Copper-clad laminate, wiring board, and copper foil with resin

Patent metadata

Field	Value
Publication number	US-12109779-B2
Application number	US-202017768170-A
Country	US
Kind code	B2
Filing date	Oct 15, 2020
Priority date	Oct 25, 2019
Publication date	Oct 8, 2024
Grant date	Oct 8, 2024

Abstract

A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less.

In Formula (1), Z represents an arylene group, R 1 to R 3 each independently represent a hydrogen atom or an alkyl group, and R 4 to R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

First claim

The invention claimed is:

1. A copper-clad laminate comprising:
an insulating layer; and
a copper foil existing to be in contact with at least one surface of the insulating layer,
wherein the insulating layer contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer,
a chromium element amount, on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and
a surface roughness of the exposed surface is 1.1 μm or less in terms of ten-point average roughness, and wherein a thickness of the silane coupling agent layer is sufficient to cause a nitrogen element amount, on the exposed surface, measured by X-ray photoelectron spectroscopy to be 1.0 at % to 5.0 at % with respect to a total element amount measured by X-ray photoelectron spectroscopy:

wherein in Formula (1), Z represents an arylene group, R 1 to R 3 each independently represent a hydrogen atom or an alkyl group, and R 4 to R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

2. The copper-clad laminate according to claim 1 , wherein the nitrogen element is derived from a nitrogen atom contained in a compound having an amino group.

3. The copper-clad laminate according to claim 1 , wherein the structural unit represented by Formula (1) includes a structural unit represented by the following Formula (2):

wherein in Formula (2), R 4 to R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and R 10 represents an arylene group having 6 to 12 carbon atoms.

4. The copper-clad laminate according to claim 3 , wherein
the structural unit represented by Formula (2) includes a structural unit represented by the following Formula (3):

wherein in Formula (3), R 4 to R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

5. The copper-clad laminate according to claim 1 , wherein
the polymer includes a polymer further having a structural unit represented by the following Formula (4) in a molecule:

wherein in Formula (4), R 11 to R 13 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and R 14 represents an aryl group.

6. The copper-clad laminate according to claim 5 , wherein the aryl group in the structural unit represented by Formula (4) has an alkyl group having 1 to 6 carbon atoms.

7. The copper-clad laminate according to claim 1 , wherein a weight average molecular weight of the polymer is 1,500 to 40,000.

8. The copper-clad laminate according to claim 1 , wherein an equivalent of a vinyl group contained in the structural unit represented by Formula (1), where R 1 to R 3 are each a hydrogen atom, of the polymer is 250 to 1200 g/mol.

9. The copper-clad laminate according to claim 1 , wherein the resin composition further contains a polyphenylene ether compound.

10. A wiring board comprising:
wiring formed by partially removing the copper foil provided in the copper-clad laminate according to claim 1 ; and
the insulating layer.

11. The wiring board according to claim 10 , comprising a plurality of the insulating layers,
wherein the wiring is disposed between the insulating layers.

12. A copper foil with resin comprising:
a resin layer; and
a copper foil existing to be in contact with at least one surface of the resin layer, the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer,
wherein the resin layer contains a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule or a semi-cured product of the resin composition,
a chromium element amount, on an exposed surface on which the cured resin layer is exposed by an etching treatment of the copper foil existing to be in contact with a surface of the cured resin layer with a copper chloride solution when the resin layer provided in the copper foil with resin is cured, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and
a surface roughness of the exposed surface is 1 . 1 um or less in terms of ten-point average roughness , and
wherein a thickness of the silane coupling agent layer is sufficient to cause a nitrogen element amount, on the exposed surface, measured by X-ray photoelectron spectroscopy to be 1.0 at % to 5.0 at % with respect to a total element amount measured by X-ray photoelectron spectroscopy:

wherein in Formula (1), Z represents an arylene group, R 1 to R 3 each independently represent a hydrogen atom or an alkyl group, and R 4 to R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Inoue Yuki
• Arisawa Tatsuya
• Kitai Yuki

Classifications

• B32B15/082

  comprising vinyl resins; comprising acrylic resins · CPC title

• C08F257/00

  Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title

• C08F290/12

  Polymers provided for in subclasses C08C or C08F · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title