Polystyrene resin composition

Patent metadata

Field	Value
Publication number	US-12122913-B2
Application number	US-201917418433-A
Country	US
Kind code	B2
Filing date	Dec 25, 2019
Priority date	Dec 27, 2018
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

There is provided a polystyrene resin composition including: (A) a polyamide; (B) a polystyrene resin having a syndiotactic structure; (C) a compatibilizer which has a polar group reactive with the polyamide (A), and which is compatible with the polystyrene resin (B); (D) a particular hindered phenol compound; and (E) an inorganic filler, wherein the amount of the polystyrene resin (B) is 10.0 to 30.0% by weight, and the amount of the hindered phenol compound (D) is 0.3 to 1.0% by weight per 100% by weight of the total amount of the components (A) to (E).

First claim

The invention claimed is:

1. A polystyrene resin composition comprising:
(A) a polyamide;
(B) a polystyrene resin having a syndiotactic structure;
(C) a compatibilizer which has a polar group reactive with the polyamide (A), and which is compatible with the polystyrene resin (B);
(D) at least one hindered phenol compound selected from the group consisting of N,N′-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl propionamide)] and 2′,3′-bis[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionyl]hydrazine; and
(E) an inorganic filler,
wherein the compatibilizer (C) is a modified polyphenylene ether polymer,
wherein the amount of the polystyrene resin (B) is 10.0% by weight or more and 30.0% by weight or less, the amount of the compatibilizer (C) is 1.5% by weight or more and 3.5% by weight or less, and the amount of the hindered phenol compound (D) is 0.3% by weight or more and 1.0% by weight or less per 100% by weight of the total amount of the components (A) to (E).

2. The polystyrene resin composition according to claim 1 , wherein when the amount of the polyamide (A) is denoted by x % by weight and the amount of the polystyrene resin (B) is denoted by y % by weight per 100% by weight of the total amount of the components (A) to (E), x is larger than y.

3. The polystyrene resin composition according to claim 1 , wherein the amount of the polyamide (A) is 40.0% by weight or more and 80.0% by weight or less per 100% by weight of the total amount of the components (A) to (E).

4. The polystyrene resin composition according to claim 1 , wherein the amount of the inorganic filler (E) is 25.0% by weight or more and 50.0% by weight or less per 100% by weight of the total amount of the components (A) to (E).

5. The polystyrene resin composition according to claim 1 , wherein the hindered phenol compound (D) is N,N′-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl propionamide)].

6. The polystyrene resin composition according to claim 1 , wherein the inorganic filler (E) is a glass filler.

7. A molded product comprising the polystyrene resin composition according to claim 1 .

8. The polystyrene resin composition according to claim 1 , wherein the polystyrene resin composition is free of a polyolefin.

Assignees

• Idemitsu Kosan Co

Inventors

• Kondo Ryosuke
• Uchida Takaaki

Classifications

• C08L2205/08

  containing additives to improve the compatibility between two polymers · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08K3/40

  Glass · CPC title

• C08K5/13

  Phenols; Phenolates · CPC title

• C08K5/24

  Derivatives of hydrazine · CPC title