Camera module and optical device comprising same

Patent metadata

Field	Value
Publication number	US-12108137-B2
Application number	US-202318203483-A
Country	US
Kind code	B2
Filing date	May 30, 2023
Priority date	Mar 20, 2018
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

A camera includes a lens barrel, a holder, a filter disposed in the holder, a circuit board having an aperture, a reinforcing member including a first region corresponding to the aperture and a second region in which the circuit board is disposed, and an image sensor disposed in the first region of the reinforcing member. The first region of the reinforcing member includes a protruding part protruding farther than the second region of the reinforcing member. The image sensor is disposed on the upper surface of the protruding part.

First claim

What is claimed is:

1. A camera module, comprising:
a stiffener comprising a cavity recessed from an upper surface thereof;
a printed circuit board disposed on the stiffener and comprising a through hole corresponding to the cavity of the stiffener;
an image sensor disposed on a bottom surface of the cavity of the stiffener; and
a lens barrel disposed above the image sensor,
wherein a lower surface of the image sensor is positioned lower than the upper surface of the stiffener,
wherein an upper surface of the image sensor is positioned higher than the upper surface of the stiffener, and
wherein a depth from the upper surface of the stiffener to the bottom surface of the cavity is less than or equal to a thickness of the image sensor.

2. The camera module according to claim 1 , wherein the image sensor is attached to the bottom surface of the cavity by an adhesive member.

3. The camera module according to claim 1 , wherein the thickness of the image sensor is greater than a thickness of the printed circuit board.

4. The camera module according to claim 1 , wherein an uneven portion is formed in the bottom surface of the cavity.

5. The camera module according to claim 4 , wherein the uneven portion comprises convex portions and concave portions.

6. The camera module according to claim 5 , wherein the convex portions have a plurality of lines, a stripe shape, a net shape, a plurality of dots, or a plurality of islands.

7. The camera module according to claim 1 , wherein protrusion portions are formed in the bottom surface of the cavity.

8. The camera module according to claim 1 , comprising a wire connecting the image sensor and the printed circuit board.

9. The camera module according to claim 1 , comprising an adhesive member disposed between the stiffener and the printed circuit board.

10. The camera module according to claim 1 , comprising:
a holder disposed on the printed circuit board; and
a filter disposed on the holder and opposite to the image sensor.

11. The camera module according to claim 1 , wherein the image sensor is disposed within the through hole of the printed circuit board, when viewed from a top.

12. The camera module according to claim 1 , wherein the stiffener is formed of a metal material.

13. The camera module according to claim 1 , wherein the stiffener is formed of glass epoxy, plastic, or synthetic resin.

14. The camera module according to claim 1 , wherein the upper surface of the image sensor is positioned lower than an upper surface of the printed circuit board.

15. The camera module according to claim 1 , wherein the image sensor is spaced apart from a side surface of the cavity.

16. A camera module, comprising:
a stiffener comprising a cavity recessed from an upper surface thereof;
a printed circuit board disposed on the upper surface of the stiffener and comprising a through hole corresponding to the cavity;
an image sensor disposed on a bottom surface of the cavity of the stiffener;
a lens barrel disposed above the image sensor; and
an adhesive member attaching the bottom surface of the cavity and the image sensor,
wherein the image sensor is disposed within the through hole of the printed circuit board, when viewed from a top,
wherein a lower surface of the image sensor is positioned lower than the upper surface of the stiffener,
wherein an upper surface of the image sensor is positioned higher than the upper surface of the stiffener, and
wherein the upper surface of the image sensor is positioned lower than an upper surface of the printed circuit board.

17. The camera module according to claim 16 , wherein a depth from the upper surface of the stiffener to the bottom surface of the cavity is less than or equal to a thickness of the image sensor.

18. The camera module according to claim 16 , wherein a thickness of the image sensor is greater than a thickness of the printed circuit board.

19. The camera module according to claim 16 , wherein an uneven portion comprising convex portions and concave portions is formed in the bottom surface of the cavity.

20. A phone comprising the camera module according to claim 1 .

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Min Soo
• Kim In Hoe
• Oh Hyun Ah
• Lee Sung Il
• Chung jong ho

Classifications

• G03B17/12

  with means for supporting objectives, supplementary lenses, filters, masks, or turrets · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/687

  by shifting the lens or sensor position · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• G03B2205/0007

  Movement of one or more optical elements for control of motion blur · CPC title