Ground detection system for ultrasonic cutting

US12115694B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12115694-B2
Application numberUS-202318342476-A
CountryUS
Kind codeB2
Filing dateJun 27, 2023
Priority dateJan 8, 2020
Publication dateOct 15, 2024
Grant dateOct 15, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of detecting a substrate, comprising: attaching a workpiece clamp to the substrate; cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein: the ultrasonic cutter is electrically coupled to a switch and a controller; the ultrasonic cutter operates at a frequency of 20 kHz to 40 kHz; and the layer of coating is non-conductive; and contacting the substrate with the ultrasonic cutter; wherein: contacting the substrate with the ultrasonic cutter comprises actuating the switch; and actuating the switch comprises instructing the controller to turn off power supplied to the ultrasonic cutter for a duration of a time delay. 2. The method of claim 1 , wherein the ultrasonic cutter is electrically coupled to a timer. 3. The method of claim 2 , wherein: the timer and the controller are disposed in a power source; and the power source is coupled to the ultrasonic cutter. 4. The method of claim 2 , wherein the switch is disposed about a portion of the ultrasonic cutter. 5. The method of claim 2 , wherein: the substrate is conductive. 6. The method of claim 5 , further comprising actuating the timer concurrently with actuating the switch. 7. The method of claim 6 , wherein actuating the timer provides the time delay in a range of 1 second to 10 seconds to an operator of the ultrasonic cutter. 8. The method of claim 2 , wherein the timer works in conjunction with a light source to alert the operator that the ultrasonic cutter is temporarily turned off. 9. The method of claim 2 , wherein the timer works in conjunction with a sound source to alert the operator that the ultrasonic cutter is temporarily turned off. 10. A method of detecting a substrate, comprising: attaching a workpiece clamp to the substrate; cutting a plurality of layers of coatings disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of 20 kHz to 40 kHz; and contacting the substrate with the ultrasonic cutter; wherein: contacting the substrate with the ultrasonic cutter comprises actuating a switch electrically coupled to the ultrasonic cutter; and actuating the switch comprises instructing a controller electrically coupled to the ultrasonic cutter to turn off power supplied to the ultrasonic cutter for a duration of a time delay. 11. The method of claim 10 , wherein the ultrasonic cutter is electrically coupled to a timer. 12. The method of claim 11 , wherein: the timer and the controller are disposed in a power source; and the power source is coupled to the ultrasonic cutter. 13. The method of claim 11 , wherein the switch is disposed about a portion of the ultrasonic cutter. 14. The method of claim 11 , wherein; the substrate is conductive. 15. The method of claim 14 , further comprising actuating the timer concurrently with actuating the switch. 16. The method of claim 15 , wherein actuating the timer provides the time delay in a range of 1 second to 10 seconds to an operator of the ultrasonic cutter. 17. The method of claim 11 , wherein the timer works in conjunction with a light source to alert the operator that the ultrasonic cutter is temporarily turned off. 18. The method of claim 11 , wherein the timer works in conjunction with a sound source to alert the operator that the ultrasonic cutter is temporarily turned off.

Assignees

Inventors

Classifications

  • B26D7/025Primary

    acting upon planar surfaces (B26D7/04 takes precedence) · CPC title

  • Safety devices specially adapted for cutting machines (safety devices in general F16P) · CPC title

  • B26D7/086Primary

    by vibrating, e.g. ultrasonically · CPC title

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Frequently asked questions

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What does patent US12115694B2 cover?
In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of ab…
Who is the assignee on this patent?
Lockheed Corp
What technology area does this patent fall under?
Primary CPC classification B26D7/025. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 15 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).