Polypropylene-based adhesive and method for producing same

US12110424B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12110424-B2
Application numberUS-201917264619-A
CountryUS
Kind codeB2
Filing dateJul 31, 2019
Priority dateAug 2, 2018
Publication dateOct 8, 2024
Grant dateOct 8, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polypropylene-based adhesive containing a polypropylene-based resin (A′) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).

First claim

Opening claim text (preview).

The invention claimed is: 1. A polypropylene-based adhesive, comprising: a polypropylene-based resin (A′) prepared by reducing a weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which a melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 5 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating the sample at 10° C./min using a differential scanning calorimeter (DSC), wherein the polypropylene-based resin (A′) has a vinylidene group as a terminal unsaturated group contained per molecule of the polypropylene-based resin (A′) of 0.9 or more and 2.0 or less, the polypropylene-based resin (A) has a melting point (Tm-D) of 20° C. or higher and 120° C. or lower, and the polypropylene-based adhesive comprises a radical generator (B) in an amount of 0.01 parts by mass or more and 5 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A). 2. The polypropylene-based adhesive according to claim 1 , wherein the weight-average molecular weight (Mw) of the polypropylene-based resin (A) is 150,000 or less. 3. The polypropylene-based adhesive according to claim 1 , wherein the polypropylene-based resin (A) has a viscosity of 400,000 mPa·s or less, as measured with a B viscosity viscometer. 4. The polypropylene-based adhesive according to claim 1 , wherein the polypropylene-based resin (A) has a molecular weight distribution (Mw/Mn) of 4.0 or less. 5. The polypropylene-based adhesive according to claim 1 , wherein the polypropylene-based resin (A) is a propylene homopolymer. 6. The polypropylene-based adhesive according to claim 1 , further comprising: a tackifier resin (C) in an amount of 0 part by mass or more and 400 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A). 7. The polypropylene-based adhesive according to claim 1 , further comprising: an oil (D) in an amount of 0 part by mass or more and 100 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A). 8. The polypropylene-based adhesive according to claim 1 , further comprising: a wax (E) in an amount of 0 part by mass or more and 50 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A). 9. A laminate, comprising: the polypropylene-based adhesive of claim 1 . 10. A nonwoven fabric, comprising: the polypropylene-based adhesive of claim 1 . 11. A method for producing a polypropylene-based adhesive, the method comprising: reducing a weight-average molecular weight of a polypropylene-based resin (A); and decomposing the polypropylene-based resin (A) in the presence of a radical generator (B), thereby producing a polypropylene-based resin (A′), wherein a melting endotherm (ΔHm-D) of the polypropylene-based resin (A) is 5 Jig or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating the sample at 10° C./min using a differential scanning calorimeter (DSC), the polypropylene-based resin (A) has a melting point (Tm-D) of 20° C. or higher and 120° C. or lower, the polypropylene-based adhesive comprises a radical generator (B) in an amount of 0.01 parts by mass or more and 5 parts by mass or less relative to 100 parts by mass of the polypropylene-based resin (A), and the polpropylene-based resin (A′) has a vinylidene group as a terminal unsaturated group contained per molecule of the polypropylene-based resin (A′) of 0.9 or more and 2.0 or less. 12. The method according to claim 11 , wherein the reducing is carried out by at least one method selected from the group consisting of adding a radical generator (B), heating and irradiating with radiation.

Assignees

Inventors

Classifications

  • Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer · CPC title

  • Waxes · CPC title

  • Peroxides · CPC title

  • Hydrocarbons {(C08K5/0091 takes precedence)} · CPC title

  • the carrier being a laminate constituted by plastic layers only · CPC title

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What does patent US12110424B2 cover?
A polypropylene-based adhesive containing a polypropylene-based resin (A′) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a…
Who is the assignee on this patent?
Idemitsu Kosan Co
What technology area does this patent fall under?
Primary CPC classification C09J123/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 08 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).