Encapsulated printed circuit board and a method of encapsulating a printed circuit board

Patent metadata

Field	Value
Publication number	US-12127362-B2
Application number	US-201715627919-A
Country	US
Kind code	B2
Filing date	Jun 20, 2017
Priority date	Jun 20, 2016
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

The present disclosure is directed to an encapsulated printed circuit board populated with a variety of components and a method of encapsulating a printed circuit board. The printed circuit board is partially encapsulated with a low pressure molded material to form at least a portion of a potting boat. The potting boat is filled with an encapsulating material.

First claim

The invention claimed is:

1. An encapsulated printed circuit board, comprising:
a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
a low pressure molded material applied to at least a portion of the perimeter wall such that a portion of the low pressure molded material extends (1) generally perpendicularly to the top side and (2) generally parallel to the perimeter wall to create a potting wall extending from the top side at the at least a portion of the perimeter wall, the potting wall and the top side forming a volume; and
a potting material filling the volume.

2. The encapsulated printed circuit board of claim 1 , wherein the low pressure molded material encapsulates the bottom side.

3. The encapsulated printed circuit board of claim 1 , wherein the low pressure molded material encapsulates a portion of the top side adjacent to an intersection of the top side and the perimeter wall.

4. The encapsulated printed circuit board of claim 1 , wherein the low pressure molded material is a thermoplastic polyamide.

5. The encapsulated printed circuit board of claim 1 , further comprising at least one lead wire coupled to the printed circuit board and wherein the low pressure molded material encapsulates a portion of the at least one lead wire coupled to the printed circuit board.

6. The encapsulated printed circuit board of claim 3 , wherein the potting wall extends from the top side from the portion of the top side adjacent to the intersection of the top side and the perimeter wall.

7. An encapsulated printed circuit board, comprising:
a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
a low pressure molded material molded about a majority of the bottom side and at least a portion of the perimeter wall such that a potting wall extends generally perpendicularly to the top side and generally parallel to the perimeter wall at the at least a portion of the perimeter wall, the potting wall and the top side forming a volume; and
a potting material filling the volume.

8. The encapsulated printed circuit board of claim 7 , wherein the low pressure molded material is a thermoplastic polyamide.

9. A method of encapsulating a printed circuit board, comprising the steps of:
providing a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
populating the printed circuit board with a plurality of electronic components;
applying a low pressure molded material to at least a portion of the perimeter wall such that a portion of the low pressure molded material extends (1) generally perpendicularly to the top side and (2) generally parallel to the perimeter wall thereby creating a potting wall extending from the top side at the at least a portion of the perimeter wall.

10. The method as recited in claim 9 , wherein creating the potting wall extending from the top side forms a volume defined by the top side and the potting wall and further comprising the step of filling the volume with a potting material.

11. A method of encapsulating a printed circuit board, comprising the steps of:
providing a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
populating the printed circuit board with a plurality of electronic components;
molding a low pressure molded material about a majority of the bottom side and at least a portion of the perimeter wall to form a potting wall that extends generally perpendicularly to the top side and generally parallel to the perimeter wall at the at least a portion of the perimeter wall, the potting wall and the top side defining a volume; and
further comprising the step of filling the volume with an encapsulating material.

Assignees

• Black & Decker Inc

Inventors

• Varipatis Michael
• Osborne Nathan J
• Irungu Alfred M
• Klee Ryan
• Garibaldi Nicholas J
• Lunsford V William T
• Cruise Nathan J

Classifications

• H01M50/186

  characterised by the disposition of the sealing members · CPC title

• H01M50/184

  characterised by their shape or structure · CPC title

• H01M50/204

  Racks, modules or packs for multiple batteries or multiple cells · CPC title

• H01M50/227

  Organic material · CPC title

• H01M50/247

  specially adapted for portable devices, e.g. mobile phones, computers, hand tools or pacemakers · CPC title