E-vapor device including heater structure with recessed shell layer

US12114702B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12114702-B2
Application numberUS-202318320659-A
CountryUS
Kind codeB2
Filing dateMay 19, 2023
Priority dateJul 29, 2015
Publication dateOct 15, 2024
Grant dateOct 15, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An e-vapor device may include a pre-vapor sector and a heater structure arranged in thermal contact with the pre-vapor sector. The pre-vapor sector is configured to hold and dispense a pre-vapor formulation. The heater structure includes a base wire and a shell layer coating the base wire. The base wire is insulated from the shell layer. The shell layer includes at least one recessed portion between a first unrecessed portion and a second unrecessed portion. The at least one recessed portion is a thinner section of the shell layer that is configured to vaporize the pre-vapor formulation to generate a vapor. As a result of the heater design, the heater structure is stiffer and more robust than other related heaters in the art, thus allowing more options for its implementation.

First claim

Opening claim text (preview).

The invention claimed is: 1. An e-vapor device, comprising: a pre-vapor sector configured to hold a pre-vapor formulation; and a heater structure in thermal contact with the pre-vapor sector, the heater structure including a base wire and a shell layer coating the base wire, the base wire being insulated from the shell layer, the shell layer including at least one recessed portion between a first unrecessed portion and a second unrecessed portion, the at least one recessed portion configured to vaporize the pre-vapor formulation to generate a vapor. 2. The e-vapor device of claim 1 , wherein the pre-vapor sector includes a reservoir and a dispensing interface. 3. The e-vapor device of claim 2 , wherein the at least one recessed portion of the shell layer is arranged to press against the dispensing interface of the pre-vapor sector. 4. The e-vapor device of claim 1 , wherein the heater structure has a yield strength ranging from 50 to 600 MPa. 5. The e-vapor device of claim 1 , wherein the base wire is an anodized wire. 6. The e-vapor device of claim 5 , wherein the anodized wire is an object wire coated with an anodic layer. 7. The e-vapor device of claim 6 , wherein the object wire is an aluminum wire, a titanium wire, a zinc wire, a magnesium wire, a niobium wire, a zirconium wire, a hafnium wire, or a tantalum wire. 8. The e-vapor device of claim 6 , wherein the anodic layer has a dielectric strength of at least 150 V. 9. The e-vapor device of claim 6 , wherein the anodic layer has a thickness ranging from 500 to 10,000 nm. 10. The e-vapor device of claim 1 , wherein the base wire is a transition metal-based wire coated with vitreous enamel. 11. The e-vapor device of claim 10 , wherein the transition metal-based wire is a nickel wire, a nickel-chromium wire, or a stainless steel wire. 12. The e-vapor device of claim 1 , wherein the first unrecessed portion is separated from the second unrecessed portion by the at least one recessed portion of the shell layer, the at least one recessed portion configured to reach a temperature that is at least double a temperature of the first and second unrecessed portions when a current flows through the shell layer. 13. The e-vapor device of claim 1 , wherein a thickness of the first and second unrecessed portions of the shell layer ranges from 10 to 100 μm. 14. The e-vapor device of claim 13 , wherein a thickness of the at least one recessed portion of the shell layer ranges from 0.01 to 1 μm. 15. The e-vapor device of claim 1 , wherein the at least one recessed portion of the shell layer has a resistivity ranging from 0.02 to 0.2 μΩ·m. 16. The e-vapor device of claim 1 , wherein the shell layer is formed of platinum or gold. 17. The e-vapor device of claim 1 , wherein the at least one recessed portion is in a form of a first recessed portion and a second recessed portion, the first and second recessed portions being between opposite sides of the first and second unrecessed portions, the first and second recessed portions coiling around the base wire.

Assignees

Inventors

Classifications

  • Heating elements having the shape of rods or tubes (H05B3/62, H05B3/68, H05B3/78 take precedence) · CPC title

  • Heating of fluids for non specified applications · CPC title

  • Devices using liquid inhalable precursors · CPC title

  • Constructional details, e.g. connection of cartridges and battery parts · CPC title

  • Inhaling appliances shaped like cigars, cigarettes or pipes · CPC title

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Frequently asked questions

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What does patent US12114702B2 cover?
An e-vapor device may include a pre-vapor sector and a heater structure arranged in thermal contact with the pre-vapor sector. The pre-vapor sector is configured to hold and dispense a pre-vapor formulation. The heater structure includes a base wire and a shell layer coating the base wire. The base wire is insulated from the shell layer. The shell layer includes at least one recessed portion be…
Who is the assignee on this patent?
Altria Client Services Llc
What technology area does this patent fall under?
Primary CPC classification A24F40/46. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Oct 15 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).