Layer forming apparatus, method of forming powder layer, and recording medium

US12109614B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12109614-B2
Application numberUS-202217735649-A
CountryUS
Kind codeB2
Filing dateMay 3, 2022
Priority dateJun 3, 2021
Publication dateOct 8, 2024
Grant dateOct 8, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A layer forming apparatus includes a loading unit including a stage onto which powder is supplied, a rotator that flattens the powder on the stage to form a powder layer, and circuitry. The circuitry causes the rotator to move in a first direction parallel to a surface of the stage and rotate while contacting the powder on the stage to form the powder layer. Further, the circuitry causes the rotator to move in a second direction opposite to the first direction and rotate while contacting surplus powder not on the stage.

First claim

Opening claim text (preview).

The invention claimed is: 1. A layer forming apparatus comprising: a loading unit including a supply stage onto which powder is supplied, and a fabrication stage; a rotator configured to flatten the powder on the fabrication stage to form a powder layer; and circuitry programmed to control the rotator to: move in a first moving direction parallel to a surface of the fabrication stage and rotate while contacting the powder on the fabrication stage to form the powder layer; and move in a second moving direction opposite to the first direction and rotate while contacting surplus powder on a frame of the fabrication stage or a frame of the supply stage, the rotation of the rotator being in a first rotation direction based on overlapping the frame of the fabrication stage on a first side of the fabrication stage and a second rotation direction based on overlapping the frame of the fabrication stage on a second side of the fabrication stage, the second side of the fabrication stage being opposite to the first side of the fabrication stage in the second moving direction, wherein the circuitry is further programmed to cause the loading unit to lower the powder layer on the fabrication stage below a height of the frame after the rotator forms the powder layer and before the rotator moves in the second direction. 2. The layer forming apparatus according to claim 1 , wherein the first and second rotation directions cause surplus powder on the frame of the loading unit in contact with the rotator to move in a direction away from the powder layer. 3. The layer forming apparatus according to claim 1 , further comprising a supply unit configured to store the powder, wherein the rotator is configured to supply the powder stored in the supply stage to the fabrication stage, and wherein the circuitry is programmed to cause the rotator to move above the supply stage in the second direction and rotate. 4. The layer forming apparatus according to claim 3 , wherein the circuitry is programmed to cause the rotator to rotate in one of the first and second rotation directions so as to move surplus powder on a frame of the loading unit adjacent the supply unit into the supply unit. 5. The layer forming apparatus according to claim 1 , further comprising a receiving unit configured to receive surplus powder spilled from the loading unit, wherein the circuitry is programmed to cause the rotator to move above the receiving unit in the second direction and rotate. 6. The layer forming apparatus according to claim 5 , wherein the circuitry is programmed to cause the rotator to rotate in one of the first and second rotation directions so as to move the surplus powder on a frame of the loading unit adjacent to the receiving unit into the receiving unit. 7. The layer forming apparatus according to claim 1 , wherein the circuitry is programmed to cause the rotator to move in the second direction and rotate at a rotation speed equal to or higher than the rotation speed at forming the powder layer. 8. A method of forming a powder layer comprising: supplying powder onto a supply stage of a loading unit; causing a rotator to move in a first moving direction parallel to a surface of the supply stage and rotate while contacting the powder on the supply stage to move the powder to a fabrication stage and flatten the powder to form a powder layer; and causing the rotator to move in a second moving direction opposite to the first direction and rotate while contacting surplus powder on a frame of the fabrication stage or a frame of the supply stage, the rotation of the rotator being in a first rotation direction based on overlapping the frame of the fabrication stage on a first side of the fabrication stage and a second rotation direction based on overlapping the frame of the fabrication stage on a second side of the fabrication stage, the second side of the fabrication stage being opposite to the first side of the fabrication stage in the second moving direction, wherein the loading unit lowers the powder layer on the fabrication stage below a height of the frame after the rotator forms the powder layer and before the rotator moves in the second direction. 9. A non-transitory recording medium storing program codes which, when executed by one or more processors, cause the one or more processors to perform a method, the method comprising: supplying powder onto a supply stage of a loading unit; causing a rotator to move in a first moving direction parallel to a surface of the supply stage and rotate while contacting the powder on the supply stage to move the powder to a fabrication stage and flatten the powder to form a powder layer; and causing the rotator to move in a second moving direction opposite to the first direction and rotate while contacting surplus powder on a frame of the fabrication stage or a frame of the supply stage, the rotation of the rotator being in a first rotation direction based on overlapping the frame of the fabrication stage on a first side of the fabrication stage and a second rotation direction based on overlapping the frame of the fabrication stage on a second side of the fabrication stage, the second side of the fabrication stage being opposite to the first side of the fabrication stage in the second moving direction, causing the loading unit to lower the powder layer on the fabrication stage below a height of the frame after the rotator forms the powder layer and before the rotator moves in the second direction.

Assignees

Inventors

Classifications

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • Means for feeding of material, e.g. heads · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Processes of additive manufacturing · CPC title

  • Process efficiency · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12109614B2 cover?
A layer forming apparatus includes a loading unit including a stage onto which powder is supplied, a rotator that flattens the powder on the stage to form a powder layer, and circuitry. The circuitry causes the rotator to move in a first direction parallel to a surface of the stage and rotate while contacting the powder on the stage to form the powder layer. Further, the circuitry causes the ro…
Who is the assignee on this patent?
Kai Tomoki, Aman Yasutomo, Yamashita Yasuyuki, and 1 more
What technology area does this patent fall under?
Primary CPC classification B22F12/226. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 08 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).