Transversely-excited film bulk acoustic resonator matrix filters with split die sub-filters

Patent metadata

Field	Value
Publication number	US-12119807-B2
Application number	US-202217940925-A
Country	US
Kind code	B2
Filing date	Sep 8, 2022
Priority date	Oct 5, 2020
Publication date	Oct 15, 2024
Grant date	Oct 15, 2024

Abstract

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

First claim

It is claimed:

1. A method of forming a radio frequency filter, comprising:
connecting a first sub-filter and a second sub-filter in parallel between a first port and a second port, wherein connecting each of the first and second sub-filters comprises:
forming a first portion of at least one piezoelectric plate to have a thickness that is different than a thickness of a second portion of the at least one piezoelectric plate;
bonding the at least one piezoelectric plate to a surface of at least one substrate, at least the first and second portions of the at least one piezoelectric plate forming respective diaphragms over respective cavities; and

forming a conductor pattern on only one surface of the piezoelectric plate and not an opposing surface of the piezoelectric plate, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT on the respective diaphragms, wherein the first sub-filter is formed on the first portion of the at least one piezoelectric plate and the second sub-filter is formed on the second portion of the at least one piezoelectric plate.

2. The method of claim 1 , wherein the at least one piezoelectric plate is a single piezoelectric plate for both the first sub-filter and the second sub-filter.

3. The method of claim 1 , wherein the at least one piezoelectric plate comprises a plurality of piezoelectric plates with a first piezoelectric plate of the first sub-filter being a different piezoelectric plate than the piezoelectric plate of the second sub-filter.

4. The method of claim 1 , wherein the at least one substrate is a single substrate for both the first sub-filter and the second sub-filter.

5. The method of claim 1 , wherein:
the first and second portions and first and second IDTs of the plurality of IDTs are configured such that radio frequency signals applied to the first and second IDTs excite primary shear acoustic modes in the first and second portions of the at least one piezoelectric plate forming the respective diaphragms over the respective cavities; and
the thicknesses of the first and second portions are selected to tune the primary shear acoustic modes in the first and second portions.

6. The method of claim 1 , further forming a third sub-filter in parallel between the first port and the second port, with the third sub-filter being formed on a third first portion of the at least one piezoelectric plate that has a thickness different than the thickness of the first portion and the second portion.

7. The method of claim 6 , wherein the thickness of the at least one piezoelectric plate portion of the first sub-filter is a thickness of between 720 nm and 740 nm extending between a front surface and a back surface of the at least one piezoelectric plate of the first sub-filter; wherein the thickness of the at least one piezoelectric plate portion of the second sub-filter is a thickness of between 752 nm and 772 nm extending between front surface and back surface of the at least one piezoelectric plate portion of the second sub-filter; and wherein the thickness of the piezoelectric plate of the third sub-filter is a thickness of between 734 nm and 754 nm extending between front surface and back surface of the at least one piezoelectric plate of the third sub-filter.

8. The method of claim 6 , wherein connecting each of the first, second and third sub-filters further comprises:
connecting three resonators in series between the first port and the second port; and
connecting two coupling capacitors between ground and a respective node between two of the resonators of the sub-filter.

9. The method of claim 8 , further comprising:
connecting a first low-edge resonator, from the plurality of resonators, between the first port and ground;
connecting a second low-edge resonator, from the plurality of resonators, between the second port and ground;
wherein respective resonance frequencies of the first and second low-edge resonators are adjacent to a lower edge of a passband of the filter.

10. The method of claim 9 , wherein:
two of the resonators of each sub-filter are symmetrical in response;
the low-edge resonators have the same response;
each of the coupling capacitors is a metal-insulator-metal capacitor; and
the sub-filters and the low-edge resonators form a matrix filter having a contiguous passband formed by passbands of the sub-filters; and a center frequency of a passband of each sub-filter is different from a center frequency of any other sub-filter.

11. The method of claim 6 , wherein:
the thickness of the at least one piezoelectric plate of the first sub-filter is thinner than the thickness of the at least one piezoelectric plate of the second sub-filter; and
the thickness of the at least one piezoelectric plate of the second sub-filter is thinner than the thickness of the at least one piezoelectric plate of the third sub-filter.

12. A method of forming a radio frequency filter, comprising:
connecting a first sub-filter and a second sub-filter in parallel between a first port and a second port, wherein connecting the first sub-filter comprises:
bonding a first piezoelectric plate to a first substrate first portions of the first piezoelectric plate forming a first plurality of diaphragms over respective first cavities; and
forming a first conductor pattern on the first piezoelectric plate, the first conductor pattern including a first plurality of interdigital transducers (IDTs) of a first respective plurality of resonators, first interleaved fingers of each IDT on a first respective diaphragm of the first plurality of diaphragms,

wherein connecting the second sub-filters comprises:
bonding a second piezoelectric to a second substrate second portions of the second piezoelectric plate forming a second plurality of diaphragms over respective second cavities; and
forming a second conductor pattern on the first piezoelectric plate, the second conductor pattern including a second plurality of interdigital transducers (IDTs) of a second respective plurality of resonators, second interleaved fingers of each IDT on a second respective diaphragm of the second plurality of diaphragms,

wherein a thickness of the first portions of the first piezoelectric plate is thicker than a thickness of the second portions of the second piezoelectric plate, and
wherein the first substrate is different than the second substrate.

13. The method of claim 12 , wherein the first piezoelectric plate is a same piezoelectric plate as the second piezoelectric plate.

14. The method of claim 12 , wherein the first piezoelectric plate is a different piezoelectric plate than the second piezoelectric plate.

15. The method of claim 12 , wherein:
the first and second portions and the first and second IDTs are configured such that radio frequency signals applied to the first and second IDTs excite primary shear acoustic modes in the first and second portions of the first and second piezoelectric plates; and
the thicknesses of the first and second portions are selected to tune the primary shear acoustic modes in the first and second portions.

16. The method of claim 12 , wherein connecting each of the first and second sub-filters further comprises:
connecting three resonators in series between the first port and the second port;
connecting each of two coupling capacitors between ground and a respective node between two of the resonators of the sub-filter;
connecting a first low-edge resonator, from the plurality of resonators, between the first port and ground;
connecting a

Assignees

• Murata Manufacturing Co

Inventors

• Guyette Andrew
• Fenzi Neal
• Dyer Greg
• Mchugh Sean

Classifications

• H03H9/545

  including active elements · CPC title

• H03H9/17

  having a single resonator (crystal tuning forks H03H9/21) · CPC title

• H03H9/13

  for networks consisting of piezoelectric or electrostrictive materials (for networks using surface acoustic waves H03H9/145) · CPC title

• H03H9/568

  consisting of a ladder configuration · CPC title

• H03H9/02157

  Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness · CPC title