Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same

Patent metadata

Field	Value
Publication number	US-12120845-B2
Application number	US-202218147672-A
Country	US
Kind code	B2
Filing date	Dec 28, 2022
Priority date	Dec 28, 2022
Publication date	Oct 15, 2024
Grant date	Oct 15, 2024

Abstract

A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

First claim

What is claimed is:

1. A liquid-cooling heat dissipation plate with unequal height pin-fins, comprising:
a heat dissipation plate body having a first heat dissipation surface and a second heat dissipation surface that face away from each other, wherein the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid;
a plurality of full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body; and
a plurality of non-full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body;
wherein a first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid, N is an integer greater than or equal to two, and the plurality of heat sources correspond in position to the first heat dissipation region to the Nth heat dissipation region, respectively;
wherein a ratio of the plurality of full-height pin-fins to pin-fins in a first fifty percent of heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region is less than a ratio of the plurality of full-height pin-fins to pin-fins in a second fifty percent of the heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region.

2. The liquid-cooling heat dissipation plate according to claim 1 , wherein the plurality of full-height pin-fins, the plurality of non-full-height pin-fins, and the heat dissipation plate body are made of copper, copper alloy, aluminum, or aluminum alloy.

3. The liquid-cooling heat dissipation plate according to claim 1 , wherein cross-sections of the plurality of full-height pin-fins and the plurality of non-full-height pin-fins can respectively be round-shaped, ellipse-shaped, rhombus-shaped, rectangle-shaped, drop-shaped, or wing-shaped.

4. The liquid-cooling heat dissipation plate according to claim 1 , wherein a ratio of the plurality of full-height pin-fins to pin-fins in the first heat dissipation region is at least 35%, and a ratio of the plurality of full-height pin-fins to pin-fins in the Nth heat dissipation region is at least 95%.

5. An enclosed liquid-cooling cooler, comprising the liquid-cooling heat dissipation plate as claimed in claim 1 , and a heat dissipation base, wherein a groove is recessed in the heat dissipation base, the heat dissipation base is combined with the heat dissipation plate body so that a chamber is formed between the groove of the heat dissipation base and the second heat dissipation surface of the heat dissipation plate body, such that the plurality of full-height pin-fins and the plurality of non-full-height pin-fins are located in the chamber.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Huang Yi-Hsin
• Wu Chun-Lung
• Lee Kuo-Wei
• Yeh Tze-Yang

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20263 Primary

  Heat dissipaters releasing heat from coolant · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title