Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Patent metadata

Field	Value
Publication number	US-12127328-B2
Application number	US-202217747810-A
Country	US
Kind code	B2
Filing date	May 18, 2022
Priority date	Nov 18, 2019
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

This application relates to the field of electronic device technologies, and provides an electronic component with an enclosure frame, a circuit board with an electronic component, and an electronic device, to effectively protect the circuit board from being corroded, thereby prolonging a service life of the electronic device. This application is applied to a charging pile for charging a new energy electric vehicle. An electronic component with an enclosure frame includes an enclosure frame and an electronic component. The enclosure frame defines a cavity that is closed or that has one open end; when the electronic component with an enclosure frame is connected to a circuit board, the enclosure frame and the circuit board can define a cavity that is closed or that has one open end.

First claim

What is claimed is:

1. A system, comprising:
an electronic component; and
an enclosure frame;
wherein the electronic component with the enclosure frame are connected to a circuit board and together define a cavity that has one open end;
wherein the electronic component comprises an electronic component body and a pin;
wherein at least a first end of the electronic component body is located inside the enclosure frame;
wherein the electronic component body is fastened to the enclosure frame;
wherein the pin extends out of the electronic component body from the first end of the electronic component body, and extends out of the enclosure frame from a first end of the enclosure frame;
wherein a part of the pin is located in the enclosure frame between an end face of the first end of the electronic component body and an end face of the first end of the enclosure frame;
wherein the enclosure frame comprises a plurality of side walls, the plurality of side walls define a cylindrical structure with two open ends opposite to each other, and a first open end of the cylindrical structure corresponds to the first end of the enclosure frame; and
wherein the electronic component body is fastened to a side wall of the plurality of side walls, the end face of the first end of the electronic component body faces towards an opening in the first open end of the cylindrical structure, and the pin extends out of the electronic component body from the first end of the electronic component body and out of the enclosure frame from the opening in the first open end of the cylindrical structure.

2. The system according to claim 1 , wherein the side a wall of the enclosure frame to which the electronic component body is fastened comprises a heat sink.

3. The system according to claim 2 , wherein the heat sink comprises:
one first heat dissipation plate, wherein the first heat dissipation plate has a first surface and a second surface that deviate from each other, and the electronic component body is fastened to the first surface of the first heat dissipation plate; and
a plurality of second heat dissipation plates, wherein the plurality of second heat dissipation plates are thermally connected to the second surface of the first heat dissipation plate, and the plurality of second heat dissipation plates are stacked and are disposed at intervals.

4. The system according to claim 1 , wherein the entire electronic component body is located inside the enclosure frame.

5. The system according to claim 1 , further comprising:
a plurality of electronic components, wherein the plurality of electronic components comprise the electronic component and at least one second electronic component; and
wherein the plurality of side walls comprise the side wall and a second side wall, wherein the side wall and the second side wall are opposite to each other, and an electronic component body of the at least one second electronic component is fastened to the second side wall.

6. The system according to claim 5 , wherein the electronic component and the at least one second electronic component are disposed in a staggered manner.

7. The system according to claim 1 , wherein the enclosure frame comprises a top wall;
wherein the plurality of side walls are fastened to the top wall and disposed around an edge of the top wall;
wherein ends of the plurality of side walls that are away from the top wall define the opening in the first open end; and
wherein the entire electronic component body is located inside the enclosure frame.

8. The system according to claim 7 , wherein the enclosure frame is filled with a sealant, and the sealant covers the electronic component body and the part of the pin that is located between the end face of the first end of the electronic component body and the end face of the first end of the enclosure frame.

9. The system according to claim 1 , wherein the enclosure frame comprises a top wall;
wherein the plurality of side walls are fastened to the top wall and disposed around an edge of the top wall;
wherein ends of the plurality of side walls away from the top wall define the opening in the first open end;
wherein one end of the enclosure frame in a direction parallel to the top wall defines a second opening;
wherein the ends of the plurality of side walls away from the top wall correspond to the first end of the enclosure frame; and
wherein the entire electronic component body is located inside the enclosure frame.

10. The system according to claim 1 , further comprising:
a plurality of electronic components;
wherein electronic component bodies of the plurality of electronic components are fastened to the side wall of the plurality of side walls, and pins of the plurality of electronic components all extend out of the enclosure frame from the first end of the enclosure frame.

11. The system according to claim 1 , wherein a distance between the end face of the first end of the electronic component body and the end face of the first end of the enclosure frame is in the range of 3 to 10 mm.

12. The system according to claim 1 , wherein the electronic component is a power transistor.

13. A system, comprising:
a circuit board; and
an electronic component with an enclosure frame;
wherein the electronic component with the enclosure frame are connected to the circuit board and together define a cavity that has one open end;
wherein the electronic component comprises an electronic component body and a pin;
wherein at least a first end of the electronic component body is located inside the enclosure frame;
wherein the electronic component body is fastened to the enclosure frame;
wherein the pin extends out of the electronic component body from the first end of the electronic component body, and extends out of the enclosure frame from a first end of the enclosure frame;
wherein a part of the pin is located in the enclosure frame between an end face of the first end of the electronic component body and an end face of the first end of the enclosure frame;
wherein the circuit board comprises:
a first surface and a second surface that deviate from each other,
a via, and
a pad disposed on the second surface of the circuit board, wherein the pad corresponds to the via;

wherein the enclosure frame and the electronic component body of the electronic component are located on the first surface of the circuit board and away from the second surface of the circuit board;
wherein the end face of the first end of the enclosure frame is attached and fastened to the first surface of the circuit board, and the pin of the electronic component is welded to the pad;
wherein the enclosure frame comprises a plurality of side walls, the plurality of side walls define a cylindrical structure with two open ends opposite to each other, and a first open end of the cylindrical structure corresponds to the first end of the enclosure frame; and
wherein the cavity is filled with a sealant, and the sealant covers at least the part of the pin located in the enclosure frame between the end face of the first end of the electronic component body and the end face of the first end of the enclosure frame.

14. The system according to claim 13 , wherein the enclosure frame comprises a top wall:
wherein the plurality of side walls are fastened to the top wall and disposed around an edge of the top wall;
wherein ends of the plurality of side walls away from the top wall define a first opening;
wherein one end of the enclosure frame in a direction parallel to the top wall defines a second opening; and
wherein the ends of the plurality of side walls away

Assignees

• Huawei Digital Power Tech Co Ltd

Inventors

• Liu Yang
• Liu Feng
• Hu Biao
• Liu Yuxiu

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title