Maintaining the shape of a circuit board

Patent metadata

Field	Value
Publication number	US-12127334-B2
Application number	US-201916286427-A
Country	US
Kind code	B2
Filing date	Feb 26, 2019
Priority date	Feb 1, 2019
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.

First claim

What is claimed is:

1. A system comprising:
metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature, the metal balls being configured to support a substrate, the metal balls being part of electrical connections between the substrate and a circuit board; and
a fixture having a size that enables application of force to an entire a surface of the substrate at once while the substrate is subjected to the temperature, the fixture being configured to distribute the force across a flat surface of the fixture in contact with the surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature;
wherein the substrate comprises one or more components on a surface of the substrate; and
wherein the fixture comprises indentations that complement shapes of the one or more components but that do not produce contact between the fixture and the one or more components.

2. The system of claim 1 , wherein the predefined force comprises seven Newtons or greater.

3. The system of claim 1 , wherein the predefined temperature comprises a temperature between 130° Celsius (C) and 250° C.

4. The system of claim 1 , wherein the metal balls comprises copper.

5. The system of claim 4 , wherein the metal balls are pure copper.

6. The system of claim 4 , wherein the metal balls comprise a core that is pure copper.

7. The system of claim 1 , wherein the metal balls comprise lead and tin.

8. The system of claim 7 , wherein the metal balls comprise 90% lead and 10% tin.

9. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board.

10. The system of claim 1 , wherein the substrate comprises an interposer configured to translate a first pitch of contacts to a second pitch of contacts, the second pitch being greater than the first pitch.

11. The system of claim 1 , wherein there are between 3000 metal balls and 10,000 metal balls.

12. The system of claim 1 , wherein there are 20,000 or more metal balls.

13. The system of claim 1 , wherein there are 30,000 or more metal balls.

14. The system of claim 1 , wherein each of the metal balls is on the order of tenths of a millimeter in diameter.

15. The system of claim 1 , wherein each of the metal balls is 0.3 millimeters in diameter or less than 0.3 millimeters in diameter.

16. The system of claim 1 , wherein the substrate is flat in shape.

17. The system of claim 1 , wherein the substrate is flat in shape; and
wherein flatness comprises a maximum deviation of no more than .0508 millimeters ( 2/1000 inches) in a first direction relative to a plane and in a second direction relative to the plane, the first direction being different than the second direction.

18. The system of claim 1 , wherein the substrate is flat in shape; and
wherein flatness comprises a maximum deviation of no more than .0762 millimeters ( 3/1000 inches) in a first direction relative to a plane and in a second direction relative to the plane, the first direction being different than the second direction.

19. The system of claim 1 , wherein the substrate comprises an interposer; and
wherein the substrate is configured to connect electrically to a probe card configured to perform testing on dice on a wafer.

20. The system of claim 19 , wherein the interposer is configured to translate contacts at a first pitch on the probe card to contacts at a second pitch on the circuit board, the second pitch being greater than the first pitch.

21. The system of claim 1 , wherein the metal balls are configured not to collapse at all in response to the force below the predefined force and the temperature below the predefined temperature.

22. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises Sn63Pb37 and the at least some of the metal balls comprise a core comprised of Sn63 and coated with Pb37; and
wherein the predefined temperature is 215° Celsius.

23. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises SAC305 and the at least some of the metal balls comprise a core coated with SAC305; and
wherein the predefined temperature is 240° Celsius.

24. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises Sn63Pb37 and the at least some of the metal balls comprise Sn10Pb90; and
wherein the predefined temperature is 215° Celsius.

25. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises Sn42Bi58 and the at least some of the metal balls comprise SAC305; and
wherein the predefined temperature is 138° Celsius.

26. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises Sn42Bi58 and the at least some of the metal balls comprise Sn63Pb37; and
wherein the predefined temperature is 138° Celsius.

27. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises OM550 and the at least some of the metal balls comprise SAC305; and
wherein the predefined temperature is 200° Celsius.

28. The system of claim 1 , further comprising:
solder between at least some of the metal balls and conductive contacts on the circuit board, the solder being part of the electrical connections between the substrate and a circuit board;
wherein the solder comprises Sn42Bi58 and the at least some of the metal balls comprise SAC305; and
wherein the predefined temperature is 141° Celsius.

Assignees

• Teradyne Inc
• Dis Tech America Llc

Inventors

• Too Heng-Kit
• Tan xue-bin
• Zhang Max
• Tao Rocky
• Brecht Brian
• Weng Iris
• Deng Hale

Classifications

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title