Substrate treating apparatus and substrate treating system
US-2022384147-A1 · Dec 1, 2022 · US
US12110194B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12110194-B2 |
| Application number | US-202017632506-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 9, 2020 |
| Priority date | Aug 9, 2019 |
| Publication date | Oct 8, 2024 |
| Grant date | Oct 8, 2024 |
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A robot control device configured to control operation of a robot configured to transfer a substrate while holding the substrate is provided. The substrate becomes in a first state where an end effector holds the substrate and the substrate is not placed at an installation position, when the end effector positions at a first teaching point above the installation position. The substrate becomes in a second state where the end effector does not hold the substrate and the substrate is placed at the installation position, when the end effector positions at a second teaching point below the installation position. The first and second states can be switched by causing the robot to perform a first operation to move the end effector from either one of the first teaching point and the second teaching point to the other one of the first teaching point and the second teaching point.
Opening claim text (preview).
What is claimed is: 1. A robot control device configured to control operation of a robot configured to transfer a substrate while holding the substrate, the robot comprising: a robotic arm having at least one joint axis; and an end effector provided to a tip end of the robotic arm and configured to hold the substrate, wherein the robot is disposed adjacent to an installation position at which the substrate is placed, wherein the substrate becomes in a first state where the end effector holds the substrate and the substrate is not placed at the installation position, when the end effector positions at a first teaching point above the installation position, wherein the substrate becomes in a second state where the end effector does not hold the substrate and the substrate is placed at the installation position, when the end effector positions at a second teaching point below the installation position, wherein the robot control device switches between the first state and the second state by causing the robot to perform a first operation to move the end effector from either one of the first teaching point and the second teaching point to the other one of the first teaching point and the second teaching point, and wherein the robot control device is inhibited to determine whether the end effector passes the installation position, and to stop the end effector during the first operation. 2. The robot control device of claim 1 , wherein the robot control device is inhibited to decelerate the end effector at or near the installation position during the first operation. 3. The robot control device of claim 1 , wherein positional information on the installation position is stored beforehand by teaching, and the robot control device derives at least either one of the first teaching point and the second teaching point based on a distance from the installation position. 4. A robot, comprising: the robot control device of claim 1 ; the robotic arm; and the end effector. 5. The robot of claim 4 , wherein the end effector includes a base-end part connected to a tip end of the robotic arm, and two tip-end parts branching from the base-end part so as to extend to a tip-end side, and wherein the first teaching point and the second teaching point are set such that the installation position passes through between the two tip-end parts when the end effector passes the installation position during the first operation. 6. A robot control method for controlling operation of a robot configured to transfer a substrate while holding the substrate, the robot including: a robotic arm having at least one joint axis; and an end effector provided to a tip end of the robotic arm and configured to hold the substrate, wherein the robot is disposed adjacent to an installation position at which the substrate is placed, wherein the substrate becomes in a first state where the end effector holds the substrate and the substrate is not placed at the installation position, when the end effector positions at a first teaching point above the installation position, and wherein the substrate becomes in a second state where the end effector does not hold the substrate and the substrate is placed at the installation position, when the end effector positions at a second teaching point below the installation position, the method comprising the steps of: positioning the end effector at either one of the first teaching point and the second teaching point; and switching between the first state and the second state by causing the robot to perform a first operation to move the end effector from the one of the first teaching point and the second teaching point to the other one of the first teaching point and the second teaching point, and not determining whether the end effector passes the installation position, and not stopping the end effector during the first operation.
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