Floor panel

US12123201B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12123201-B2
Application numberUS-202016796217-A
CountryUS
Kind codeB2
Filing dateFeb 20, 2020
Priority dateMay 10, 2010
Publication dateOct 22, 2024
Grant dateOct 22, 2024

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing floor panels, wherein these floor panels comprise at least a substrate and a top layer provided on said substrate, wherein said top layer comprises a thermoplastic layer having translucent or transparent properties, wherein the method comprises the following successive steps: a first step of providing said substrate, said substrate having first and second opposed flat and undisturbed sides, said first step of providing the substrate comprises extruding a synthetic material board; a second step of providing a second flat side of said top layer, including said thermoplastic layer, on and parallel to the first flat side of the substrate by heating the second flat side of said top layer and the first flat side of the substrate such that the heated second flat side of said top layer and the heated first flat side of the substrate are welded together by being fed through at least one roller; a third step of reheating at least said thermoplastic layer in a heating device and feeding the reheated thermoplastic layer from the heating device into a mechanical press device; and a fourth step of structuring said thermoplastic layer at least by means of said mechanical press device along at least a first flat side of the top layer including the thermoplastic layer, and opposite the second flat side, wherein the mechanical press element in the step of structuring the thermoplastic layer is provided by said mechanical press device, said mechanical press device being a cyclic press device or a continuous press device, and wherein said step of providing a structure comprises providing a decorative relief along a surface of the thermoplastic layer in the top layer; wherein a plurality of boards with the top layer are formed, from which in a subsequent step, by means of a dividing operation, a plurality of floor panels are obtained and are at their edges provided with mechanical coupling means allowing to couple two or more such panels at said edges to one another. 2. The method of claim 1 , wherein at least said thermoplastic layer, substantially consists of a vinyl compound or of a polyurethane compound. 3. The method of claim 1 , wherein the step of reheating said thermoplastic layer, use is made of a radiation source of infrared light. 4. The method of claim 1 , wherein said thermoplastic layer is in a layer-shaped form during said heating. 5. The method of claim 1 , wherein said synthetic material board has an average density above 450 kg per cubic meter. 6. The method of claim 1 , wherein said top layer further comprises a print positioned above said first flat side of the substrate and below said translucent or transparent thermoplastic layer, wherein said print has a motif, said print being in a flat configuration, undisturbed, after the step of structuring the thermoplastic layer. 7. The method of claim 6 , wherein a relative positioning between said motif and said mechanical press element is performed, wherein said decorative relief corresponds to said motif. 8. The method of claim 7 , wherein said decorative relief comprises a plurality of separate impressions imitating wood pores and which together form a decorative relief with the appearance of a wood nerve following a wood nerve depicted in said motif. 9. The method of claim 6 , wherein said print is provided as a printed synthetic material film. 10. The method of claim 1 , further comprising the step of printing a decorative pattern directly on said substrate. 11. The method of claim 1 , wherein said floor panels have a thickness of more than 5 millimeters. 12. The method of claim 11 , wherein said boards are subjected to said step of structuring while being in an endless form, and wherein said dividing operation is performed subsequent to said step of structuring. 13. The method of claim 1 , wherein said floor panels are rigid. 14. The method of claim 9 , wherein the top layer is formed previously to at least the second step, the printed synthetic material film is a thermoplastic film that is welded to said transparent thermoplastic layer of the top layer. 15. The method of claim of claim 1 , wherein said structuring includes forming a plurality of impressions into the top layer, wherein the impressions are formed in the top layer are limited in depth, such that the substrate is free from local deformations. 16. A method for manufacturing floor panels, wherein these floor panels comprise at least a substrate and a top layer provided on said substrate, wherein said top layer comprises a thermoplastic layer having translucent or transparent properties, wherein said floor panels are at their edges provided with mechanical coupling means allowing to couple two or more such panels at said edges to one another; wherein the method comprises the following steps in successive order: a first step of providing said substrate, said substrate having first and second opposed flat and undisturbed sides; a second step of providing a second flat side of said top layer, including said thermoplastic layer, on and parallel to the first flat side of the substrate by heating the second flat side of said top layer and the first flat side of the substrate such that the heated second flat side of said top layer and the heated first flat side of the substrate are welded together by being fed through at least one roller in a heating device, wherein the thermoplastic layer is subsequently fed from the heating device into a mechanical press device; a third step of structuring said thermoplastic layer at least by means of said mechanical press device along at least a first flat side of the top layer including the thermoplastic layer, and opposite the second flat side; wherein a synthetic material board is provided as said substrate, said synthetic material board having an average density above 450 kg per cubic meter, said step of providing said substrate comprises extruding said synthetic material board; wherein said step of structuring comprises providing a decorative relief in the surface of the thermoplastic layer, wherein said top layer further comprises a print positioned above said substrate and below said translucent or transparent thermoplastic layer, wherein said print has a motif; wherein said method includes providing formed boards of a first size with said top layer produced from said first, second and third steps, from which in a subsequent step, by means of a dividing operation, a plurality of floor panels are obtained from the formed boards, each floor panel of said plurality of floor panels being of a smaller size than the first size of the formed boards, and wherein said formed boards are subjected to said step of structuring while being in an endless form, and wherein said dividing operation is performed subsequent to said step of structuring; and wherein the structuring of the third step involves hot embossing said thermoplastic layer, wherein the structuring is performed by said mechanical press device, said mechanical press device being a cyclic press device or a continuous press device. 17. The method of claim 16 , wherein a relative positioning between said motif and said mechanical press element is performed, whereby said decorative relief corresponds to said motif. 18. The method of claim 16 , wherein said decorative relief comprises a plurality of separate impressions imitating wood pores and which together form a decorative relief with the appearance of a wood nerve following a wood nerve depicted in said motif. 19. The method of claim 16

Assignees

Inventors

Classifications

  • of fibrous or chipped materials, e.g. bonded with synthetic resins · CPC title

  • Tiles for floors or walls · CPC title

  • using fillers, pigments, thixotroping agents · CPC title

  • of synthetic resin · CPC title

  • characterised by features of a layer {of} foamed material · CPC title

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Frequently asked questions

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What does patent US12123201B2 cover?
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the s…
Who is the assignee on this patent?
Flooring Ind Ltd Sarl, Unilin Bv
What technology area does this patent fall under?
Primary CPC classification B32B3/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 22 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).