Silicone adhesive composition and use thereof

Patent metadata

Field	Value
Publication number	US-12129407-B2
Application number	US-201917413087-A
Country	US
Kind code	B2
Filing date	Dec 5, 2019
Priority date	Dec 13, 2018
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.

First claim

The invention claimed is:

1. A silicone adhesive composition, comprising:
(A) a straight-chain or branched chain organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups at the ends of the molecular chains and a degree of siloxane polymerization in the range of 5 to 10,000;
(B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain;
(C) an organopolysiloxane resin containing, in a molecule, a siloxane unit as expressed by R 3 SiO 1/2 , where R mutually independently represents a monosaturated organic group and a siloxane unit as expressed by SiO 4/2 ;
(D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the terminals of the molecular chain of the straight-chain or branched-chain siloxane, and having at least three or more aliphatic unsaturated carbon-carbon bond groups in the molecule; and
(E) a hydrosilylation reaction catalyst;
where:
the ratio of the number of moles of silicon-bonded hydrogen atoms in component (B) to the number of moles of aliphatic unsaturated carbon-carbon bond-containing groups in components (A) to (D) is in the range of 0.70 to 1.30, and
the amount of substance of the aliphatic unsaturated carbon-carbon bond-containing groups in component (D) is in the range of 0.001 to 0.030 when compared to 100 g of the total amount of components (A) to (D) in the composition.

2. The silicone adhesive composition according to claim 1 , wherein when the total amount of components (A) to (D) is 100 parts by mass,
the total amount of components (A) and (B) is in the range of 10 to 80 parts by mass,
the amount of component (C) is in the range of 10 to 80 parts by mass, and
the amount of component (D) is in the range of 0.01 to 20 parts by mass.

3. The silicone adhesive composition according to claim 1 , wherein component (D) is component (D1), component (D2), or a mixture thereof, as follows:
(D1) a straight-chain or branched-chain organopolysiloxane having at least three aliphatic unsaturated carbon-carbon bond-containing groups at the side molecular chains and a degree of siloxane polymerization of 5 to 5,000;
(D2) an organopolysiloxane that at least contains, in the molecule thereof, a siloxane unit expressed by (Alk)R′ 2 SiO 1/2 in which Alk represents mutually independent aliphatic unsaturated carbon-carbon bond-containing groups and R′ represents mutually independently aliphatic unsaturated carbon-carbon bond non-containing groups and a siloxane unit represented by SiO 4/2 , wherein the content of a vinyl portion in the aliphatic unsaturated carbon-carbon bond-containing group in the molecule is at least 0.1 mass %.

4. The silicone adhesive composition according to claim 1 , wherein an organic solvent content is 20 mass % or less of the entire composition.

5. The silicone adhesive composition according to claim 1 , wherein a pressure-sensitive adhesive layer having a thickness of 40 μm obtained by curing the composition has an adhesive force, measured at a tensile speed of 300 mm/min using the 180° peel test method according to JIS Z0237 relative to a SUS substrate, in the range of 100 to 2500 gf/inch.

6. A pressure-sensitive adhesive layer comprising a cured product of the silicone adhesive composition according to claim 1 .

7. A laminate body provided with, on a substrate, a pressure-sensitive adhesive layer comprising a cured product of the silicone adhesive composition according to claim 1 .

8. The laminate body according to claim 7 , wherein one or two or more film-like substrates are included, and a release layer for the pressure-sensitive adhesive layer is provided on the film layers.

9. A laminate body, comprising:
a film-like substrate;
a first release layer formed on the film-like substrate;
a pressure-sensitive adhesive layer formed by coating and curing the silicone adhesive composition according to claim 1 on the release layer; and
a second release layer laminated on the pressure-sensitive adhesive layer.

10. An elastic adhesive member comprising a cured product of the silicone adhesive composition according to claim 1 .

11. Electronic equipment or electrical devices that include the elastic adhesive member according to claim 10 .

12. The silicone adhesive composition according to claim 1 , wherein when the total amount of components (A) to (D) is 100 parts by mass, the amount of component (D) is in the range of 0.01 to 20 parts by mass.

Assignees

• Dow Toray Co Ltd
• Dow Silicones Corp

Inventors

• Degroot Jr Jon
• Furukawa Haruhiko
• Iimura Tomohiro
• Jang Eun Sil
• Joffre Eric E

Classifications

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J2301/302

  the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C · CPC title

• C09J7/38 Primary

  Pressure-sensitive adhesives [PSA] · CPC title

• C09J7/29

  Laminated material (metallised plastics C09J7/22) · CPC title

• C09J7/20

  characterised by their carriers · CPC title