Method for producing a component having a cavity

Patent metadata

Field	Value
Publication number	US-12126232-B2
Application number	US-201916961307-A
Country	US
Kind code	B2
Filing date	Jan 9, 2019
Priority date	Jan 12, 2018
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

A method for producing an electrically conductive component having a cavity is described. An efficient production method for such a component, which allows a high variability of the wall thickness of the component, is implemented by applying a load-bearing layer consisting of an electrically conductive material to a soluble substrate and then dissolving and at least partially removing the substrate.

First claim

The invention claimed is:

1. A method for producing an electrically conductive component having a cavity, comprising:
applying a load-carrying, fluid-tight layer made of an electrically conductive material onto a soluble substrate by applying particles to the substrate, wherein said application of said layer is a thickness of more than 3 micrometers, including more than 20 micrometers, in such a way that the substrate is covered by the layer in a fluid-tight manner, and that thereafter the substrate is dissolved and at least partially removed,
further comprising that after the load-carrying, fluid tight layer has been applied, a semi-finished product comprising the substrate and the load-carrying, fluid tight layer is deformed into a coil geometry, and is subsequently pressed, so as to calibrate a coil body for an available installation space, and achieve a planar abutment of one turn to the next of the coil body.

2. The method according to claim 1 , further comprising forming the load-carrying, fluid-tight layer in the layer thickness of less than 20 mm, including less than 5 mm.

3. The method according to claim 1 , further comprising providing the substrate with a strand-shaped design, and applying the layer to the lateral surface(s) of the substrate on all sides, such that the lateral surface(s) of the substrate is or are covered in a fluid-tight manner.

4. The method according to claim 1 , further comprising at least partially making the substrate of an electrically conductive material, including a metal or an electrically conductive plastic material, or of an electrically insulating material filled with conductive particles.

5. The method according to claim 1 , further comprising at least partially making the substrate of an electrically insulating material, including a plastic material, a wax, a ceramic material or a thermoplastic material.

6. The method according to claim 1 , further comprising pre-coating the substrate with an electrically conductive pre-coating substance, including a metal, including a metal in the form of microparticles or nanoparticles or a conductive plastic material or carbon, including carbon in the form of graphite or carbon nanotubes, before the load-carrying layer is applied.

7. The method according to claim 1 , further comprising applying the load-carrying layer to the substrate by way of a galvanic, including an electrochemical or electroless galvanic method, a PVD coating method, or a CVD coating method.

8. The method according to claim 1 , further comprising applying the load-carrying layer to the substrate by way of a plasma spraying process or by immersing the substrate in molten metal.

9. The method according to claim 1 , further comprising applying the load-carrying layer to the substrate so as to surround the substrate in a fluid-tight manner on all sides.

10. The method according to claim 1 , further comprising detaching the substrate from the load-carrying layer by burning out, dissolution in a solvent, mechanical crushing, chemical decomposition, melting, evaporation or sublimation, and is at least partially removed.

11. The method according to claim 1 , further comprising deforming the substrate together with the load-carrying layer after the same has been applied, and including being bent, and thereafter the substrate is at least partially removed.

12. The method according to claim 1 , further comprising creating a helical substrate and extending the helical substrate in the longitudinal direction of the helices before the coating is applied, and thereupon is provided with the coating.

13. The method according to claim 1 , further comprising deforming, or processing by way of forming, a semi-finished product comprising the substrate and the load-carrying, fluid tight layer after the load-carrying, fluid tight layer has been applied to the substrate.

14. The method according to claim 1 , further comprising twisting or transposing multiple electrically conductive components, which are designed as strand-shaped conductors, with one another, together with the substrate, so as to achieve a reduction in the skin effect, including an insulation of the electrically conducting components with respect to one another being carried out prior to or after the twisting.

15. The method for according to claim 1 , further comprising pouring the substrate into a mold coated with a material that adheres to a surface of the substrate and that has such properties so as to enable or facilitate a deposition and/or an adhesion of the load-carrying layer on the substrate.

Assignees

• Fraunhofer Ges Forschung

Inventors

• Specht Uwe
• Heuser Michael
• Burchardt Malte
• Woestmann Franz-Josef

Classifications

• B22F1/054

  Nanosized particles · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• B22F7/08

  with one or more parts not made from powder {(B22F7/062 takes precedence)} · CPC title

• H02K3/14

  with transposed conductors, e.g. twisted conductors · CPC title

• H02K3/22 Primary

  consisting of hollow conductors · CPC title