuring physical properties according to claim 7 , wherein:
a first mass is obtained by measuring a mass of the member during heating and cooling, and a deformation rate of the member corresponding to the first mass, is measured using the digital image correlation method for each combination of heating and cooling the member and measuring the mass of the member, and
the method further comprises deriving a thermal expansion coefficient of the member in each instance of heating and cooling the member based on the first mass and the third deformation rate of the member corresponding to the first mass.

10. A method of evaluating a member, comprising:
the method of measuring physical properties according to claim 5 ;
deriving a water absorption rate of the member after heating and cooling corresponding to the second deformation rate; and
evaluating a relationship between the derived water absorption rate, the thermal expansion coefficient, and a thermal expansion coefficient of a comparative member that contains the organic material and that has not been moistened.

11. A method of evaluating a member, comprising:
the method of measuring physical properties according to claim 6 ;
deriving a water absorption rate corresponding to the deformation rate of the member corresponding to the first mass; and
evaluating a relationship between the derived water absorption rate, the thermal expansion coefficient, and a thermal expansion coefficient of a comparative member that contains the organic material and that has not been moistened.

12. A method of manufacturing an electronic component device, the method comprising:
selecting a material that is an organic material or a composite material including the organic material based on the method of evaluating a member according to claim 10 ; and
manufacturing an electronic component device using the selected material.

13. A method of manufacturing a mateiral for an electronic component device, the method comprising:
selecting a material that is an organic material or a composite material including the organic material based on the method of evaluating a member according to claim 10 ; and
manufacturing a material for an electronic component device using the selected material.

14. A physical property measurement system, comprising:
a temperature control chamber including an arrangement portion in which a moistened member containing an organic material and having a known water absorption rate and a known mass is arranged, and a temperature control unit that heats and cools the member arranged in the arrangement portion;
a deformation rate measurement unit that measures a deformation rate of the member arranged in the arrangement portion using a digital image correlation method; and
a mass measurement unit that measures a mass of the member,
wherein the physical property includes the mass and deformation rate, the mass is used for obtaining a water absorption rate of the member at the time of measuring the mass, and the deformation rate is used for evaluating a relationship with the water absorption rate at the time of measuring the mass.

15. The physical property measurement system according to claim 14 , wherein the mass measurement unit is arranged in the temperature control chamber and measures a mass of the member arranged in the arrangement portion.

16. The method of manufacturing a mateiral for an electronic component device, according 10 claim 13 , wherein the mateiral for the electronic componennet a laminate or a prepeg.

17. A method of evaluating a member, comprising:
the method of measuring physical properties according to claim 8 ;
deriving a water absorption rate of the member after heating and cooling corresponding to the second deformation rate; and
evaluating a relationship between the derived water absorption rate, the thermal expansion coefficient, and a thermal expansion coefficient of a comparative member that contains the organic material and that has not been moistened.

Assignees

• Showa Denko Materials Co Ltd
• Resonac Corp

Inventors

• Noma Hirokazu

Classifications

• G01N5/02 Primary

  by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content {(absorption bulbs B01D53/00)} · CPC title

• G01N33/0078

  Testing material properties on manufactured objects · CPC title

• G01N5/045

  for determining moisture content · CPC title

• G01N5/025

  for determining moisture content · CPC title

• G01N25/58

  by measuring changes of properties of the material due to heat, cold or expansion · CPC title