Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation

Patent metadata

Field	Value
Publication number	US-12108574-B2
Application number	US-202217981466-A
Country	US
Kind code	B2
Filing date	Nov 6, 2022
Priority date	Nov 6, 2022
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

A two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the plurality of fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees. A center line average roughness (Ra) of the side surface is less than 3 μm, and a ten-point average roughness (Rz) of the side surface is not less than 12 μm.

First claim

What is claimed is:

1. A two-phase immersion-type heat dissipation structure, comprising:
a heat dissipation substrate having a fin surface and a non-fin surface that face away from each other, wherein the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant; and
a plurality of fins, wherein the fin surface is connected with the plurality of fins;
wherein more than half of the plurality of fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees, and wherein a center line average roughness (Ra) of the side surface is less than 3 μm, a ten-point average roughness (Rz) of the side surface is not less than 12 μm, such that the side surface is a smooth surface and has a plurality of deep holes formed thereon, so as to promote bubble generation and detachment of bubbles.

2. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the Rz of the side surface is greater than six times the Ra of the side surface.

3. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the functional fins are pin-fins or plate-fins.

4. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the functional fins are made of copper, copper alloy, or aluminum alloy.

5. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the side surface is formed by grinding or shot-peening.

6. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the side surface is formed by chemical etching.

7. The two-phase immersion-type heat dissipation structure according to claim 1 , wherein the side surface is formed by deposition.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Wu Chun-Te
• Yang Ching-Ming
• Chiu Yu-Wei
• Yeh Tze-Yang

Classifications

• H05K7/203 Primary

  by immersion · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title